Shift Register, 18-Bit, CMOS, CDIP24
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | DIP, DIP24,.3 |
| Reach Compliance Code | unknow |
| JESD-30 代码 | R-XDIP-T24 |
| JESD-609代码 | e0 |
| 最大频率@ Nom-Su | 28000000 Hz |
| 位数 | 18 |
| 功能数量 | 8 |
| 端子数量 | 24 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP24,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| TMC2011B2V | TMC2011B2C | TMC2011C3V | TMC2111C3V | TMC2111B2C | |
|---|---|---|---|---|---|
| 描述 | Shift Register, 18-Bit, CMOS, CDIP24 | Shift Register, 18-Bit, CMOS, CDIP24 | Pipeline Register, 8-Bit, CMOS, CQCC28 | Shift Register, 1-Bit, CMOS, CQCC28 | Shift Register, 1-Bit, CMOS, CDIP24 |
| 包装说明 | DIP, DIP24,.3 | DIP, DIP24,.3 | , | QCCN, LCC28,.45SQ | DIP, DIP24,.3 |
| Reach Compliance Code | unknow | unknow | unknown | unknown | unknown |
| JESD-30 代码 | R-XDIP-T24 | R-XDIP-T24 | S-CQCC-N28 | S-XQCC-N28 | R-XDIP-T24 |
| 端子数量 | 24 | 24 | 28 | 28 | 24 |
| 最高工作温度 | 125 °C | 70 °C | 125 °C | 125 °C | 70 °C |
| 最低工作温度 | -55 °C | - | -55 °C | -55 °C | - |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC, METAL-SEALED COFIRED | CERAMIC | CERAMIC |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | NO | NO | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | THROUGH-HOLE |
| 端子位置 | DUAL | DUAL | QUAD | QUAD | DUAL |
| 是否Rohs认证 | 不符合 | 不符合 | - | 不符合 | 不符合 |
| JESD-609代码 | e0 | e0 | - | e0 | e0 |
| 位数 | 18 | 18 | - | 1 | 1 |
| 功能数量 | 8 | 8 | - | 8 | 8 |
| 封装代码 | DIP | DIP | - | QCCN | DIP |
| 封装等效代码 | DIP24,.3 | DIP24,.3 | - | LCC28,.45SQ | DIP24,.3 |
| 电源 | 5 V | 5 V | - | 5 V | 5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | - | 5 V | 5 V |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子节距 | 2.54 mm | 2.54 mm | - | 1.27 mm | 2.54 mm |
| 厂商名称 | - | - | TRW Inc | TRW Inc | TRW Inc |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
