MSP
Vishay Sfernice
Precision Surface Mount Resistors
Wirewound or Metal Film Technologies
FEATURES
•
Wide range of ohmic values (R04 to 1M)
•
Low temperature coefficient (± 25 ppm/°C
available)
•
Good electrical insulation
•
Good mechanical strength
•
High power (to 2.5 W)
•
Termination = Pure Matte Tin
Specially designed for surface mounting, the MSP series
uses either wirewound or metal film technology.
The molded package ensures mechanical and climatic
protection as well as high dielectric insulation.
RoHS
COMPLIANT
The MSP design is compatible with surface mounting
equipment and can withstand wave and reflow soldering
techniques.
DIMENSIONS
in millimeters
MSP
E
Z
RECOMMENDED SOLDERING AREAS
W
X
A
C
X
DIMENSIONS
A
SERIES
B
B
C
D
E
F
W
X
Z
6
MSP 1
MSP 2
MSP 3
D
6.9 3.8 3.8 2.5 6.5 1.4 2.7 2.9
11.4
5
7
7
5
5
11
14.8 6.6
2.4 5.2 4.1 9.4
F
F
14.4 2.4 5.2 4.1 12.7
General tolerance: ± 0.2 mm
TECHNICAL SPECIFICATIONS
RESISTIVE TECHNOLOGY
Vishay Sfernice Series EN140400
Power Dissipation at + 25 °C
±5%
±2%
Ohmic Range
In Relation
to Tolerance
±1%
± 0.5 %
± 0.1 %
Limiting Element Voltage
Critical Resistance
Average Weight (in g)
50 V
-
0.2
MSP 1B
RW1
1W
0.04
2.2K
0.04
2.2K
0.04
2.2K
0.4
2.2K
WIREWOUND
MSP 2B
RW2
2W
0.04
4.7K
0.04
4.7K
0.04
4.7K
0.4
4.7K
Consult VISHAY SFERNICE
120 V
-
0.8
200 V
-
1.5
MSP 3B
RW3
2.5 W
0.04
13K
0.05
13K
0.05
13K
0.3
13K
METAL FILM
MSP 1C
RW1
0.5 W
-
-
10
332K
10
332K
10
332K
300 V
180K
0.2
MSP 2C
RW2
1W
-
-
10
1M
10
1M
10
332K
350 V
122.5K
0.8
www.vishay.com
1
For technical questions, contact: sfer@vishay.com
Document Number: 50003
Revision: 20-Mar-07
MSP
Precision Surface Mount Resistors
Wirewound or Metal Film Technologies
PERFORMANCE
CONDITIONS
TESTS
Wirewound
Dielectric w/s Voltage
Short Time Overload
Climatic Sequence
Humidity
(Steady State)
Vibration
Load Life
Thermal Shock
Metal Film
Wirewound EN140402-801
± (0.1 % + 0.05)
± (0.25 % + 0.05)
± (0.5 % + 0.05)
Ins. resistance > 100M
± (0.5 % + 0.05)
Ins. resistance > 100M
± (0.25 % + 0.05)
± (0.5 % + 0.05)
Ins. resistance 1G
± (0.25 % + 0.05)
Metal Film EN140401-802
± 0.25 %
± 0.25 %
± 0.5 %
Ins. resistance > 100M
±1%
Ins. resistance > 100M
± 0.25 %
±1%
± 0.25 % + 0.05
± 0.05 %
± 0.15 %
± 0.2 %
Ins. resistance > 103M
± 0.3 %
Ins. resistance > 103M
± 0.05 %
± 0.5 %
± 0.2 %
REQUIREMENTS
TEST RESULTS
Vishay Sfernice
500 V RMS
5 Pr/5 s
5 cycles
- 55 °C + 200 °C - 55 °C + 125 °C
56 days
95 % RH
10/2000 Hz
Pr + 25 °C
2000 h
10 days
low load
10/500 Hz
1000 h Pr + 25 °C
90/30 cycle
260 °C 10 s
MSP B - Wirewound Technology
TEMPERATURE COEFFICIENT IN THE TEMPERATURE RANGE - 55 °C + 200 °C
OHMIC RANGE
<1
1 to < 10
10
NF C 83-210
LIMITS
± 100 ppm/°C
± 50 pm/°C
± 50 ppm/°C
± 25 ppm/°C
+ 0 to - 20 ppm/°C
TYPICAL VALUE
MSP C - Metal Film Technology
TEMPERATURE COEFFICIENT IN THE TEMPERATURE RANGE - 55 °C + 155 °C
OHMIC RANGE
10 to 332K
> 332K
-
MSP 1C
K3: ± 50 ppm/°C
K4: ± 25 ppm/°C
K3: ± 50 ppm/°C
MSP 2C
SURFACE MOUNTING
Soldering cycle: 2 minutes at 215 °C or 10 seconds at 260 °C or with an iron 40 W: 3 seconds at 350 °C.
Soldering is poss.ible by wave, reflow and vapor phase.
NON INDUCTIVE WINDING
Non inductive (Ayrton Perry) winding available.
Please consult VISHAY SFERNICE.
Document Number: 50003
Revision: 20-Mar-07
For technical questions, contact: sfer@vishay.com
www.vishay.com
2
MSP
Vishay Sfernice
POWER RATING CHART
125
Precision Surface Mount Resistors
Wirewound or Metal Film Technologies
TEMPERATURE RISE
250
HOT SPOT TEMPERATURE IN °C
100
200
M
SP
3
B
%
RATED POWER
75
MSP B
150
1B
MS
P
M
SP
2
B
50
100
25
MSP C
50
0
0
50
100
150
200
250
300
0
0
0.5
M
SP
1
C
M
SP
2
C
1
1.5
2
2.5
3
AMBIENT TEMPERATURE IN °C
RATED POWER IN WATTS
PACKAGING
In bulk (plastic bag of 100 units or multiples).
In tube:
MSP1 70 units per tube
MSP2 50 units per tube
MSP3 40 units per tube
In reel of 500 units for MSP1 and MSP2.
MARKING
SFERNICE trademark, ohmic value (in
Ω),
tolerance (in %), series and style, technology, manufacturing date.
ORDERING INFORMATION
MSP
SERIES
1
STYLE
B
48U7
±1%
TC
Applicable
only in “C”
technology
BA100NA
e3
TECHNOLOGY NON INDUCTIVE OHMIC VALUE TOLERANCE
B: Wirewound
C: Metal Film
WINDING
Optional
PACKAGING LEAD (Pb)-FREE
SAP PART NUMBERING GUIDELINES
MSP
MODEL
1
STYLE
B
TECHNOLOGY
48R70
OHMIC VALUE
F
TOLERANCE
500
PACKAGING
e3
LEAD (Pb)-FREE
www.vishay.com
3
For technical questions, contact: sfer@vishay.com
Document Number: 50003
Revision: 20-Mar-07
Legal Disclaimer Notice
Vishay
Notice
Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc.,
or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, by
estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's
terms and conditions of sale for such products, Vishay assumes no liability whatsoever, and disclaims any express
or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness
for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify Vishay for any damages resulting from such improper use or sale.
Document Number: 91000
Revision: 08-Apr-05
www.vishay.com
1
微控制器 MCU
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
