IC 8-CHANNEL, SGL ENDED MULTIPLEXER, CDIP16, CERDIP-16, Multiplexer or Switch
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | ADI(亚德诺半导体) |
| 零件包装代码 | DIP |
| 包装说明 | CERDIP-16 |
| 针数 | 16 |
| Reach Compliance Code | compliant |
| 模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER |
| JESD-30 代码 | R-GDIP-T16 |
| JESD-609代码 | e0 |
| 长度 | 19.05 mm |
| 标称负供电电压 (Vsup) | -15 V |
| 信道数量 | 8 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 标称断态隔离度 | 60 dB |
| 通态电阻匹配规范 | 22.5 Ω |
| 最大通态电阻 (Ron) | 500 Ω |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度(摄氏度) | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 标称供电电压 (Vsup) | 15 V |
| 表面贴装 | NO |
| 最长断开时间 | 2100 ns |
| 最长接通时间 | 1300 ns |
| 技术 | BIPOLAR |
| 温度等级 | MILITARY |
| 端子面层 | TIN LEAD |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| MUX-08BQ | MUX-08AQ | MUX-08EP | MUX-08FP | MUX-08FS | MUX-24FS | MUX-24AQ | MUX-24FP | |
|---|---|---|---|---|---|---|---|---|
| 描述 | IC 8-CHANNEL, SGL ENDED MULTIPLEXER, CDIP16, CERDIP-16, Multiplexer or Switch | IC 8-CHANNEL, SGL ENDED MULTIPLEXER, CDIP16, CERDIP-16, Multiplexer or Switch | IC 8-CHANNEL, SGL ENDED MULTIPLEXER, PDIP16, PLASTIC, DIP-16, Multiplexer or Switch | IC 8-CHANNEL, SGL ENDED MULTIPLEXER, PDIP16, PLASTIC, DIP-16, Multiplexer or Switch | IC 8-CHANNEL, SGL ENDED MULTIPLEXER, PDSO16, SO-16, Multiplexer or Switch | IC 4-CHANNEL, DIFFERENTIAL MULTIPLEXER, PDSO16, SO-16, Multiplexer or Switch | IC 4-CHANNEL, DIFFERENTIAL MULTIPLEXER, CDIP16, CERDIP-16, Multiplexer or Switch | IC 4-CHANNEL, DIFFERENTIAL MULTIPLEXER, PDIP16, PLASTIC, DIP-16, Multiplexer or Switch |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
| 零件包装代码 | DIP | DIP | DIP | DIP | SOIC | SOIC | DIP | DIP |
| 包装说明 | CERDIP-16 | DIP, | DIP, | PLASTIC, DIP-16 | SO-16 | SO-16 | CERDIP-16 | DIP, |
| 针数 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| 模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | DIFFERENTIAL MULTIPLEXER |
| JESD-30 代码 | R-GDIP-T16 | R-GDIP-T16 | R-PDIP-T16 | R-PDIP-T16 | R-PDSO-G16 | R-PDSO-G16 | R-GDIP-T16 | R-PDIP-T16 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
| 信道数量 | 8 | 8 | 8 | 8 | 8 | 4 | 4 | 4 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 标称断态隔离度 | 60 dB | 60 dB | 60 dB | 60 dB | 60 dB | 66 dB | 66 dB | 66 dB |
| 通态电阻匹配规范 | 22.5 Ω | 6 Ω | 6 Ω | 22.5 Ω | 22.5 Ω | 22.5 Ω | 6 Ω | 22.5 Ω |
| 最大通态电阻 (Ron) | 500 Ω | 400 Ω | 400 Ω | 500 Ω | 500 Ω | 500 Ω | 400 Ω | 500 Ω |
| 最高工作温度 | 125 °C | 125 °C | 70 °C | 85 °C | 85 °C | 85 °C | 125 °C | 85 °C |
| 最低工作温度 | -55 °C | -55 °C | - | -40 °C | -40 °C | -40 °C | -55 °C | -40 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | DIP | DIP | SOP | SOP | DIP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE |
| 峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
| 表面贴装 | NO | NO | NO | NO | YES | YES | NO | NO |
| 最长断开时间 | 2100 ns | 2100 ns | 2100 ns | 2100 ns | 2100 ns | 2100 ns | 2100 ns | 2100 ns |
| 最长接通时间 | 1300 ns | 1300 ns | 1300 ns | 1300 ns | 1300 ns | 1300 ns | 1300 ns | 1300 ns |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 温度等级 | MILITARY | MILITARY | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | MILITARY | INDUSTRIAL |
| 端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 长度 | 19.05 mm | 19.05 mm | - | - | 9.9 mm | 9.9 mm | 19.05 mm | - |
| 座面最大高度 | 5.08 mm | 5.08 mm | - | - | 1.75 mm | 1.75 mm | 5.08 mm | - |
| 端子节距 | 2.54 mm | 2.54 mm | - | - | 1.27 mm | 1.27 mm | 2.54 mm | - |
| 宽度 | 7.62 mm | 7.62 mm | - | - | 3.9 mm | 3.9 mm | 7.62 mm | - |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved