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89H12T3BG2ZABC

产品描述PCI Bus Controller, PBGA324, 19 X 19 MM, 1 MM PITCH, BGA-324
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小437KB,共30页
制造商IDT (Integrated Device Technology)
下载文档 详细参数 选型对比 全文预览

89H12T3BG2ZABC概述

PCI Bus Controller, PBGA324, 19 X 19 MM, 1 MM PITCH, BGA-324

89H12T3BG2ZABC规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
零件包装代码BGA
包装说明19 X 19 MM, 1 MM PITCH, BGA-324
针数324
Reach Compliance Code_compli
ECCN代码3A001.A.3
其他特性IT ALSO NEED 3.3V I/O NOMINAL SUPPLY
地址总线宽度
最大时钟频率125 MHz
驱动器接口标准IEEE 1149.1AC; IEEE 1149.1
外部数据总线宽度
JESD-30 代码S-PBGA-B324
JESD-609代码e0
长度19 mm
湿度敏感等级3
端子数量324
最高工作温度70 °C
最低工作温度
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装等效代码BGA324,18X18,40
封装形状SQUARE
封装形式GRID ARRAY
峰值回流温度(摄氏度)225
电源1,2.5,3.3 V
认证状态Not Qualified
座面最大高度1.72 mm
最大压摆率781 mA
最大供电电压1.1 V
最小供电电压0.9 V
标称供电电压1 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn63Pb37)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间20
宽度19 mm
uPs/uCs/外围集成电路类型BUS CONTROLLER, PCI
Base Number Matches1

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12-Lane 3-Port
Gen2 PCI Express® Switch
®
89HPES12T3BG2
Data Sheet
Device Overview
The 89HPES12T3BG2 is a member of IDT’s PRECISE™ family of
PCI Express® switching solutions. The PES12T3BG2 is a 12-lane, 3-
port Gen2 peripheral chip that performs PCI Express Base switching
with a feature set optimized for high performance applications such as
servers, storage, and communications/networking. It provides connec-
tivity and switching functions between a PCI Express upstream port and
two downstream ports and supports switching between downstream
ports.
Features
Block Diagram
3-Port Switch Core / 12 PCI Express Lanes
Frame Buffer
Route Table
Port
Arbitration
Scheduler
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
SerDes
SerDes
SerDes
(Port 0)
(Port 2)
Figure 1 Internal Block Diagram
(Port 4)
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 30
©
2009 Integrated Device Technology, Inc
*Notice: The information in this document is subject to change without notice
July 1, 2009
Advance Information
High Performance PCI Express Switch
– Twelve 5 Gbps Gen2 PCI Express lanes
– Three switch ports
• One x4 upstream port
• Two x4 downstream ports
– Low latency cut-through switch architecture
– Support for Max Payload Size up to 2048 bytes
– One virtual channel
– Eight traffic classes
– PCI Express Base Specification Revision 2.0 compliant
Flexible Architecture with Numerous Configuration Options
– Automatic per port link width negotiation to x4, x2 or x1
– Automatic lane reversal on all ports
– Automatic polarity inversion
– Ability to load device configuration from serial EEPROM
On-Die Temperature Sensor
– Range of 0 to 127.5 degrees Celsius
– Three programmable temperature thresholds with over and
under temperature threshold alarms
– Automatic recording of maximum high or minimum low
temperature
Legacy Support
– PCI compatible INTx emulation
– Bus locking
Highly Integrated Solution
– Incorporates on-chip internal memory for packet buffering and
queueing
– Integrates twelve 5 Gbps embedded SerDes with 8b/10b
encoder/decoder (no separate transceivers needed)
• Receive equalization (RxEQ)

89H12T3BG2ZABC相似产品对比

89H12T3BG2ZABC 89H12T3BG2ZABCG 89H12T3BG2ZABCG8 89H12T3BG2ZABC8
描述 PCI Bus Controller, PBGA324, 19 X 19 MM, 1 MM PITCH, BGA-324 PCI Bus Controller, PBGA324, 19 X 19 MM, 1 MM PITCH, GREEN, BGA-324 Bus Controller, PBGA324 Bus Controller, PBGA324
是否Rohs认证 不符合 符合 符合 不符合
Reach Compliance Code _compli compli compliant not_compliant
JESD-30 代码 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324
JESD-609代码 e0 e1 e1 e0
湿度敏感等级 3 3 3 3
端子数量 324 324 324 324
最高工作温度 70 °C 70 °C 70 °C 70 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA BGA BGA BGA
封装等效代码 BGA324,18X18,40 BGA324,18X18,40 BGA324,18X18,40 BGA324,18X18,40
封装形状 SQUARE SQUARE SQUARE SQUARE
封装形式 GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
电源 1,2.5,3.3 V 1,2.5,3.3 V 1,2.5,3.3 V 1,2.5,3.3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified
最大压摆率 781 mA 781 mA 781 mA 781 mA
表面贴装 YES YES YES YES
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子面层 Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn63Pb37)
端子形式 BALL BALL BALL BALL
端子节距 1 mm 1 mm 1 mm 1 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM
Base Number Matches 1 1 1 1

 
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