AN626
Application note
Serial EEPROM product numbering
Introduction
This application note provides a detailed description of the part numbering scheme of Serial
EEPROM products.
The part numbering scheme consists of a maximum of 13 digits grouped into nine fields (A
to H) as shown in
Table 1.
Fields A to C represent the product identifiers and fields D to H the product options. The “-”
character is used to separate the identifiers from the options.
Table 1. Serial EEPROM part numbering scheme
Digit
1st
2nd
3rd
4th
5th
6th
7th
8th
9th
10th
11th
12th
13th
14th
-
D
E
F
G
H
/J
Dash, to separate the product number identifiers from the product option designators
Operating range (V
CC
)
Package type
Device grade (Temperature range)
Option
Plating technology
Die process
C
Device function (Memory capacity)
Field
A
B
Product line (“M” = memory)
Device type (Product family)
Use
An additional “/” followed by two digits are used by ST to aid traceability, and might appear
on some documents at the bottom of the Ordering information scheme table under
Process.
This information offers the die and technology references (for temperature range 3 devices)
and can be ignored for temperature range 6 devices.
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AN626
Table 2. Field A, 1
st
character, product line
Product line code
M
Product line type
Memory
Table 3. Field B, 2
nd
and 3
rd
characters, product family
Family code
93
24
95
33
34
35
Application-specific memory
Non-volatile memory
Non-volatile memory
Memory type
MICROWIRE
I
2
C
SPI
MICROWIRE
I
2
C
SPI
Family
Table 4. Field C, 4
th
, 5
th
and 6
th
characters, memory capacity
Capacity
1 Kb
2 Kb
4 Kb
8 Kb
16 Kb
32 Kb
64 Kb
128 Kb
256 Kb
512 Kb
1 Mb
2 Mb
Microwire (M93)
C46
C56
C66
C76
C86
-
-
-
-
-
-
-
I²C (M24)
C01
C02
C04
C08
C16
C32
C64
128-B
256-B
512
M01
M02
SPI (M95)
010
020
040
080
160
320
640
128
256
512
M01
M02
Table 5. Field D, 8
th
character, V
CC
range
Voltage range code
Blank
W
R
F
X
Serial EEPROMs
Memory
Voltage range
4.5 V to 5.5 V
2.5 V to 5.5 V
1.8 V to 5.5 V
1.7 V to 5.5 V
1.6 V to 5.5 V
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Table 6. Field E, 9
th
and 10
th
characters, package (two letters used in every case)
Package code
BN
CS, CU
CT
DW
MN
MC or MF
MH
PSDIP8 standard
WLCSP (Chip scale package)
Thin WLCSP (Chip scale package)
TSSOP8
SO8 narrow 0.150 mils
UFDFPN8 (MLP8)
UFDFPN5 (MLP5)
Package type
Table 7. Field F, 11
th
character, temperature range
Device grade
1
3
6
8
0 °C to 70 °C
–40 °C to +125 °C, with a certified reliability flow tailored for automotive applications
–40 °C to +85 °C
–40 °C to +105 °C
Temperature range
Table 8. Field G, 12
th
, packing option
Option code
Blank
T
Standard packing
Tape and reel packing
Option
Table 9. Field H, 13
th
, plating technology
Code
P or G
TF
Plating technology
ECOPACK
®
(RoHS compliant)
Back side coating (for WLCSP packages)
Table 10. Field J, 14
th
, die process
Code
G or S
B or P
A
K or T
F6SP
F6DP
F8L
F8H
Plating technology
For complete details of the correct product number, and ordering codes, for a specific
product, please contact your nearest ST sales office or distributor.
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Revision history
AN626
Revision history
Table 11. Document revision history
Date
June-1998
22-Nov-2004
25-Apr-2008
Revision
1.0
2.0
3
First Issue.
15th digit concerning Plating option added in
Table 1: Serial
EEPROM part numbering scheme.
Tables
3,
5,
5, 6
updated and
Table 9: Field H, 13
th
, plating technology
added.
Document reformatted. All tables updated.
Table 1: Serial EEPROM part numbering scheme, Table 4: Field C,
4
th
, 5
th
and 6
th
characters, memory capacity,
and
Table 6: Field E,
9
th
and 10
th
characters, package (two letters used in every case)
updated.
Table 10: Field J, 14
th
, die process
added.
Added Voltage range code ‘X’ in
Table 5: Field D, 8
th
character, VCC
range
Updated packaged codes list in
Table 6: Field E, 9
th
and 10
th
characters, package (two letters used in every case).
Added die process code ‘T’ in
Table 10: Field J, 14
th
, die process.
Added package code CU in
Table 6: Field E, 9
th
and 10
th
characters,
package (two letters used in every case).
Added temperature range 8 in
Table 7: Field F, 11
th
character,
temperature range.
Added plating technology TF in
Table 9: Field H, 13
th
, plating
technology.
Changes
19-Jul-2010
4
15-Jul-2013
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improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on
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acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or
the design of Purchasers’ products.
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Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
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