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49EC226P020J0XG

产品描述CAPACITOR, TANTALUM, SOLID, POLARIZED, 20 V, 22 uF, SURFACE MOUNT, 2915, CHIP
产品类别无源元件    电容器   
文件大小140KB,共6页
制造商Vishay(威世)
官网地址http://www.vishay.com
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49EC226P020J0XG概述

CAPACITOR, TANTALUM, SOLID, POLARIZED, 20 V, 22 uF, SURFACE MOUNT, 2915, CHIP

49EC226P020J0XG规格参数

参数名称属性值
厂商名称Vishay(威世)
包装说明, 2915
Reach Compliance Codeunknown
ECCN代码EAR99
电容22 µF
电容器类型TANTALUM CAPACITOR
介电材料TANTALUM (DRY/SOLID)
JESD-609代码e4
漏电流0.004 mA
安装特点SURFACE MOUNT
负容差5%
端子数量2
最高工作温度125 °C
最低工作温度-55 °C
封装形状RECTANGULAR PACKAGE
极性POLARIZED
正容差5%
额定(直流)电压(URdc)20 V
参考标准MIL-C-55365/4
尺寸代码2915
表面贴装YES
Delta切线0.06
端子面层GOLD
端子形状WRAPAROUND

文档预览

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49BC / EC
Vishay Sprague
Solid Tantalum Chip Capacitors
Conformal Coated
FEATURES
Eight standard case codes, "pad compatible" with
MIL-C-55365/4 (CWR06).
High volumetric efficiency (Up to 200,000 CV per cubic inch).
Low profile, conformally-coated construction.
100% low impedance power burn-in at + 85°C.
Low ESR in high frequency applications.
Packaging in 50 unit 'Blister-Pack' trays or 8mm or 12mm
tape and reel.
Gold plated or solder dipped terminations.
PERFORMANCE CHARACTERISTICS
Operating Temperature:
- 55°C to + 85°C. (To + 125°C
with voltage derating.)
Capacitance Range:
0.1µF to 220µF.
Capacitance Tolerance:
±
20%,
±
10% standard.
±
5% available as special
Voltage Rating:
4 WVDC to 50 WVDC.
Conformally Coated:
Fluoroelastomer coating.
Automatic Screening:
Capacitance, DF and DCL.
DIMENSIONS
in inches [millimeters]
Negative Termination
(See Note 1)
W
Top View
Positive Termination
L
0.005
[0.127]
Typ.
H
B
S
Side View
B
0.015 [0.381]
Max. Weld Stub
CASE
CODE
B
L
U
E
C
H
I
P
LENGTH
L
0.100
±
0.015
[2.54
±
0.381]
0.150
±
0.015
[3.81
±
0.381]
0.200
±
0.015
[5.08
±
0.381]
0.150
±
0.015
[3.81
±
0.381]
0.200
±
0.015
[5.08
±
0.381]
0.220
±
0.015
[5.59
±
0.381]
0.265
±
0.015
[6.73
±
0.381]
0.285
±
0.015
[7.25
±
0.381]
WIDTH
W
0.050
±
0.015
[1.27
±
0.381]
0.050
±
0.015
[1.27
±
0.381]
0.050
±
0.015
[1.27
±
0.381]
0.100
±
0.015
[2.54
±
0.381]
0.100
±
0.015
[2.54
±
0.381]
0.135
±
0.015
[3.43
±
0.381]
0.110
±
0.015
[2.79
±
0.381]
0.150
±
0.015
[3.81
±
0.381]
HEIGHT
H
0.050
±
0.015
[1.27
±
0.381]
0.050
±
0.015
[1.27
±
0.381]
0.050
±
0.015
[1.27
±
0.381]
0.050
±
0.015
[1.27
±
0.381]
0.050
±
0.015
[1.27
±
0.381]
0.070
±
0.015
[1.78
±
0.381]
0.110
±
0.015
[2.79
±
0.381]
0.110
±
0.015
[2.79
±
0.381]
SPACING
TYPICAL
S
0.040
[1.02]
0.090
[2.29]
0.140
[3.55]
0.090
[2.29]
0.140
[3.55]
0.160
[4.06]
0.165
[4.19]
0.185
[4.70]
PAD
WIDTH
B
0.030
±
0.005
[0.76
±
0.127]
0.030
±
0.005
[0.76
±
0.127]
0.030
±
0.005
[0.76
±
0.127]
0.030
±
0.005
[0.76
±
0.127]
0.030
±
0.005
[0.76
±
0.127]
0.030
±
0.005
[0.76
±
0.127]
0.050
±
0.005
[1.27
±
0.127]
0.050
±
0.005
[1.27
±
0.127]
TYPICAL
WEIGHT
(Grams)
0.02
0.03
0.04
0.07
0.09
0.21
0.33
0.50
Notes:
1. For polarity identification, when chip is in mounting position, bare metal clip and weld stub are positive. The top surface of the negative
terminal is blue.
2. Anode Riser (weld stub) may extend case size length dimension by 0.015" [0.381] maximum.
3. Dimensions given are for gold plated terminations. For solder dipped terminations, add 0.015" [0.381] to dimension tolerances.
4. Spacing dimension is average distance between chip mounting terminations and therefore maximum distance between mounting pads on
substrate.
www.vishay.com
108
For technical questions, contact tantalum@vishay.com
Document Number 40013
Revision 05-Jul-02

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