EDO DRAM, 1MX16, 50ns, CMOS, PDSO42
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Infineon(英飞凌) |
| Reach Compliance Code | not_compliant |
| 最长访问时间 | 50 ns |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-PDSO-J42 |
| JESD-609代码 | e0 |
| 内存密度 | 16777216 bit |
| 内存集成电路类型 | EDO DRAM |
| 内存宽度 | 16 |
| 端子数量 | 42 |
| 字数 | 1048576 words |
| 字数代码 | 1000000 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 1MX16 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOJ |
| 封装等效代码 | SOJ42,.44 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 电源 | 3.3 V |
| 认证状态 | Not Qualified |
| 刷新周期 | 4096 |
| 自我刷新 | YES |
| 最大待机电流 | 0.001 A |
| 最大压摆率 | 0.1 mA |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| HYB3116165BSJ-50 | HYB3116165BST-70 | 17JE-13150-2(D8B)A-CG | HYB3116165BST-50 | HYB3116165BST-60 | HYB3116165BSJ-60 | |
|---|---|---|---|---|---|---|
| 描述 | EDO DRAM, 1MX16, 50ns, CMOS, PDSO42 | EDO DRAM, 1MX16, 70ns, CMOS, PDSO44 | 17JE Series Hood Kit | EDO DRAM, 1MX16, 50ns, CMOS, PDSO44 | EDO DRAM, 1MX16, 60ns, CMOS, PDSO44 | EDO DRAM, 1MX16, 60ns, CMOS, PDSO42 |
| 是否Rohs认证 | 不符合 | 不符合 | - | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Infineon(英飞凌) | Infineon(英飞凌) | - | Infineon(英飞凌) | Infineon(英飞凌) | Infineon(英飞凌) |
| Reach Compliance Code | not_compliant | unknown | - | unknown | not_compliant | _compli |
| 最长访问时间 | 50 ns | 70 ns | - | 50 ns | 60 ns | 60 ns |
| I/O 类型 | COMMON | COMMON | - | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-PDSO-J42 | R-PDSO-G44 | - | R-PDSO-G44 | R-PDSO-G44 | R-PDSO-J42 |
| JESD-609代码 | e0 | e0 | - | e0 | e0 | e0 |
| 内存密度 | 16777216 bit | 16777216 bit | - | 16777216 bit | 16777216 bit | 16777216 bi |
| 内存集成电路类型 | EDO DRAM | EDO DRAM | - | EDO DRAM | EDO DRAM | EDO DRAM |
| 内存宽度 | 16 | 16 | - | 16 | 16 | 16 |
| 端子数量 | 42 | 44 | - | 44 | 44 | 42 |
| 字数 | 1048576 words | 1048576 words | - | 1048576 words | 1048576 words | 1048576 words |
| 字数代码 | 1000000 | 1000000 | - | 1000000 | 1000000 | 1000000 |
| 最高工作温度 | 70 °C | 70 °C | - | 70 °C | 70 °C | 70 °C |
| 组织 | 1MX16 | 1MX16 | - | 1MX16 | 1MX16 | 1MX16 |
| 输出特性 | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOJ | TSOP | - | TSOP | TSOP | SOJ |
| 封装等效代码 | SOJ42,.44 | TSOP44/50,.46,32 | - | TSOP44/50,.46,32 | TSOP44/50,.46,32 | SOJ42,.44 |
| 封装形状 | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | - | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE |
| 电源 | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 刷新周期 | 4096 | 4096 | - | 4096 | 4096 | 4096 |
| 自我刷新 | YES | YES | - | YES | YES | YES |
| 最大待机电流 | 0.001 A | 0.001 A | - | 0.001 A | 0.001 A | 0.001 A |
| 最大压摆率 | 0.1 mA | 0.08 mA | - | 0.1 mA | 0.09 mA | 0.09 mA |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | - | YES | YES | YES |
| 技术 | CMOS | CMOS | - | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND | GULL WING | - | GULL WING | GULL WING | J BEND |
| 端子节距 | 1.27 mm | 0.8 mm | - | 0.8 mm | 0.8 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | - | DUAL | DUAL | DUAL |
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