T2G4003532-FL
30W, 32V DC – 3.5 GHz, GaN RF Power Transistor
Applications
•
•
•
•
•
•
Military radar
Civilian radar
Professional and military radio communications
Test instrumentation
Wideband or narrowband amplifiers
Jammers
Product Features
•
•
•
•
•
Frequency: DC to 3.5 GHz
Output Power (P
3dB
): 28 W at 3.5 GHz
Linear Gain: >16 dB at 3.5 GHz
Operating Voltage: 32 V
Low thermal resistance package
Functional Block Diagram
General Description
The TriQuint T2G4003532-FL is a 30 W (P
3dB
) discrete
GaN on SiC HEMT which operates from DC to 3.5 GHz.
The device is constructed with TriQuint’s proven
TQGaN25 process, which features advanced field plate
techniques to optimize power and efficiency at high drain
bias operating conditions. This optimization can
potentially lower system costs in terms of fewer amplifier
line-ups and lower thermal management costs.
Lead-free and ROHS compliant
Evaluation boards are available upon request.
Pin Configuration
Pin No.
1
2
Flange
Label
V
D
/ RF OUT
V
G
/ RF IN
Source
Ordering Information
Part
T2G4003532-FL
T2G4003532-
FS/FL-EVB1
ECCN
EAR99
EAR99
Description
Packaged part
Flangeless
2.7-3.5 GHz
Evaluation Board
Datasheet: Rev - 12-30-13
© 2013 TriQuint
- 1 of 13 -
Disclaimer: Subject to change without notice
www.triquint.com
T2G4003532-FL
30W, 32V DC – 3.5 GHz, GaN RF Power Transistor
Absolute Maximum Ratings
Parameter
Breakdown Voltage (BV
DG
)
Gate Voltage Range (V
G
)
Drain Current (I
D
)
Gate Current (I
G
)
Power Dissipation (P
D
)
RF Input Power, CW,
T = 25° (P
IN
)
C
Channel Temperature (T
CH
)
Mounting Temperature
(30 Seconds)
Storage Temperature
Recommended Operating Conditions
Parameter
Drain Voltage (V
D
)
Drain Quiescent Current (I
DQ
)
Peak Drain Current ( I
D
)
Gate Voltage (V
G
)
Channel Temperature (T
CH
)
Power Dissipation, CW (P
D
)
Power Dissipation, Pulse (P
D
)
Value
100 V
-7 to 0 V
4.5 A
-7.5 to 12 mA
40 W
38.75 dBm
275 °
C
320 °
C
-40 to 150 °
C
Value
32 V (Typ.)
150 mA (Typ.)
1900 mA (Typ.)
-2.9 V (Typ.)
225 ° (Max)
C
28 W (Max)
46 W (Max)
Electrical specifications are measured at specified test conditions.
Specifications are not guaranteed over all recommended
operating conditions.
Operation of this device outside the parameter ranges
given above may cause permanent damage. These are
stress ratings only, and functional operation of the device
at these conditions is not implied.
RF Characterization – Load Pull Performance at 1.0 GHz
(1)
Test conditions unless otherwise noted: T
A
= 25 ° V
D
= 32 V, I
DQ
= 150 mA
C,
Symbol Parameter
G
LIN
P
3dB
DE
3dB
PAE
3dB
G
3dB
Linear Gain
Output Power at 3 dB Gain Compression
Drain Efficiency at 3 dB Gain Compression
Power-Added Efficiency at 3 dB Gain
CompressionCompression
Gain at 3 dB
Min
Typical
21.6
27.0
51.0
50.0
18.6
Max
Units
dB
W
%
%
dB
Notes:
1. V
DS
= 32 V, I
DQ
= 150 mA; Pulse: 100µs, 20%
RF Characterization – Load Pull Performance at 3.5 GHz
(1)
Test conditions unless otherwise noted: T
A
= 25 ° V
D
= 32 V, I
DQ
= 150 mA
C,
Symbol Parameter
G
LIN
P
3dB
DE
3dB
PAE
3dB
G
3dB
Linear Gain
Output Power at 3 dB Gain Compression
Drain Efficiency at 3 dB Gain Compression
Power-Added Efficiency at 3 dB Gain
CompressionCompression
Gain at 3 dB
Min
Typical
17.7
31.0
59.7
57.6
14.7
Max
Units
dB
W
%
%
dB
Notes:
1. V
DS
= 32 V, I
DQ
= 150 mA; Pulse: 100µs, 20%
Datasheet: Rev - 12-30-13
© 2013 TriQuint
- 2 of 13 -
Disclaimer: Subject to change without notice
www.triquint.com
T2G4003532-FL
30W, 32V DC – 3.5 GHz, GaN RF Power Transistor
RF Characterization – Performance at 3.5 GHz
(1, 2)
Test conditions unless otherwise noted: T
A
= 25 ° V
D
= 32 V, I
DQ
= 150 mA
C,
Symbol Parameter
G
LIN
P
3dB
DE
3dB
G
3dB
Linear Gain
Output Power at 3 dB Gain Compression
Drain Efficiency at 3 dB Gain Compression
Gain at 3 dB Compression
Min
16.0
25.0
45.5
13.0
Typical
16.5
28.0
48.8
13.5
Max
Units
dB
W
%
dB
Notes:
1. Performance at 3.5 GHz in the 2.7 to 3.5 GHz Evaluation Board
2. V
DS
= 32 V, I
DQ
= 150 mA; Pulse: 100µs, 20%
RF Characterization – Narrow Band Performance at 3.50 GHz
(1)
Test conditions unless otherwise noted: T
A
= 25 ° V
D
= 32 V, I
DQ
= 150 mA
C,
Symbol Parameter
VSWR
Impedance Mismatch Ruggedness
Notes:
1. V
DS
= 32 V, I
DQ
= 150 mA, CW at P
1dB
Typical
10:1
Datasheet: Rev - 12-30-13
© 2013 TriQuint
- 3 of 13 -
Disclaimer: Subject to change without notice
www.triquint.com
T2G4003532-FL
30W, 32V DC – 3.5 GHz, GaN RF Power Transistor
Thermal and Reliability Information
Parameter
Thermal Resistance (θ
JC
)
Channel Temperature (T
CH
)
Test Conditions
DC at 85 °C Case
Value
4.9
225
Units
ºC/W
°
C
Notes:
Thermal resistance measured to bottom of package, CW.
Median Lifetime
Maximum Channel Temperature
T
BASE
= 85° P
D
= 30 W
C,
Datasheet: Rev - 12-30-13
© 2013 TriQuint
- 4 of 13 -
Disclaimer: Subject to change without notice
www.triquint.com
T2G4003532-FL
30W, 32V DC – 3.5 GHz, GaN RF Power Transistor
Load Pull Smith Charts
(1, 2)
RF performance that the device typically exhibits when placed in the specified impedance environment. The impedances are not
the impedances of the device, they are the impedances presented to the device via an RF circuit or load-pull system. The
impedances listed follow an optimized trajectory to maintain high power and high efficiency.
Notes:
1. Test Conditions: V
DS
= 32 V, I
DQ
= 150 mA
2. Test Signal: Pulse Width = 100 µsec, Duty Cycle = 20%
Datasheet: Rev - 12-30-13
© 2013 TriQuint
- 5 of 13 -
Disclaimer: Subject to change without notice
www.triquint.com
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