(Note 2) .................................................. –55°C to 150°C
Storage Temperature Range ................. –65°C to 150°C
Lead Temperature (Soldering, 10 sec)................... 300°C
13
GND
MSE PACKAGE
12-LEAD PLASTIC MSOP
T
JMAX
= 150°C,
θ
JA
= 40°C/W
EXPOSED PAD (PIN 13) IS GND, MUST BE SOLDERED TO PCB
orDer inForMaTion
LEAD FREE FINISH
LTC3261EMSE#PBF
LTC3261IMSE#PBF
LTC3261HMSE#PBF
LTC3261MPMSE#PBF
TAPE AND REEL
LTC3261EMSE#TRPBF
LTC3261IMSE#TRPBF
LTC3261HMSE#TRPBF
LTC3261MPMSE#TRPBF
PART MARKING*
3261
3261
3261
3261
PACKAGE DESCRIPTION
12-Lead Plastic MSOP
12-Lead Plastic MSOP
12-Lead Plastic MSOP
12-Lead Plastic MSOP
TEMPERATURE RANGE
–40°C to 125°C
–40°C to 125°C
–40°C to 150°C
–55°C to 150°C
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
Consult LTC Marketing for information on non-standard lead based finish parts.
For more information on lead free part marking, go to:
http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to:
http://www.linear.com/tapeandreel/
3261fb
2
For more information
www.linear.com/3261
LTC3261
elecTrical characTerisTics
SYMBOL
Charge Pump
V
IN
V
UVLO
I
VIN
V
RT
V
OUT
f
OSC
R
OUT
I
SHORT_CKT
V
MODE(H)
V
MODE(L)
I
MODE
V
EN(H)
V
EN(L)
I
EN
Input Voltage Range
V
IN
Undervoltage Lockout Threshold
V
IN
Quiescent Current
RT Regulation Voltage
V
OUT
Regulation Voltage
Oscillator Frequency
Charge Pump Output Impedance
Max I
VOUT
Short-Circuit Current
MODE Threshold Rising
MODE Threshold Falling
MODE Pin Internal Pull-Down Current
EN Threshold Rising
EN Threshold Falling
EN Pin Internal Pull-Down Current
V
IN
= EN = 32V
V
IN
= MODE = 32V
l
l
l
The
l
denotes the specifications which apply over the specified operating
junction temperature range, otherwise specifications are at T
A
= 25°C (Note 2). V
IN
= EN = 12V, MODE = 0V, RT = 200kΩ.
PARAMETER
CONDITIONS
MIN
4.5
3.4
3.8
3.6
2
60
3.5
1.200
MODE = 12V
MODE = 0V
RT = GND
MODE = 0V, RT = GND
V
OUT
= GND, RT = GND
l
l
l
TYP
MAX
32
4
5
120
5.5
UNITS
V
V
V
µA
µA
mA
V
V
V
V
IN
Rising
V
IN
Falling
Shutdown, = EN = 0V
MODE = V
IN
, I
VOUT
= 0mA
MODE = 0V, I
VOUT
= 0mA
l
l
–0.94 • V
IN
–V
IN
450
100
0.4
500
32
160
1.1
1.0
0.7
1.1
0.4
1.0
0.7
2
250
2
550
KHz
Ω
mA
V
V
µA
V
V
µA
Note 1:
Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2:
The LTC3261 is tested under pulsed load conditions such that
T
J
≈ T
A
. The LTC3261E is guaranteed to meet specifications from
0°C to 85°C junction temperature. Specifications over the –40°C to
125°C operating junction temperature range are assured by design,
characterization and correlation with statistical process controls. The
LTC3261I is guaranteed over the –40°C to 125°C operating junction
temperature range, the LTC3261H is guaranteed over the –40°C to 150°C
operating junction temperature range and the LTC3261MP is tested and
guaranteed over the full –55°C to 150°C operating junction temperature
range. High junction temperatures degrade operating lifetimes; operating
lifetime is derated for junction temperatures greater than 125°C. Note that
the maximum ambient temperature consistent with these specifications
is determined by specific operating conditions in conjunction with board
layout, the rated package thermal impedance and other environmental
factors.
The junction temperature (T
J
, in °C) is calculated from the ambient
temperature (T
A
, in °C) and power dissipation (P
D
, in Watts) according to
the formula:
T
J
= T
A
+ (P
D
•
θ
JA
),
where
θ
JA
= 40°C/W is the package thermal impedance.
Note 3:
This IC includes overtemperature protection that is intended
to protect the device during momentary overload conditions. Junction
temperatures will exceed 150°C when overtemperature protection is
active. Continuous operation above the specified maximum operating
junction temperature may result in device degradation or failure.