● USP-12B01
Power Dissipation
Power dissipation data for the USP-12B01 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
1. Test Condition (Reference data)
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board Dimensions: 40 x 40 mm (1600 mm2 in one side)
Board Structure: Inner two metal layers, no large metal area
in the front and back.
Copper Area
1st Inner Metal Layer about 50%
2nd Inner Metal Layer about 50%
Each Heatsink back metal is connected
to the inner layers respectively.
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 2 x 0.8 Diameter
(One through-hole connection per one
heatsink back metal)
Evaluation Board (Unit: mm)
2. Power Dissipation vs. Ambient Temperature
1）1ch Operation
Board Mount (Tj max = 125℃)
Ambient Temperature（℃）Power Dissipation Pd（mW） Thermal Resistance(℃/W)
25
85
800
320
Pd vs Ta
1000
800
600
400
200
0
25
45
65
85
Ambient TemperatureTa（℃）
105
125
125.00
2）2ch Operation
Board Mount (Tj max = 125℃)
Ambient Temperature（℃）Power Dissipation Pd（mW） Thermal Resistance(℃/W)
25
85
600
240
Pd vs Ta
1000
800
600
400
200
0
25
45
65
85
Ambient Temperature Ta（℃）
105
125
166.67
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