Half Bridge Based Peripheral Driver
参数名称 | 属性值 |
厂商名称 | SEMIKRON |
包装说明 | , |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
内置保护 | TRANSIENT |
接口集成电路类型 | HALF BRIDGE BASED PERIPHERAL DRIVER |
JESD-30 代码 | R-XXMA-X |
功能数量 | 2 |
输出电流流向 | SOURCE AND SINK |
封装主体材料 | UNSPECIFIED |
封装形状 | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY |
认证状态 | Not Qualified |
表面贴装 | NO |
端子形式 | UNSPECIFIED |
端子位置 | UNSPECIFIED |
SKIIP1013GB122-2DUW | SKIIP1013GB122-2DUL | SKIIP1013GB122-2DW | |
---|---|---|---|
描述 | Half Bridge Based Peripheral Driver | Half Bridge Based Peripheral Driver | Half Bridge Based Peripheral Driver |
厂商名称 | SEMIKRON | SEMIKRON | SEMIKRON |
Reach Compliance Code | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 |
内置保护 | TRANSIENT | TRANSIENT | TRANSIENT |
接口集成电路类型 | HALF BRIDGE BASED PERIPHERAL DRIVER | HALF BRIDGE BASED PERIPHERAL DRIVER | HALF BRIDGE BASED PERIPHERAL DRIVER |
JESD-30 代码 | R-XXMA-X | R-XXMA-X | R-XXMA-X |
功能数量 | 2 | 2 | 2 |
输出电流流向 | SOURCE AND SINK | SOURCE AND SINK | SOURCE AND SINK |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
认证状态 | Not Qualified | Not Qualified | Not Qualified |
表面贴装 | NO | NO | NO |
端子形式 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
端子位置 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
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