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SI7157DP

产品描述P-Channel 20-V (D-S) MOSFET
文件大小331KB,共14页
制造商Vishay(威世)
官网地址http://www.vishay.com
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SI7157DP概述

P-Channel 20-V (D-S) MOSFET

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Si7157DP
Vishay Siliconix
P-Channel 20-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
V
DS
(V)
R
DS(on)
() Max.
0.0016 at V
GS
= - 10 V
- 20
0.0020 at V
GS
= - 4.5 V
0.0032 at V
GS
= - 2.5 V
I
D
(A)
- 60
d
- 60
d
- 60
d
202.5 nC
Q
g
(Typ.)
• TrenchFET
®
Gen III P-Channel Power MOSFET
• 100 % R
g
and UIS Tested
• Material categorization:
For definitions of compliance please see
www.vishay.com/doc?99912
PowerPAK
®
SO-8
APPLICATIONS
For Mobile Computing
S
6.15 mm
S
1
2
3
S
S
5.15 mm
G
4
- Adaptor Switch
- Battery Switch
- Load Switch
- Power Management
G
D
8
7
6
5
D
D
D
D
Bottom View
P-Channel MOSFET
Ordering Information:
Si7157DP-T1-GE3 (Lead (Pb)-free and Halogen-free)
ABSOLUTE MAXIMUM RATINGS
(T
A
= 25 °C, unless otherwise noted)
Parameter
Drain-Source Voltage
Gate-Source Voltage
T
C
= 25 °C
T
C
= 70 °C
T
A
= 25 °C
T
A
= 70 °C
T
C
= 25 °C
T
A
= 25 °C
L = 0.1 mH
T
C
= 25 °C
T
C
= 70 °C
T
A
= 25 °C
T
A
= 70 °C
Symbol
V
DS
V
GS
I
D
I
DM
I
S
I
AS
E
AS
P
D
T
J
, T
stg
Limit
- 20
± 12
- 60
d
- 60
d
- 46.5
a, b
- 37.2
a, b
- 300
- 60
d
- 5.6
a, b
- 35
61.25
104
66.6
6.25
a, b
4
a, b
- 55 to 150
260
Unit
V
Continuous Drain Current (T
J
= 150 °C)
Pulsed Drain Current (t
p
= 100 µs)
Continuous Source-Drain Diode Current
Avalanche Current
Single-Pulse Avalanche Energy
A
mJ
Maximum Power Dissipation
W
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
e, f
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambient
a, c
Maximum Junction-to-Case
t
10
s
Steady State
Symbol
R
thJA
R
thJC
Typical
15
0.9
Maximum
20
1.2
Unit
°C/W
Notes:
a. Surface mounted on 1" x 1" FR4 board.
b. t = 10 s.
c. Maximum under steady state conditions is 54 °C/W.
d. Package limited.
e. See solder profile
(www.vishay.com/doc?73257).
The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
f. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
Document Number: 62860
S13-1665-Rev. A, 29-Jul-13
For technical questions, contact:
pmostechsupport@vishay.com
www.vishay.com
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000

 
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