电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

IDT72V51556L7-5BB8

产品描述FIFO, 64KX36, 4ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256
产品类别存储    存储   
文件大小545KB,共58页
制造商IDT (Integrated Device Technology)
下载文档 详细参数 选型对比 全文预览

IDT72V51556L7-5BB8概述

FIFO, 64KX36, 4ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256

IDT72V51556L7-5BB8规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称IDT (Integrated Device Technology)
零件包装代码BGA
包装说明BGA, BGA256,16X16,40
针数256
Reach Compliance Codenot_compliant
ECCN代码EAR99
最长访问时间4 ns
其他特性ALTERNATIVE MEMORY WIDTH:9-BIT AND 18-BIT
最大时钟频率 (fCLK)133 MHz
周期时间7.5 ns
JESD-30 代码S-PBGA-B256
JESD-609代码e0
长度17 mm
内存密度2359296 bit
内存集成电路类型OTHER FIFO
内存宽度36
湿度敏感等级3
功能数量1
端子数量256
字数65536 words
字数代码64000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织64KX36
可输出YES
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装等效代码BGA256,16X16,40
封装形状SQUARE
封装形式GRID ARRAY
并行/串行PARALLEL
峰值回流温度(摄氏度)225
电源3.3 V
认证状态Not Qualified
座面最大高度3.5 mm
最大待机电流0.01 A
最大压摆率0.1 mA
最大供电电压 (Vsup)3.45 V
最小供电电压 (Vsup)3.15 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn63Pb37)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间20
宽度17 mm

文档预览

下载PDF文档
3.3V MULTI-QUEUE FLOW-CONTROL DEVICES
(32 QUEUES) 36 BIT WIDE CONFIGURATION
1,179,648 bits
2,359,296 bits
IDT72V51546
IDT72V51556
FEATURES:
Choose from among the following memory density options:
IDT72V51546
Total Available Memory = 1,179,648 bits
IDT72V51556
Total Available Memory = 2,359,296 bits
Configurable from 1 to 32 Queues
Queues may be configured at master reset from the pool of
Total Available Memory in blocks of 256 x 36
Independent Read and Write access per queue
User programmable via serial port
Default multi-queue device configurations
– IDT72V51546 : 1,024 x 36 x 32Q
– IDT72V51556 : 2,048 x 36 x 32Q
100% Bus Utilization, Read and Write on every clock cycle
166 MHz High speed operation (6ns cycle time)
3.7ns access time
Individual, Active queue flags (OV,
FF, PAE, PAF, PR)
8 bit parallel flag status on both read and write ports
Shows
PAE
and
PAF
status of 8 Queues
Direct or polled operation of flag status bus
Global Bus Matching - (All Queues have same Input Bus Width
and Output Bus Width)
User Selectable Bus Matching Options:
– x36in to x36out
– x18in to x36out
– x9in to x36out
– x36in to x18out
– x36in to x9out
FWFT mode of operation on read port
Packet mode operation
Partial Reset, clears data in single Queue
Expansion of up to 8 multi-queue devices in parallel is available
JTAG Functionality (Boundary Scan)
Available in a 256-pin PBGA, 1mm pitch, 17mm x 17mm
HIGH Performance submicron CMOS technology
Industrial temperature range (-40°C to +85°C) is available
FUNCTIONAL BLOCK DIAGRAM
MULTI-QUEUE FLOW-CONTROL DEVICE
Q
0
FSTR
WRADD
WEN
WCLK
8
READ CONTROL
WADEN
RADEN
ESTR
8
WRITE CONTROL
Q
1
RDADD
REN
RCLK
OE
Q
2
Din
Qout
x36
DATA
OUT
WRITE FLAGS
READ FLAGS
OV
PR
PAE
8
x36
DATA IN
FF
PAF
PAFn
8
Q
31
PAEn/PRn
5904 drw01
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
1
2003
Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
JUNE 2003
DSC-5904/8

IDT72V51556L7-5BB8相似产品对比

IDT72V51556L7-5BB8 IDT72V51546L7-5BB8 IDT72V51546L6BB8 IDT72V51556L7-5BB IDT72V51556L6BB8
描述 FIFO, 64KX36, 4ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 FIFO, 32KX36, 4ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 FIFO, 32KX36, 3.7ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 FIFO, 64KX36, 4ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 FIFO, 64KX36, 3.7ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256
是否Rohs认证 不符合 不符合 不符合 不符合 不符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 BGA BGA BGA BGA BGA
包装说明 BGA, BGA256,16X16,40 BGA, BGA256,16X16,40 BGA, BGA256,16X16,40 BGA, BGA256,16X16,40 BGA, BGA256,16X16,40
针数 256 256 256 256 256
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99
最长访问时间 4 ns 4 ns 3.7 ns 4 ns 3.7 ns
其他特性 ALTERNATIVE MEMORY WIDTH:9-BIT AND 18-BIT ALTERNATIVE MEMORY WIDTH:9-BIT AND 18-BIT ALTERNATIVE MEMORY WIDTH:9-BIT AND 18-BIT ALTERNATIVE MEMORY WIDTH:9-BIT AND 18-BIT ALTERNATIVE MEMORY WIDTH:9-BIT AND 18-BIT
最大时钟频率 (fCLK) 133 MHz 133 MHz 166 MHz 133 MHz 166 MHz
周期时间 7.5 ns 7.5 ns 6 ns 7.5 ns 6 ns
JESD-30 代码 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256
JESD-609代码 e0 e0 e0 e0 e0
长度 17 mm 17 mm 17 mm 17 mm 17 mm
内存密度 2359296 bit 1179648 bit 1179648 bit 2359296 bit 2359296 bit
内存集成电路类型 OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO
内存宽度 36 36 36 36 36
湿度敏感等级 3 3 3 3 3
功能数量 1 1 1 1 1
端子数量 256 256 256 256 256
字数 65536 words 32768 words 32768 words 65536 words 65536 words
字数代码 64000 32000 32000 64000 64000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 70 °C 70 °C 70 °C 70 °C 70 °C
组织 64KX36 32KX36 32KX36 64KX36 64KX36
可输出 YES YES YES YES YES
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA BGA BGA BGA BGA
封装等效代码 BGA256,16X16,40 BGA256,16X16,40 BGA256,16X16,40 BGA256,16X16,40 BGA256,16X16,40
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) 225 225 225 225 225
电源 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 3.5 mm 3.5 mm 3.5 mm 3.5 mm 3.5 mm
最大待机电流 0.01 A 0.01 A 0.01 A 0.01 A 0.01 A
最大压摆率 0.1 mA 0.1 mA 0.1 mA 0.1 mA 0.1 mA
最大供电电压 (Vsup) 3.45 V 3.45 V 3.45 V 3.45 V 3.45 V
最小供电电压 (Vsup) 3.15 V 3.15 V 3.15 V 3.15 V 3.15 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子面层 Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37)
端子形式 BALL BALL BALL BALL BALL
端子节距 1 mm 1 mm 1 mm 1 mm 1 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
处于峰值回流温度下的最长时间 20 20 20 20 20
宽度 17 mm 17 mm 17 mm 17 mm 17 mm
诚招 仿真工程师(软件)年薪:20-50万 | 经验:5年以上 | 工作地:深圳市
岗位职责: 1.负责OBC+DCDC控制算法研究与验证; 2.负责电源产品控制参数的性能指标分析; 3.负责研究行业标准、前沿技术; 4.负责新拓扑、新算法的预研,推进仿真系统提升; 5.负责HIL ......
ViviWong 求职招聘
ADC库函数问题
在driverlib中的adc.c里,ADCProcessorTrigger函数通过写寄存器ADC_PSSI来触发采样: HWREG(ui32Base + ADC_O_PSSI) |= ((ui32SequenceNum & 0xffff0000) | ......
MOAI 微控制器 MCU
还是那个串口(碰到的问题真多)
串口能够写入,返回写入的数据也不为0。进入读线程函数后,WaitCommEvent却没反应。我真要晕了,模拟器是不是很不稳定,有时同一个程序在不同时间运行出现不同的问题。让我彻底无语...下面是读 ......
dai_weis 嵌入式系统
瑞萨R7F0C80212 DIY活动网友设计心得大汇总
.t_table td { border: 2px solid black; overflow: hidden; padding: 4px; } 瑞萨DIY活动结束啦,将这段时间网友们写的帖子以作者形式给大家做个集合。帖子置顶 ......
nmg 瑞萨MCU/MPU
关于信号源如何输出最小值大于0的波形(驱动开关管)问题
真正的信号源要如何生成电压最小值大于0的信号?我想输出一个最小值为1V最大值为5V的方波信号...
jdzwanghao 电源技术

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1769  843  428  607  2693  42  7  1  10  46 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved