v5.3
SX-A Family FPGAs
u e
™
Leading-Edge Performance
•
•
250 MHz System Performance
350 MHz Internal Performance
•
•
•
•
•
•
•
•
•
•
Specifications
•
•
•
•
12,000 to 108,000 Available System Gates
Up to 360 User-Programmable I/O Pins
Up to 2,012 Dedicated Flip-Flops
0.22
μ
/ 0.25
μ
CMOS Process Technology
Features
•
•
•
•
Hot-Swap Compliant I/Os
Power-Up/Down Friendly (No Sequencing Required
for Supply Voltages)
66 MHz PCI Compliant
Nonvolatile, Single-Chip Solution
Configurable I/O Support for 3.3 V / 5 V PCI, 5 V
TTL, 3.3 V LVTTL, 2.5 V LVCMOS2
2.5 V, 3.3 V, and 5 V Mixed-Voltage Operation with
5 V Input Tolerance and 5 V Drive Strength
Devices Support Multiple Temperature Grades
Configurable Weak-Resistor Pull-Up or Pull-Down
for I/O at Power-Up
Individual Output Slew Rate Control
Up to 100% Resource Utilization and 100% Pin
Locking
Deterministic, User-Controllable Timing
Unique In-System Diagnostic and Verification
Capability with Silicon Explorer II
Boundary-Scan Testing in Compliance with IEEE
Standard 1149.1 (JTAG)
Actel Secure Programming Technology with
FuseLock™ Prevents Reverse Engineering and
Design Theft
Table 1 •
SX-A Product Profile
Device
Capacity
Typical Gates
System Gates
Logic Modules
Combinatorial Cells
Dedicated Flip-Flops
Maximum Flip-Flops
Maximum User I/Os
Global Clocks
Quadrant Clocks
Boundary Scan Testing
3.3 V / 5 V PCI
Input Set-Up (External)
Speed Grades
2
Temperature Grades
Package (by pin count)
PQFP
TQFP
PBGA
FBGA
CQFP
Notes:
1. A maximum of 512 registers is possible if all 512 C cells are used to build an additional 256 registers.
2. All –3 speed grades have been discontinued.
A54SX08A
8,000
12,000
768
512
256
512
1
130
3
0
Yes
Yes
0 ns
–F, Std, –1, –2
C, I, A, M
208
100, 144
–
144
–
A54SX16A
16,000
24,000
1,452
924
528
990
180
3
0
Yes
Yes
0 ns
–F, Std, –1, –2, –3
C, I, A, M
208
100, 144
–
144, 256
–
A54SX32A
32,000
48,000
2,880
1,800
1,080
1,980
249
3
0
Yes
Yes
0 ns
–F, Std, –1, –2, –3
C, I, A, M
208
100, 144, 176
329
144, 256, 484
208, 256
A54SX72A
72,000
108,000
6,036
4,024
2,012
4,024
360
3
4
Yes
Yes
0 ns
–F, Std, –1, –2, –3
C, I, A, M
208
–
–
256, 484
208, 256
February 2007
© 2007 Actel Corporation
i
See the Actel website for the latest version of the datasheet.
SX-A Family FPGAs
Ordering Information
A54SX16A
2
PQ
G
208
Application (Temperature Range)
Blank = Commercial (0 to +70°)
I = Industrial (-40 to +85°C)
A = Automotive (-40 to +125°C)
M = Military (-55 to +125°C)
B = MIL-STD-883 Class B
Package Lead Count
Lead-Free Packaging
Blank = Standard Packaging
G = RoHS Compliant Packaging
Package Type
BG = 1.27 mm Plastic Ball Grid Array
FG = 1.0 mm Fine Pitch Ball Grid Array
PQ = Plastic Quad Flat Pack
TQ = Thin (1.4 mm) Quad Flat Pack
CQ = Ceramic Quad Flat Pack
1
Speed Grade
Blank = Standard Speed
–1 = Approximately 15% Faster than Standard
–2 = Approximately 25% Faster than Standard
–3 = Approximately 35% Faster than Standard
2
–F = Approximately 40% Slower than Standard
Part Number
A54SX08A = 12,000 System Gates
A54SX16A = 24,000 System Gates
A54SX32A = 48,000 System Gates
A54SX72A = 108,000 System Gates
Notes:
1. For more information about the CQFP package options, refer to the
HiRel SX-A datasheet.
2. All –3 speed grades have been discontinued.
Device Resources
User I/Os (Including Clock Buffers)
Device
A54SX08A
A54SX16A
A54SX32A
A54SX72A
208-Pin
PQFP
130
175
174
171
100-Pin
TQFP
81
81
81
–
144-Pin
TQFP
113
113
113
–
176-Pin
TQFP
–
–
147
–
329-Pin
PBGA
–
–
249
–
144-Pin
FBGA
111
111
111
–
256-Pin
FBGA
–
180
203
203
484-Pin
FBGA
–
–
249
360
Notes:
Package Definitions: PQFP = Plastic Quad Flat Pack, TQFP = Thin Quad Flat Pack, PBGA = Plastic Ball Grid Array,
FBGA = Fine Pitch Ball Grid Array
ii
v5.3
SX-A Family FPGAs
Temperature Grade Offering
Package
PQ208
TQ100
TQ144
TQ176
BG329
FG144
FG256
FG484
CQ208
CQ256
Notes:
1.
2.
3.
4.
5.
6.
7.
C = Commercial
I = Industrial
A = Automotive
M = Military
B = MIL-STD-883 Class B
For more information regarding automotive products, refer to the
SX-A Automotive Family FPGAs
datasheet.
For more information regarding Mil-Temp and ceramic packages, refer to the
HiRel SX-A Family FPGAs
datasheet.
C,I,A,M
C,I,A,M
C,I,A,M
A54SX08A
C,I,A,M
C,I,A,M
C,I,A,M
A54SX16A
C,I,A,M
C,I,A,M
C,I,A,M
A54SX32A
C,I,A,M
C,I,A,M
C,I,A,M
C,I,M
C,I,M
C,I,A,M
C,I,A,M
C,I,M
C,M,B
C,M,B
C,I,A,M
C,I,A,M
C,M,B
C,M,B
A54SX72A
C,I,A,M
Speed Grade and Temperature Grade Matrix
F
Commercial
Industrial
Automotive
Military
MIL-STD-883B
Notes:
1. For more information regarding automotive products, refer to the
SX-A Automotive Family FPGAs
datasheet.
2. For more information regarding Mil-Temp and ceramic packages, refer to the
HiRel SX-A Family FPGAs
datasheet.
✓
Std
✓
✓
✓
✓
✓
✓
✓
–1
✓
✓
–2
✓
✓
–3
Discontinued
Discontinued
Contact your Actel Sales representative for more information on availability.
v5.3
iii
SX-A Family FPGAs
Table of Contents
General Description
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
SX-A Family Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
Other Architectural Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-7
Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-13
Related Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-14
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-15
Detailed Specifications
Operating Conditions
Electrical Specifications
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
Typical SX-A Standby Current
PCI Compliance for the SX-A Family . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3
Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-11
SX-A Timing Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-14
Sample Path Calculations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-14
Output Buffer Delays . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-15
AC Test Loads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-15
Input Buffer Delays . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-16
C-Cell Delays . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-16
Cell Timing Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-16
Timing Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-17
Temperature and Voltage Derating Factors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-17
Timing Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-18
Package Pin Assignments
208-Pin PQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
100-Pin TQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5
144-Pin TQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-8
176-Pin TQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-11
329-Pin PBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-14
144-Pin FBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-18
256-Pin FBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-21
484-Pin FBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-26
Datasheet Information
List of Changes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
Datasheet Categories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3
International Traffic in Arms Regulations (ITAR) and Export Administration
Regulations (EAR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3
iv
v5.3
SX-A Family FPGAs
General Description
Introduction
The Actel SX-A family of FPGAs offers a cost-effective,
single-chip solution for low-power, high-performance
designs. Fabricated on 0.22
μm
/ 0.25
μm
CMOS
antifuse technology and with the support of 2.5 V,
3.3 V and 5 V I/Os, the SX-A is a versatile platform to
integrate designs while significantly reducing time-
to-market.
SX-A Family Architecture
The SX-A family’s device architecture provides a unique
approach to module organization and chip routing that
satisfies performance requirements and delivers the most
optimal register/logic mix for a wide variety of
applications.
Interconnection between these logic modules is achieved
using Actel’s patented metal-to-metal programmable
antifuse interconnect elements (Figure
1-1).
The
antifuses are normally open circuit and, when
programmed, form a permanent low-impedance
connection.
Routing Tracks
Amorphous Silicon/
Dielectric Antifuse
Metal 4
Tungsten Plug Via
Metal 3
Tungsten Plug Via
Metal 2
Metal 1
Tungsten Plug Contact
Silicon Substrate
Note:
The A54SX72A device has four layers of metal with the antifuse between Metal 3 and Metal 4. The A54SX08A, A54SX16A, and
A54SX32A devices have three layers of metal with the antifuse between Metal 2 and Metal 3.
Figure 1-1 •
SX-A Family Interconnect Elements
v5.3
1-1
Microchip MCU
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