Packaging Information / Reference Pattern Layout Dimensions
●
USPN-4
■
Packaging Information
Unit: mm
■
Reference Pattern Layout Dimension
Note : reference metal mask design
● USPN-4 Power Dissipation
Power dissipation data for the USPN-4 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
1. Measurement Condition (Reference data)
Condition:
Mount on a board
Ambient:
Natural convection
Soldering:
Lead (Pb) free
Board:
Dimensions 40 x 40 mm (1600 mm2 in one side)
Copper (Cu) traces occupy 50% of the front and
50% of the back.
The copper area is divided into four block,
one block is 12.5% of total.
The USPN-4 package has for terminals.
Each terminal connects one copper block in the front
and one in the back.
Material:
Glass Epoxy (FR-4)
Thickness:
1.6 mm
Through-hole: 4 x 0.8 Diameter
Evaluation Board (Unit: mm)
2. Power Dissipation vs. Ambient Temperature（85℃）
Board Mount (Tj max = 125℃)
Ambient
Temperature
（℃）
25
85
Power
Dissipation Pd
（mW）
600
240
Thermal
Resistance
(℃/W)
166.67
Power Dissipation Pd(mW)
許容損失Pd（mW）
700
600
500
400
300
200
100
0
25
45
65
85
105
Ambient Temperature Ta(℃)
周囲温度Ta（℃）
125
Pd vs Ta
Pd-Ta特性グラフ
3. Power Dissipation vs. Ambient temperature（105℃）
Board Mount ( Tjmax=125℃)
Ambient
Temperature
（℃）
25
105
Power
Dissipation Pd
（mW）
600
120
Thermal
Resistance
(℃/W)
166.67
Pd-Ta特性グラフ
Pd vs Ta
Power
許容損失Pd（mW）
Dissipation Pd(mW)
700
600
500
400
300
200
100
0
25
45
65
85
105
周囲温度Ta（℃）
Ambient Temperature Ta(℃)
125
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