SANGDEST
MICROELECTRONICS
Technical Data
Data Sheet N1445, Rev. -
503CNQ… SERIES
Green Products
503CNQ080/503CNQ100 SCHOTTKY RECTIFIER
Applications:
●
High current switching power supply
●
Plating power supply
●
Free-Wheeling diodes
●
Reverse battery protection
●
Converters
●
UPS System
●
Welding
Features:
•
•
•
•
•
•
•
•
•
175℃ T
J
operation
℃
Center tap module
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and
moisture resistance
Low forward voltage drop
High frequency operation
Guard ring for enhanced ruggedness and long term reliability
This is a Pb − Free Device
All SMC parts are traceable to the wafer lot
Additional testing can be offered upon request
Mechanical Dimensions: In mm/ Inches
PRM4 (Non-Isolated)
MARKING,MOLDING RESIN
Marking for 503CNQ080/100, 1
st
row SS YYWWL, 2
nd
row 503CNQ080/100
Where YY is the manufacture year
WW is the manufacture week code
L is the wafer’s Lot Number
Molding resin
Epoxy resin UL:94V-0
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FAX (86) 25-87123900
•
World Wide Web Site - http://www.sangdest.com.cn
•
E-Mail Address - sales@ sangdest.com.cn
•
•
Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113
(86) 25-87123907
•
SANGDEST
MICROELECTRONICS
Technical Data
Data Sheet N1445, Rev. -
503CNQ… SERIES
Green Products
Maximum Ratings:
Characteristics
Peak Inverse Voltage
Max. Average Forward
Current
Max. Peak One Cycle Non-
Repetitive Surge Current
(per leg)
Symbol
V
RWM
I
F(AV)
Condition
-
50% duty cycle @T
C
=122°C,
rectangular wave form
8.3 ms, half Sine pulse
80
100
250
500
Max.
503CNQ080
503CNQ100
per leg
per device
5000
Units
V
A
I
FSM
A
Electrical Characteristics:
Characteristics
Max. Forward Voltage Drop
(per leg) *
Max. Reverse Current (per
leg) *
Max. Junction Capacitance
(per leg)
Typical Series Inductance
(per leg)
Max. Voltage Rate of Change
*
Pulse Width < 300µs, Duty Cycle <2%
Symbol
V
F1
V
F2
I
R1
I
R2
C
T
L
S
dv/dt
Condition
@ 250A, Pulse, T
J
= 25
°C
@ 250A, Pulse, T
J
= 175
°C
@V
R
= rated V
R
T
J
= 25
°C
@V
R
= rated V
R
T
J
= 125
°C
@V
R
= 5V, T
C
= 25
°C
f
SIG
= 1MHz
Measured lead to lead 5 mm
from package body
-
Max.
0.90
0.72
8
200
7200
5.0
10,000
Units
V
V
mA
mA
pF
nH
V/µs
Thermal-Mechanical Specifications:
Characteristics
Max. Junction Temperature
Max. Storage Temperature
Maximum Thermal
Resistance Junction to Case
(per leg)
Maximum Thermal
Resistance Junction to Case
(per package)
Typical Thermal Resistance,
case to Heat Sink
Mounting Torque
Approximate Weight
Case Style
Symbol
T
J
T
stg
R
θJC
Condition
-
-
DC operation
Specification
-55 to +175
-55 to +175
0.24
Units
°C
°C
°C/W
°C/W
°C/W
24(min)
35(max)
35(min)
46(max)
R
θJC
R
θcs
DC operation
Mounting surface, smooth
and greased
0.12
0.08
T
M
wt
Mounting
Torque
-
Terminal
Torque
-
78
PRM4 Non-Isolated
Kg-cm
g
•
FAX (86) 25-87123900
•
World Wide Web Site - http://www.sangdest.com.cn
•
E-Mail Address - sales@ sangdest.com.cn
•
•
Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113
(86) 25-87123907
•
SANGDEST
MICROELECTRONICS
Technical Data
Data Sheet N1445, Rev. -
503CNQ… SERIES
Green Products
•
FAX (86) 25-87123900
•
World Wide Web Site - http://www.sangdest.com.cn
•
E-Mail Address - sales@ sangdest.com.cn
•
•
Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113
(86) 25-87123907
•
SANGDEST
MICROELECTRONICS
Technical Data
Data Sheet N1445, Rev. -
503CNQ… SERIES
Green Products
DISCLAIMER:
1- The information given herein, including the specifications and dimensions, is subject to change without prior notice to improve
product characteristics. Before ordering, purchasers are advised to contact the SMC - Sangdest Microelectronics (Nanjing) Co., Ltd
sales department for the latest version of the datasheet(s).
2- In cases where extremely high reliability is required (such as use in nuclear power control, aerospace and aviation, traffic equipment,
medical equipment , and safety equipment) , safety should be ensured by using semiconductor devices that feature assured safety or
by means of users’ fail-safe precautions or other arrangement .
3- In no event shall SMC - Sangdest Microelectronics (Nanjing) Co., Ltd be liable for any damages that may result from an accident or
any other cause during operation of the user’s units according to the datasheet(s). SMC - Sangdest Microelectronics (Nanjing) Co., Ltd
assumes no responsibility for any intellectual property claims or any other problems that may result from applications of information,
products or circuits described in the datasheets.
4- In no event shall SMC - Sangdest Microelectronics (Nanjing) Co., Ltd be liable for any failure in a semiconductor device or any
secondary damage resulting from use at a value exceeding the absolute maximum rating.
5- No license is granted by the datasheet(s) under any patents or other rights of any third party or SMC - Sangdest Microelectronics
(Nanjing) Co., Ltd.
6- The datasheet(s) may not be reproduced or duplicated, in any form, in whole or part, without the expressed written permission of
SMC - Sangdest Microelectronics (Nanjing) Co., Ltd.
7- The products (technologies) described in the datasheet(s) are not to be provided to any party whose purpose in their application will
hinder maintenance of international peace and safety nor are they to be applied to that purpose by their direct purchasers or any third
party. When exporting these products (technologies), the necessary procedures are to be taken in accordance with related laws and
regulations..
•
FAX (86) 25-87123900
•
World Wide Web Site - http://www.sangdest.com.cn
•
E-Mail Address - sales@ sangdest.com.cn
•
•
Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113
(86) 25-87123907
•
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