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AM28F256A-90JC

产品描述256 Kilobit (32 K x 8-Bit) CMOS 12.0 Volt, Bulk Erase Flash Memory with Embedded Algorithms
产品类别存储    存储   
文件大小225KB,共35页
制造商AMD(超微)
官网地址http://www.amd.com
下载文档 详细参数 全文预览

AM28F256A-90JC概述

256 Kilobit (32 K x 8-Bit) CMOS 12.0 Volt, Bulk Erase Flash Memory with Embedded Algorithms

AM28F256A-90JC规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称AMD(超微)
零件包装代码QFJ
包装说明QCCJ, LDCC32,.5X.6
针数32
Reach Compliance Codeunknow
ECCN代码EAR99
最长访问时间90 ns
其他特性100K WRITE/ERASE CYCLES MIN
命令用户界面YES
数据轮询YES
JESD-30 代码R-PQCC-J32
JESD-609代码e0
内存密度262144 bi
内存集成电路类型FLASH
内存宽度8
功能数量1
端子数量32
字数32768 words
字数代码32000
工作模式ASYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织32KX8
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码QCCJ
封装等效代码LDCC32,.5X.6
封装形状RECTANGULAR
封装形式CHIP CARRIER
并行/串行PARALLEL
峰值回流温度(摄氏度)NOT SPECIFIED
电源5 V
编程电压12 V
认证状态Not Qualified
最大待机电流0.0001 A
最大压摆率0.03 mA
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn/Pb)
端子形式J BEND
端子节距1.27 mm
端子位置QUAD
处于峰值回流温度下的最长时间NOT SPECIFIED
切换位YES
类型NOR TYPE

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FINAL
Am28F256A
256 Kilobit (32 K x 8-Bit)
CMOS 12.0 Volt, Bulk Erase Flash Memory with Embedded Algorithms
DISTINCTIVE CHARACTERISTICS
s
High performance
— Access times as fast as 70 ns
s
CMOS low power consumption
— 30 mA maximum active current
— 100 µA maximum standby current
— No data retention power consumption
s
Compatible with JEDEC-standard byte-wide
32-Pin EPROM pinouts
— 32-pin PDIP
— 32-pin PLCC
— 32-pin TSOP
s
100,000 write/erase cycles minimum
s
Write and erase voltage 12.0 V
±5%
s
Latch-up protected to 100 mA from –1 V to
V
CC
+1 V
s
Embedded Erase Electrical Bulk Chip-Erase
— 1.5 seconds typical chip-erase including
pre-programming
s
Embedded Program
— 14 µs typical byte-program including time-out
— 0.5 second typical chip program
s
Command register architecture for
microprocessor/microcontroller compatible
write interface
s
On-chip address and data latches
s
Advanced CMOS flash memory technology
— Low cost single transistor memory cell
s
Embedded algorithms for completely
self-timed write/erase operations
GENERAL DESCRIPTION
The Am28F256A is a 256 K Flash memory organized
as 32 Kbytes of 8 bits each. AMD’s Flash memories
offer the most cost-effective and reliable read/write
non- volatile random access memory. The Am28F256A
is packaged in 32-pin PDIP, PLCC, and TSOP versions.
It is designed to be reprogrammed and erased in-sys-
tem or in standard EPROM programmers. The
Am28F256A is erased when shipped from the factory.
The standard Am28F256A offers access times as fast
as 70 ns, allowing operation of high-speed micropro-
cessors without wait states. To eliminate bus conten-
tion, the Am28F256A has separate chip enable (CE#)
and output enable (OE#) controls.
AMD’s Flash memories augment EPROM functionality
with in-circuit electrical erasure and programming. The
Am28F256A uses a command register to manage this
functionality, while maintaining a standard JEDEC
Flash Standard 32-pin pinout. The command register
allows for 100% TTL level control inputs and fixed
power supply levels during erase and programming.
AMD’s Flash technology reliably stores memory con-
tents even after 100,000 erase and program cycles.
The AMD cell is designed to optimize the erase and
Publication#
18879
Rev:
C
Amendment/+2
Issue Date:
May 1998
programming mechanisms. In addition, the combina-
tion of advanced tunnel oxide processing and low inter-
nal electr ic fields for erase a nd programmi ng
operations produces reliable cycling. The Am28F256A
uses a 12.0V± 5% V
PP
high voltage input to perform
the erase and programming functions.
The highest degree of latch-up protection is achieved
with AMD’s proprietary non-epi process. Latch-up pro-
tection is provided for stresses up to 100 milliamps on
address and data pins from –1 V to V
CC
+1 V.
Embedded Program
The Am28F256A is byte programmable using the
Embedded Programming algorithm. The Embedded
Programming algorithm does not require the system to
time-out or verify the data programmed. The typical
room temperature programming time of the
Am28F256A is one half second.
Embedded Erase
The entire chip is bulk erased using the Embedded
Erase algorithm. The Embedded Erase algorithm
automatically programs the entire array prior to electrical
erase. The timing and verification of electrical erase are
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