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GS842Z18AGB-166IT

产品描述ZBT SRAM, 256KX18, 8.5ns, CMOS, PBGA119, ROHS COMPLIANT, FPBGA-119
产品类别存储    存储   
文件大小632KB,共29页
制造商GSI Technology
官网地址http://www.gsitechnology.com/
标准  
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GS842Z18AGB-166IT概述

ZBT SRAM, 256KX18, 8.5ns, CMOS, PBGA119, ROHS COMPLIANT, FPBGA-119

GS842Z18AGB-166IT规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称GSI Technology
零件包装代码BGA
包装说明BGA,
针数119
Reach Compliance Codecompliant
ECCN代码3A991.B.2.B
最长访问时间8.5 ns
其他特性FLOW-THROUGH OR PIPELINED ARCHITECTURE
JESD-30 代码R-PBGA-B119
JESD-609代码e1
长度22 mm
内存密度4718592 bit
内存集成电路类型ZBT SRAM
内存宽度18
湿度敏感等级3
功能数量1
端子数量119
字数262144 words
字数代码256000
工作模式SYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织256KX18
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装形状RECTANGULAR
封装形式GRID ARRAY
并行/串行PARALLEL
峰值回流温度(摄氏度)260
认证状态Not Qualified
座面最大高度1.99 mm
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)3 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层TIN SILVER COPPER
端子形式BALL
端子节距1.27 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度14 mm

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GS842Z18/36AB-180/166/150/100
119-Bump BGA
Commercial Temp
Industrial Temp
Features
• 256K x 18 and 128K x 36 configurations
• User configurable Pipeline and Flow Through mode
• NBT (No Bus Turn Around) functionality allows zero wait
read-write-read bus utilization
• Fully pin compatible with both pipelined and flow through
NtRAM™, NoBL™ and ZBT™ SRAMs
• Pin-compatible with 2M, 8M, and 16M devices
• 3.3 V +10%/–10% core power supply
• 2.5 V or 3.3 V I/O supply
• LBO pin for Linear or Interleave Burst mode
• Byte write operation (9-bit Bytes)
• 3 chip enable signals for easy depth expansion
• Clock Control, registered address, data, and control
• ZZ Pin for automatic power-down
• JEDEC-standard 119-bump BGA package
• RoHS-compliant package available
4Mb Pipelined and Flow Through
Synchronous NBT SRAMs
180 MHz–100 MHz
3.3 V V
DD
2.5 V and 3.3 V V
DDQ
Because it is a synchronous device, address, data inputs, and
read/ write control inputs are captured on the rising edge of the
input clock. Burst order control (LBO) must be tied to a power
rail for proper operation. Asynchronous inputs include the
sleep mode enable (ZZ) and Output Enable. Output Enable can
be used to override the synchronous control of the output
drivers and turn the RAM's output drivers off at any time.
Write cycles are internally self-timed and initiated by the rising
edge of the clock input. This feature eliminates complex off-
chip write pulse generation required by asynchronous SRAMs
and simplifies input signal timing.
The GS842Z18/36AT may be configured by the user to
operate in Pipeline or Flow Through mode. Operating as a
pipelined synchronous device, in addition to the rising-edge-
triggered registers that capture input signals, the device
incorporates a rising-edge-triggered output register. For read
cycles, pipelined SRAM output data is temporarily stored by
the edge triggered output register during the access cycle and
then released to the output drivers at the next rising edge of
clock.
The GS842Z18/36AT is implemented with GSI's high
performance CMOS technology and is available in a JEDEC-
standard 119-bump BGA package.
Functional Description
The GS842Z18/36AB is a 4Mbit Synchronous Static SRAM.
GSI's NBT SRAMs, like ZBT, NtRAM, NoBL or other
pipelined read/double late write or flow through read/single
late write SRAMs, allow utilization of all available bus
bandwidth by eliminating the need to insert deselect cycles
when the device is switched from read to write cycles.
Parameter Synopsis
Pipeline
3-1-1-1
Flow
Through
2-1-1-1
tCycle
t
KQ
I
DD
t
KQ
tCycle
I
DD
–180
5.5 ns
3.2 ns
335 mA
8 ns
9.1 ns
210 mA
–166
6.0 ns
3.5 ns
310 mA
8.5 ns
10 ns
190 mA
–150
6.6 ns
3.8 ns
280 mA
10 ns
12 ns
165 mA
–100
10 ns
4.5 ns
190 mA
12 ns
15 ns
135 mA
Rev: 1.04c 1/2009
1/29
© 2001, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

 
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