RU20120L
N-Channel Advanced Power MOSFET
Features
• 20V/120A,
R
DS (ON)
=2.3mΩ(Typ.)@V
GS
=10V
R
DS (ON)
=4.2mΩ(Typ.)@V
GS
=4.5V
Pin Description
• Super High Dense Cell Design
• Reliable and Rugged
• 100% avalanche tested
• 175°C Operating Temperature
• Lead Free and Green Devices Available (RoHS Compliant)
TO252
Applications
• Power Management
• DC-DC Converters
N-Channel MOSFET
Absolute Maximum Ratings
Symbol
Parameter
Rating
Unit
Common Ratings
(T
C
=25°C Unless Otherwise Noted)
V
DSS
V
GSS
T
J
T
STG
I
S
Drain-Source Voltage
Gate-Source Voltage
Maximum Junction Temperature
Storage Temperature Range
Diode Continuous Forward Current
T
C
=25°C
20
V
±20
175
-55 to 175
120
°C
°C
A
Mounted on Large Heat Sink
I
DP
I
D
①
300μs Pulse Drain Current Tested
Continuous Drain Current(V
GS
=10V)
T
C
=25°C
T
C
=25°C
T
C
=100°C
480
120
A
A
②
93
103
W
52
1.45
100
°C/W
°C/W
P
D
R
θJC
R
θJA
Maximum Power Dissipation
Thermal Resistance-Junction to Case
Thermal Resistance-Junction to Ambient
T
C
=25°C
T
C
=100°C
Drain-Source Avalanche Ratings
E
AS
③
Avalanche Energy, Single Pulsed
64
mJ
Ruichips Semiconductor Co., Ltd
Rev. A– DEC., 2012
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RU20120L
Electrical Characteristics
(T
C
=25°C Unless Otherwise Noted)
RU20120L
Symbol
Static Characteristics
BV
DSS
I
DSS
V
GS(th)
I
GSS
R
DS(ON)
④
Parameter
Test Condition
Min.
Typ.
Max.
Unit
Drain-Source Breakdown Voltage V
GS
=0V, I
DS
=250µA
Zero Gate Voltage Drain Current
Gate Threshold Voltage
Gate Leakage Current
Drain-Source On-state Resistance
V
DS
=20V, V
GS
=0V
T
J
=125°C
V
DS
=V
GS
, I
DS
=250µA
V
GS
=±20V, V
DS
=0V
V
GS
=10V, I
DS
=60A
V
GS
=4.5V, I
DS
=40A
20
1
30
1
2.5
±100
2.3
4.2
2.8
5
V
µA
V
nA
mΩ
mΩ
Diode Characteristics
V
SD
t
rr
Q
rr
④
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
⑤
I
SD
=60A, V
GS
=0V
I
SD
=60A, dl
SD
/dt=100A/µs
75
140
1.2
V
ns
nC
Dynamic Characteristics
R
G
C
iss
C
oss
C
rss
t
d(ON)
t
r
t
d(OFF)
t
f
Gate Resistance
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Turn-on Delay Time
Turn-on Rise Time
Turn-off Delay Time
Turn-off Fall Time
⑤
V
GS
=0V,V
DS
=0V,F=1MHz
V
GS
=0V,
V
DS
=10V,
Frequency=1.0MHz
1.5
2750
520
280
10
Ω
pF
V
DD
=10V, R
L
=0.15Ω,
I
DS
=60A, V
GEN
=10V,
R
G
=6Ω
26
22
15
ns
Gate Charge Characteristics
Q
g
Q
gs
Q
gd
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
V
DS
=16V, V
GS
=10V,
I
DS
=60A
28
7
9
nC
Notes:
①Pulse
width limited by safe operating area.
②Calculated
continuous current based on maximum allowable junction temperature. The package
limitation current is 60A.
③Limited
by T
Jmax
, I
AS
=16A, V
DD
= 12V, R
G
= 50Ω , Starting T
J
= 25°C.
④Pulse
test;Pulse width≤300µs, duty cycle≤2%.
⑤Guaranteed
by design, not subject to production testing.
Ruichips Semiconductor Co., Ltd
Rev. A– DEC., 2012
2
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℃
RU20120L
Ordering and Marking Information
Device
RU20120L
Marking
RU20120L
Package
TO252
Packaging Quantity Reel Size Tape width
Tape&Reel
2500
13''
16mm
Ruichips Semiconductor Co., Ltd
Rev. A– DEC., 2012
3
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℃
RU20120L
Typical Characteristics
120
100
80
60
40
20
0
0
25
50
75
100
125
150
175
Power Dissipation
140
120
Drain Current
P
D
- Power (W)
I
D
- Drain Current (A)
100
80
60
40
20
VGS=10V
0
25
50
75
100
125
150
175
T
J
- Junction Temperature (°C)
R
DS(ON)
- On - Resistance (mΩ)
T
J
- Junction Temperature (°C)
1000
Safe Operation Area
R
DS(ON)
limited
Drain Current
10
Ids=60A
8
I
D
- Drain Current (A)
100
10
DC
1
10µs
100µs
1ms
10ms
6
4
0.1
2
0.01
0.01
T
C
=25°C
0.1
1
10
100
1000
0
0
1
2
3
4
5
6
7
8
9
10
V
DS
- Drain-Source Voltage (V)
V
GS
- Gate-Source Voltage (V)
Thermal Transient Impedance
ZthJC - Thermal Response (°C/W)
10
Duty=0.5, 0.2, 0.1, 0.05, 0.02, 0.01, Single Pulse
1
0.1
Single Pulse
0.01
R
θJC
=
1.45°C/W
0.001
1E-05
0.0001
0.001
0.01
0.1
1
10
Square Wave Pulse Duration (sec)
Ruichips Semiconductor Co., Ltd
Rev. A– DEC., 2012
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℃
RU20120L
Typical Characteristics
300
Output Characteristics
10
Drain-Source On Resistance
I
D
- Drain Current (A)
250
200
150
10V
4.5V
R
DS(ON)
- On Resistance (mΩ)
8
6
4.5V
4
3V
100
50
0
0
1
2
3
4
5
2
1V
10V
0
0
50
100
150
V
DS
- Drain-Source Voltage (V)
2.5
I
D
- Drain Current (A)
100
Drain-Source On Resistance
V
GS
=10V
I
D
=60A
Source-Drain Diode Forward
Normalized On Resistance
I
S
- Source Current (A)
2.0
10
T
J
=175°C
1.5
1.0
1
T
J
=25°C
0.5
T
J
=25°C
Rds(on)=2.3mΩ
0.0
-50
-25
0
25
50
75
100
125
150
175
0.1
0.2
0.4
0.6
0.8
1
1.2
1.4
T
J
- Junction Temperature (°C)
V
SD
- Source-Drain Voltage (V)
Capacitance
V
GS
- Gate-Source Voltage (V)
4000
10
9
8
7
6
5
4
3
2
1
0
0
Gate Charge
VDS=16V
IDS=60A
C - Capacitance (pF)
3500
3000
2500
Frequency=1.0MHz
Ciss
2000
1500
1000
500
0
1
Coss
Crss
10
100
V
DS
- Drain-Source Voltage (V)
10
20
30
Q
G
- Gate Charge (nC)
Ruichips Semiconductor Co., Ltd
Rev. A– DEC., 2012
5
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