MAXIMUM
solutions
Receptacles on Tape for Automated Assembly
Mill-Max offers receptacles (discrete sockets) on carrier tape per EIA-481 to feed automated ‘pick &
place’ assembly equipment. Our standard reel size has been 13”, but now for 8 & 12mm wide carrier tapes,
we also offer the new 7” ‘mini’ reel. A 7” reel holds about one quarter the parts of a 13” reel. This is more
economic and convenient for smaller volume customers who want the benefit of automated assembly.
• Two types of receptacles are available on carrier tape: surface mount, flat types, which sit on the
surface of the PCB where the pin or component lead plugs-in parallel to the PCB; and thru-hole types
where the lead plugs-in perpendicular to the PCB. Thru-hole receptacles are intrusive reflow soldered*.
Our increasingly popular thru-hole (tubular) receptacles have an Organic Fibre Plug® barrier which
prevents solder, paste or flux from contaminating the spring contact. After soldering, the OFP®
barrier is pushed out of the receptacle when the device is plugged in.
• Also new for Mill-Max is the availability of RoHS “lead free” plating options. Instead of traditional
tin/lead plating on the receptacle’s shell and contact, a pure matte tin with oxide and whisker inhibitors
can be specified.
*Intrusive reflow (also called "pin-in-paste") is a technique of using conventional thru-hole components in a reflow soldering
process. The receptacles are placed into plated-thru-holes in the circuit board (solder paste has previously been screen printed
on pads adjacent to the holes) and the board is reflowed in the same pass as other SMT components. Solder will fill the plated-
thru-holes and achieve solder joints as reliable as wave soldering. The OFP® barrier prevents solder paste from being picked-
up inside the contact during pick ‘n place assembly. "Overprinting" paste on the solder mask can be used to adjust the volume
of paste required to fill each hole.
(02/06-558)
R
Mill-Max Mfg. Corp. • 190 Pine Hollow Road, Oyster Bay, NY 11771-0300
516-922-6000 • Fax: 516-922-9253 • www.mill-max.com
Maximum Interconnect Solutions
RECEPTACLES ON TAPE per EIA-481
for automated “pick & place” assembly.
Surface Mount & OFP
®
thru hole, “intrusive” reflow soldered
PR
E
CI
M
ON
S
I
CHI
A
PINS
NE
D
3907
8806
6628
.080
.059
.080
.059
.078
.057
3907-0-5X-XX-30-XX-10-0
Surface Mount.
#30
Contact for Ø.015-.025 pins.
Supplied on 12mm wide carrier tape,
4,000 per 13” reel, 1,000 per 7” reel.
8806-0-5X-XX-47-XX-40-0
Surface Mount.
#47
Contact for Ø.025-.037 pins.
Supplied on 12mm wide carrier tape,
4,000 per 13” reel, 1,000 per 7” reel.
6628-0-5X-XX-18-XX-10-0
Surface Mount.
#18
Contact for Ø.037-.043 pins.
Supplied on 12mm wide carrier tape,
3,700 per 13” reel, 900 per 7” reel.
9184
9222
0577
9184-0-5X-XX-02-XX-40-0
Bottom entry, “intrusive” reflow
soldered in Ø.095±.003 PTH.
#02
Contact for Ø.040-.050 pins.
Supplied on 12mm wide carrier tape,
1,500 per 13” reel, 350 per 7” reel.
9222-2-5X-XX-02-XX-40-0
Bottom entry, “intrusive” reflow
soldered in Ø.085±.003 PTH.
#02
Contact for Ø.040-.050 pins.
Supplied on 12mm wide carrier tape,
1,500 per 13” reel, 350 per 7” reel.
0577-0-6X-XX-21-XX-10-0
Carrier tape format for
9184 & 9222
OFP
®
thru hole, “intrusive” reflow
soldered in Ø.045±.003 PTH.
#21
Contact for Ø.015-.022 pins.
Supplied on 12mm wide carrier tape,
3,000 per 13” reel, 850 per 7” reel.
4015
.068 DIA.
.052 DIA.
.020
.089 .100
4280
.078 DIA.
.062 DIA.
.020
.089
.100
9873
.100 DIA.
.078 DIA.
.030
.093
.125
5364
.120 DIA.
.098 DIA.
.075 DIA.
.110
.018 .125
.150
.056 DIA.
.043 DIA.
.009
.051 DIA.
.009
.068 DIA.
.009
.067 DIA.
.009
4015-0-6X-XX-30-XX-10-0
OFP
®
thru hole, “intrusive” reflow
soldered in Ø.057±.003 PTH.
#30
Contact for Ø.015-.025 pins.
Supplied on 8mm wide carrier tape,
5,500 per 13” reel, 1,500 per 7” reel.
4280-0-6X-XX-16-XX-10-0
OFP
®
thru hole, “intrusive” reflow
soldered in Ø.067±.003 PTH.
#16
Contact for Ø.022-.034 pins.
Supplied on 8mm wide carrier tape,
5,500 per 13” reel, 1,500 per 7” reel.
9873-0-6X-XX-02-XX-10-0
OFP
®
thru hole, “intrusive” reflow
soldered in Ø.083±.003 PTH.
#02
Contact for Ø.040-.050 pins.
Supplied on 12mm wide carrier tape,
4,500 per 13” reel, 1,200 per 7” reel.
5364-0-6X-XX-23-XX-10-0
OFP
®
thru hole, “intrusive” reflow
soldered in Ø.103±.003 PTH.
#23
Contact for Ø.045-.065 pins.
Supplied on 12mm wide carrier tape,
2,000 per 13” reel, 500 per 7” reel.
ORDER CODE: XXXX - X - XX - XX - XX - XX -XX - 0
SPECIFICATIONS
SHELL MATERIAL:
Brass Alloy 360, 1/2 Hard
CONTACT MATERIAL:
Beryllium Copper Alloy 172, HT
DIMENSION IN INCHES
TOLERANCES ON:
LENGTHS:
±.005
DIAMETERS: ±.002
ANGLES:
± 2°
BASIC PART #
REEL SIZE: 5
= 7”
, 7
= 13”
SPECIFY SHELL FINISH:
01
200μ" TIN/LEAD OVER NICKEL
80
200μ" TIN OVER NICKEL
SPECIFY CONTACT FINISH:
27
30μ" GOLD OVER NICKEL
01
200μ" TIN/LEAD or
02
100μ" TIN/LEAD OVER NICKEL
80
200μ" TIN
or
84
100μ" TIN OVER NICKEL
Use with
#21
&
#30
Contacts Only
CONTACT TYPE
#21, #30, #16, #47, #18, #02, #03 or #23
(DATA ON PAGES 206-214)
The
ORGANIC FIBRE PLUG
®
(OFP
®
) barrier prevents solder, paste or flux from contaminating the spring contact.
After soldering, the
OFP
®
barrier is pushed out of the receptacle when the device is plugged in.
w w w. m i l l - m a x . c o m
PR558
516-922-6000
嵌入式系统
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