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SIT3521AC-4C13323L156.250000Y: 产品描述HCSL Output Clock Oscillator, 156.25MHz Nom, QFN, 10 PIN; 产品类别无源元件振荡器; 文件大小3MB，共47页; 制造商SiTime; 标准

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SIT3521AC-4C13323L156.250000Y概述

HCSL Output Clock Oscillator, 156.25MHz Nom, QFN, 10 PIN

SIT3521AC-4C13323L156.250000Y规格参数

参数名称	属性值
是否Rohs认证	符合
厂商名称	SiTime
包装说明	LCC10,.12X.2,50/40
Reach Compliance Code	unknown
其他特性	ENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT
最长下降时间	0.465 ns
频率调整-机械	NO
频率稳定性	20%
JESD-609代码	e4
安装特点	SURFACE MOUNT
端子数量	10
标称工作频率	156.25 MHz
最高工作温度	70 °C
最低工作温度	-20 °C
振荡器类型	HCSL
输出负载	50 OHM, 2 pF
封装等效代码	LCC10,.12X.2,50/40
物理尺寸	5.0mm x 3.2mm x 0.9mm
最长上升时间	0.465 ns
最大压摆率	93 mA
最大供电电压	3.63 V
最小供电电压	2.97 V
标称供电电压	3.3 V
表面贴装	YES
最大对称度	55/45 %
端子面层	Nickel/Palladium/Gold (Ni/Pd/Au)

SIT3521AC-4C13323L156.250000Y文档预览

SiT3521

Description

PRELIMINARY

1 to 340 MHz Elite Platform™ I

C/SPI Programmable Oscillator

Features



The

SiT3521

is an ultra-low jitter, user programmable

oscillator which offers the system designer great flexibility

and functionality.

The device supports two in-system programming options

after powering up at a default, factory programmed startup

frequency:



Any-frequency mode where the clock output can be re-

programmed to any frequency between 1 MHz and

340 MHz in 1 Hz steps

Digitally controlled oscillator (DCO) mode where the

clock output can be steered or pulled by up to

±3200

ppm with 5 to 94 ppt (parts per trillion) resolution.



The device’s default start-up frequency is specified in the

ordering code. User programming of the device is achieved

via I C or SPI. Up to 16 I C addresses can be specified by

the user either as a factory programmable option or via

hardware pins, enabling the device to share the I C with

other I C devices.

The SiT3521 utilizes SiTime’s unique DualMEMS™

temperature sensing and TurboCompensation™ technology

to deliver exceptional dynamic performance:



Programmable frequencies (factory or via I C/SPI)

from 1 MHz to 340 MHz

Digital frequency pulling (DCO) via I C/SPI



Output frequency pulling with perfect pull linearity



13 programmable pull range options to

±3200

ppm



Frequency pull resolution as low as 5 ppt (0.005 ppb)

0.21 ps typical integrated phase jitter (12 kHz to 20 MHz)

Integrated LDO for on-chip power supply noise filtering

0.02 ps/mV PSNR

-40°C to 105°C operating temperature

LVPECL, LVDS, or HCSL outputs



Programmable LVPECL, LVDS Swing



LVDS Common Mode Voltage Control

RoHS and REACH compliant, Pb-free, Halogen-free

and Antimony-free

Applications



Resistant to airflow and thermal shock

Resistant to shock and vibration

Superior power supply noise rejection

Combined with wide frequency range and user

programmability, this device is ideal for telecom, networking

and industrial applications that require a variety of

frequencies and operate in noisy environment.

Ethernet: 1/10/40/100/400 Gbps

G.fast and xDSL

Optical Transport: SONET/SDH, OTN

Clock and data recovery

Processor over-clocking

Low jitter clock generation

Server, storage, datacenter

Test and measurement

Broadcasting

Block Diagram

Package Pinout

(10-Lead QFN, 5.0 x 3.2 mm)

A/ K

SD C L

OE / NC

GND

VDD

OUT-

OUT+

A1 A0

/N /N

C/ C/

M SS

Figure 1. SiT3521 Block Diagram

Figure 2. Pin Assignments (Top view)

(Refer to

Table 14

for Pin Descriptions)

Rev 0.991

April 25, 2020

www.sitime.com

SiT3521

1 to 340 MHz Elite™ I

C/SPI Programmable Oscillator

Ordering Information

PRELIMINARY

SiT3521 AC -1C133 1 GG156.250000T

Part Family

“SiT3521”

12 mm Tape & Reel, 3ku reel

12 mm Tape & Reel, 1ku reel

[2]

Revision Letter

“A” is the revision of Silicon

Frequency

1.000000 to 340. 000000 MHz

Temperature Range

“C” : Extended Commercial, -20 to 70°C

“ I ” : Industrial, -40 to 85°C

“E” : Extended Industrial, -40 to 105°C

[1]

Signaling Type

“1”: LVPECL

“2”: LVDS

“4”: HCSL

DCXO Pull Range

“M”

“B”

“C”

“E”

“F”

“G”

“H”

“X”

“L”

“Y”

“S”

“Z”

“U”

± 25 ppm

± 50 ppm

± 80 ppm

±100 ppm

±125 ppm

±150 ppm

±200 ppm

±400 ppm

± 600 ppm

±800 ppm

±1200 ppm

±1600 ppm

±3200 ppm

Package Size

“C”: 5.0 x 3.2 mm

Frequency Stability/Grade

“F”: ±10 ppm

“1”: ±20 ppm

“2”: ±25 ppm

“3”: ±50 ppm

Serial IF mode

“S”

: SPI mode

[1]

“0-G”

: I

C mode (See below)

I C Factory Programmable Addresses

“0-F” : I C Address factory programmed

Sets Bits 3: 0 of Device I

C address to

the Hex value of the ordering code .

When the I C address is factory

programmed using these codes ,

pin A0, A1 are NC

“G”: I

C address controlled by A0, A1 pins

A1:A0

C Address

1100000

1100010

1101000

1101010 (default)

Voltage Supply

“25” :

“28” :

“30” :

“33” :

2.5V

2.8V

3.0V

3.3V

±10%

OE Pin Control

“-”: OE under software Control.

Pin 1 and 2 are both NC.

“1”: Pin 1 OE, Pin 2 NC

“2”: Pin 1 NC, Pin 2 OE

Notes:

1. -40 to 105°C option available only for I

C operation.

2. Bulk is available for sampling only.

Rev 0.991

Page 2 of 47

www.sitime.com

SiT3521

1 to 340 MHz Elite™ I

C/SPI Programmable Oscillator

TABLE OF CONTENTS

PRELIMINARY

Description ................................................................................................................................................................................... 1

Features....................................................................................................................................................................................... 1

Applications ................................................................................................................................................................................. 1

Block Diagram ............................................................................................................................................................................. 1

Ordering Information .................................................................................................................................................................... 2

1 Electrical Characteristics ......................................................................................................................................................... 4

2 Device Configurations and Pin-outs ........................................................................................................................................ 9

3 Waveform Diagrams ............................................................................................................................................................. 11

4 Termination Diagrams ........................................................................................................................................................... 13

4.1. LVPECL .................................................................................................................................................................... 13

4.2. LVDS ........................................................................................................................................................................ 15

4.3. HCSL ........................................................................................................................................................................ 16

5 Test Circuit Diagrams ........................................................................................................................................................... 17

6 Architecture Overview ........................................................................................................................................................... 19

7 Functional Overview ............................................................................................................................................................. 19

7.1. User Programming Interface ..................................................................................................................................... 19

7.2. Start-up output frequency and signaling types .......................................................................................................... 19

7.3. In-system programmable options.............................................................................................................................. 19

8 In-system Programmable Functional Description.................................................................................................................. 20

8.1. Any-frequency function ............................................................................................................................................. 20

8.2. DCO Functional Description ..................................................................................................................................... 24

8.3. Pull Range, Absolute Pull Range .............................................................................................................................. 26

8.4. Software OE Functional Description ......................................................................................................................... 28

9 I C/SPI Control Registers...................................................................................................................................................... 29

9.1. Register Address: 0x00. DCO Frequency Control Least Significant Word (LSW) .................................................... 29

9.2. Register Address: 0x01. OE Control, DCO Frequency Control Most Significant Word (MSW) ................................. 30

9.3. Register Address: 0x02. DCO PULL RANGE CONTROL ........................................................................................ 31

9.4. Register Address: 0x03. Flac-N PLL Integer Value and Flac-N PLL Fraction MSW ................................................. 32

9.5. Register Address: 0x04. Flac-N PLL Fraction LSW .................................................................................................. 32

9.6. Register Address: 0x05. PostDiv, Driver Control ...................................................................................................... 33

9.7. Register Address: 0x06. mDriver, Driver Control ...................................................................................................... 34

10 I C Operation ........................................................................................................................................................................ 35

10.1. I C protocol ............................................................................................................................................................... 35

10.2. I C Timing Specification ............................................................................................................................................ 37

10.3. I C Device Address Modes ....................................................................................................................................... 38

11 SPI Operation ....................................................................................................................................................................... 39

Schematic Examples ................................................................................................................................................................. 42

Dimensions and Patterns ........................................................................................................................................................... 45

Additional Information ................................................................................................................................................................ 46

Revision History ......................................................................................................................................................................... 47

Rev 0.991

Page 3 of 47

www.sitime.com

SiT3521

1 to 340 MHz Elite™ I

C/SPI Programmable Oscillator

1 Electrical Characteristics

PRELIMINARY

All Min and Max limits in the Electrical Characteristics tables are specified over temperature and rated operating voltage with

standard output terminations shown in the termination diagrams. Typical values are at 25°C and nominal supply voltage.

Table 1. Electrical Characteristics – Common to LVPECL, LVDS and HCSL

Parameter

Output Frequency Range

Frequency Stability

Symbol

F_stab

Min.

-10

-20

-25

-50

First Year Aging

Operating Temperature Range

F_1y

T_use

–

-20

-40

Supply Voltage

Vdd

2.97

2.7

2.52

2.25

Input Voltage High

Input Voltage Low

Input Pull-up Impedance

Duty Cycle

Start-up Time

Output Enable/Disable Time –

Hardware control via OE pin

Output Enable/Disable Time –

Software control via I

C/SPI

VIH

VIL

Z_in

T_start

T_oe_hw

70%

–

Typ.

–

±1

–

3.3

3.0

2.8

2.5

–

100

–

Max.

340

+10

+20

+25

+50

–

+70

+85

+105

Supply Voltage

3.63

3.3

3.08

2.75

–

30%

–

3.0

3.8

Vdd

kΩ

µs

Measured from the time Vdd reaches its rated minimum value

Measured from the time OE pin reaches rated VIH and VIL to

the time clock pins reach 90% of swing and high-Z.

See

Figure 9

and

Figure 10

Measured from the time the last byte of command is

transmitted via I

C/SPI (reg1) to the time clock pins reach 90%

of swing and high-Z. See

Figure 30

and

Figure 31

OE pin

OE pin, logic high or logic low

Unit

MHz

ppm

°C

1 -year aging at 25°C

Extended Commercial

Industrial

Extended Industrial. Available only for I C operation, not SPI.

Condition

Factory or user programmable, accurate to 6 decimal places

Inclusive of initial tolerance, operating temperature, rated

power supply voltage and load variations.

Frequency Range

Frequency Stability

Temperature Range

Input Characteristics – OE Pin

Output Characteristics

Startup and Output Enable/Disable Timing

T_oe_sw

–

6.5

µs

Rev 0.991

Page 4 of 47

www.sitime.com

SiT3521

1 to 340 MHz Elite™ I

C/SPI Programmable Oscillator

Table 2. Electrical Characteristics – LVPECL Specific

Parameter

Symbol

Min.

Typ.

Max.

Unit

PRELIMINARY

Condition

Current Consumption

OE Disable Supply Current

Output Disable Leakage Current

Maximum Output Current

Idd

I_OE

I_leak

I_driver

–

0.15

–

A

Excluding Load Termination Current, Vdd = 3.3V or 2.5V

OE = Low

Maximum average current drawn from OUT+ or OUT-

Output Characteristics

Output High Voltage

Output Low Voltage

Output Differential Voltage Swing

Rise/Fall Time

VOH

VOL

V_Swing

Tr, Tf

Vdd - 1.1V

Vdd - 1.9V

1.2

–

1.6

225

Vdd - 0.7V

Vdd - 1.5V

2.0

290

Jitter

RMS Phase Jitter (random) –

DCO Mode Only

T_phj

–

RMS Phase Jitter (random) –

Any-frequency Mode Only

T_phj

–

RMS Period Jitter

[3]

Note:

3. Measured according to JESD65B.

T_jitt

–

0.225

0.1

0.225

0.11

0.340

0.14

0.340

0.15

1.6

f = 156.25 MHz, Integration bandwidth = 12 kHz to 20 MHz,

all Vdd levels

f = 156.25, IEEE802.3-2005 10 GbE jitter mask integration

bandwidth = 1.875 MHz to 20 MHz, all Vdd levels

f = 156.25 MHz, Integration bandwidth = 12 kHz to 20 MHz,

all Vdd levels

f = 156.25, IEEE802.3-2005 10 GbE jitter mask integration

bandwidth = 1.875 MHz to 20 MHz, all Vdd levels

f = 100, 156.25 or 212.5 MHz, Vdd = 3.3V or 2.5V

See

Figure 5

See

Figure 5

See

Figure 6

20% to 80%, see

Figure 6

Table 3. Electrical Characteristics – LVDS Specific

Parameter

Symbol

Min.

Typ.

Max.

Unit

Condition

Current Consumption

OE Disable Supply Current

Output Disable Leakage Current

Idd

I_OE

I_leak

–

0.15

–

A

Excluding Load Termination Current, Vdd = 3.3V or 2.5V

OE = Low

Output Characteristics

Differential Output Voltage

Delta VOD

Offset Voltage

Delta VOS

Rise/Fall Time

VOD

ΔVOD

VOS

ΔVOS

Tr, Tf

250

–

1.125

–

400

455

1.375

470

Jitter

RMS Phase Jitter (random) –

DCO Mode Only

T_phj

–

RMS Phase Jitter (random) –

Any-frequency Mode Only

T_phj

–

RMS Period Jitter

[4]

Note:

4. Measured according to JESD65B.

T_jitt

–

0.21

0.1

0.21

0.1

0.275

0.12

0.367

0.12

1.6

f = 156.25 MHz, Integration bandwidth = 12 kHz to 20 MHz,

all Vdd levels

f = 156.25, IEEE802.3-2005 10 GbE jitter mask integration

bandwidth = 1.875 MHz to 20 MHz, all Vdd levels

f = 156.25 MHz, Integration bandwidth = 12 kHz to 20 MHz,

all Vdd levels

f = 156.25, IEEE802.3-2005 10 GbE jitter mask integration

bandwidth = 1.875 MHz to 20 MHz, all Vdd levels

f = 100, 156.25 or 212.5 MHz, Vdd = 3.3V or 2.5V

f = 156.25MHz See

Figure 7

See

Figure 7

See

Figure 7

See

Figure 7

Measured with 2 pF capacitive loading to GND, 20% to 80%,

see

Figure 8

Rev 0.991

Page 5 of 47

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