电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

RVC2047R0JTP

产品描述RESISTOR, METAL GLAZE/THICK FILM, 0.125 W, 5 %, 200 ppm, 47 ohm, SURFACE MOUNT, 0805, CHIP
产品类别无源元件    电阻器   
文件大小72KB,共2页
制造商Kamaya
标准
下载文档 详细参数 选型对比 全文预览

RVC2047R0JTP概述

RESISTOR, METAL GLAZE/THICK FILM, 0.125 W, 5 %, 200 ppm, 47 ohm, SURFACE MOUNT, 0805, CHIP

RVC2047R0JTP规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称Kamaya
包装说明, 0805
Reach Compliance Codecompliant
ECCN代码EAR99
JESD-609代码e3
制造商序列号RVC
安装特点SURFACE MOUNT
端子数量2
最高工作温度125 °C
最低工作温度-55 °C
封装形状RECTANGULAR PACKAGE
包装方法TR, PAPER, 7 INCH
额定功率耗散 (P)0.125 W
额定温度70 °C
电阻47 Ω
电阻器类型FIXED RESISTOR
尺寸代码0805
表面贴装YES
技术METAL GLAZE/THICK FILM
温度系数200 ppm/°C
端子面层Tin (Sn)
端子形状WRAPAROUND
容差5%
工作电压300 V

RVC2047R0JTP文档预览

FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE & HIGH VOLTAGE
KAMAYA OHM
RVC
Features
Chip Resistors
1. Higher Limiting Element Voltage compared with RMC series.
2. Stability Class : 5%
Dimensions
L
W
c
c
Rated resistance is marked with 3-digit (E24 series)
or 4-digit (E96 series) on the over coating.
RVC16 4-digit marking is not available.
d
d
Unit : mm
Style
RVC16
RVC20
RVC32
RVC50
RVC63
Metric
1608
2012
3216
5025
6332
Inch
0603
0805
1206
2010
2512
H
1.6
2.0
3.2
5.0
6.3
L
0.1
0.1
0.15
0.15
0.15
W
0.8
1.25
1.6
2.5
3.2
e0.15
0.05
H
0.45
0.55
0.55
0.55
0.55
0.10
0.10
0.10
0.15
0.15
0.3
0.4
0.5
0.6
0.6
0.10
0.15
0.15
0.15
c
0.1
0.2
0.25
0.2
0.2
0.3
0.4
0.5
0.6
0.6
d
0.1
0.2
0.25
0.2
0.2
*Unit weight/pc.
2mg
5mg
9mg
25mg
40mg
*Values for reference
Part Number Description
Example
Style
RVC
32
K
475
F
TP
Product Type
Code
16
20
32
50
63
Size
Metric Inch
1608 0603
2012 0805
3216 1206
5025 2010
6332 2512
Rated Resistance
E24 Series
e.g. : 475=4.7M ohm 3-Digit
E96 Series
e.g. : 7154=7.15M ohm 4-Digit
Temperature Coefficient of Resistance
Standard
K
100
´
10
-6
/
°
C
Tolerance on Rated Resistance
* Packaging & Standard Qty. (Min.)
B
TP
Bulk (Loose Package)
Paper Tape
1,000pcs. All Styles
5,000pcs.
4,000pcs.
RVC16
RVC20
RVC32
RVC50
RVC63
F
G
J
K
1%
2%
5%
10%
TE Embossed Tape
*Refer to Tape and Packaging information on pages 38 and 39.
8
KAMAYA OHM
FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE & HIGH VOLTAGE
RVC
Ratings
Style
RVC16
RVC20
RVC32
RVC50
1608
(0603)
2012
(0805)
3216
(1206)
5025
(2010)
6332
(2512)
0.1
0.125
0.25
0.5
200
300
400
500
K
K
K
K
K
1.0
800
100
200
100
200
100
200
100
200
100
200
500 200
100
100
470
560
470
47
10M
47
10M
47
20M
47
20M
100
47
10M
464
100
97.6
100
97.6
470
464
560
549
97.6
F( 1%)
51M
51M
51M
J(
51M
5%)
K( 10%)
E24series
G( 2%)
E96series
E24series
500
55
125
100
Chip Resistors
Size
Metric
(Inch)
Rated Dissipation Limiting Element Temperature Coefficient Combinations of Rated Resistance Range and Tolerance on Rated Resistance Preferred Number Isolation Category Temperature
of Resistance
at 70
°
C
Voltage
Series for
Voltage
Range
-6
F( 1%) , G( 2%)
J( 5%) , K( 10%)
V
Resistors
V
°
C
W
Code
10 /
C
RVC63
Note1. Rated Voltage = (Rated Dissipation)
´
(Rated Resistance). (d.c. or a.c. r.m.s. Voltage)
Note2. Limiting Element Voltage can only be applied to resistors when the resistance value is equal to or higher than the critical resistance value.
Derating Curve
100
Percentage of the rated dissipation(%)
The derated values of dissipation for temperatures in excess of
70
°
C shall be indicated by the following Curve.
Climatic Category
55/125/56
Lower Category Temperature
Upper Category Temperature
Duration of the Damp heat, Steady-State Test
–55
°
C
+125
°
C
56 days
Area of recommended operation
0
55
0
70
125
Ambient Temperature (
°
C)
Performance Characteristics
Description
Voltage proof
Variation of resistance
with temperature
Overload
Solderability
Resistance to
soldering heat
Rapid change of
temperature
Climatic sequence
Damp test, steady state
Endurance at 70
°
C
Endurance at the upper
category temperature
Adhesion
Bend strength of the
face plating
See Ratings Table
JIS C 5201-1 : 1998
Requirements
Test Methods
Clause 4.7
Clause 4.8
RVC16
RVC20~RVC63
100Va.c.,60s
500Va.c.,60s
No breakdown or flashover
R
³
1G ohm
Measuring temperature :
+
20
°
C/–55
°
C/
+
20
°
C/
+
125
°
C/
+
20
°
C
D
R
£±
(1%
+
0.05 ohm)
No visible damage, legible marking
In accordance with Clause 4.17.4.5
D
R
£±
(1%
+
0.05 ohm)
D
R
£±
(1%
+
0.05 ohm) No visible damage
D
R
£±
(5%
+
0.1 ohm) No visible damage
D
R
£±
(5%
+
0.1 ohm) No visible damage, legible marking
D
R
£±
(5%
+
0.1 ohm) No visible damage
D
R
£±
(5%
+
0.1 ohm) No visible damage
No visible damage
Clause 4.13 The applied voltage shall be 2.5 times of the rated voltage or twice
of the limiting element voltage, whichever is the less severe, 2s.
Clause 4.17 235
°
C, 2s
Clause 4.18 After immersion into the flux, the immersion into solder
shall be carried out in Solder bath at 260
°
C for 5s.
Clause 4.19 5 cycles between
-
55
°
C and
+
125
°
C.
Clause 4.23 Dry/Damp heat(12
+
12h cycle), first cycle./
Cold/Damp heat(12
+
12h cycle), remaining cycle. /D.C.Load.
Clause 4.24 40
°
C, 95%R.H., 56 days, test a) and b) of Clause 4.24.2.1
Clause 4.25.1 Rated voltage, 1.5h"ON", 0.5h"OFF", 70
°
C, 1,000h.
Clause 4.25.3 125
°
C, no-load, 1,000h.
Clause 4.32 5N, 10s
Clause 4.33 RVC16~RVC32 Amount of bend : 3 mm
RVC50, 63
Amount of bend : 1 mm
D
R
£±
(1%
+
0.05 ohm)
9

RVC2047R0JTP相似产品对比

RVC2047R0JTP RVC2047R0KB RVC2047R0JB RVC2047R0KTP RVC20-47R0KB RVC20-47R0JTP RVC20-47R0KTP RVC20-47R0JB
描述 RESISTOR, METAL GLAZE/THICK FILM, 0.125 W, 5 %, 200 ppm, 47 ohm, SURFACE MOUNT, 0805, CHIP RESISTOR, METAL GLAZE/THICK FILM, 0.125 W, 10 %, 200 ppm, 47 ohm, SURFACE MOUNT, 0805, CHIP RESISTOR, METAL GLAZE/THICK FILM, 0.125 W, 5 %, 200 ppm, 47 ohm, SURFACE MOUNT, 0805, CHIP RESISTOR, METAL GLAZE/THICK FILM, 0.125 W, 10 %, 200 ppm, 47 ohm, SURFACE MOUNT, 0805, CHIP Fixed Resistor, Metal Glaze/thick Film, 0.125W, 47ohm, 300V, 10% +/-Tol, 200ppm/Cel, Surface Mount, 0805, CHIP Fixed Resistor, Metal Glaze/thick Film, 0.125W, 47ohm, 300V, 5% +/-Tol, 200ppm/Cel, Surface Mount, 0805, CHIP Fixed Resistor, Metal Glaze/thick Film, 0.125W, 47ohm, 300V, 10% +/-Tol, 200ppm/Cel, Surface Mount, 0805, CHIP Fixed Resistor, Metal Glaze/thick Film, 0.125W, 47ohm, 300V, 5% +/-Tol, 200ppm/Cel, Surface Mount, 0805, CHIP
是否无铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅
是否Rohs认证 符合 符合 符合 符合 符合 符合 符合 符合
厂商名称 Kamaya Kamaya Kamaya Kamaya Kamaya Kamaya Kamaya Kamaya
包装说明 , 0805 , 0805 , 0805 , 0805 , 0805 CHIP CHIP , 0805
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
JESD-609代码 e3 e3 e3 e3 e3 e3 e3 e3
制造商序列号 RVC RVC RVC RVC RVC RVC RVC RVC
安装特点 SURFACE MOUNT SURFACE MOUNT SURFACE MOUNT SURFACE MOUNT SURFACE MOUNT SURFACE MOUNT SURFACE MOUNT SURFACE MOUNT
端子数量 2 2 2 2 2 2 2 2
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
最低工作温度 -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
封装形状 RECTANGULAR PACKAGE RECTANGULAR PACKAGE RECTANGULAR PACKAGE RECTANGULAR PACKAGE RECTANGULAR PACKAGE RECTANGULAR PACKAGE RECTANGULAR PACKAGE RECTANGULAR PACKAGE
包装方法 TR, PAPER, 7 INCH BULK BULK TR, PAPER, 7 INCH BULK TR, PAPER, 7 INCH TR, PAPER, 7 INCH BULK
额定功率耗散 (P) 0.125 W 0.125 W 0.125 W 0.125 W 0.125 W 0.125 W 0.125 W 0.125 W
额定温度 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
电阻 47 Ω 47 Ω 47 Ω 47 Ω 47 Ω 47 Ω 47 Ω 47 Ω
电阻器类型 FIXED RESISTOR FIXED RESISTOR FIXED RESISTOR FIXED RESISTOR FIXED RESISTOR FIXED RESISTOR FIXED RESISTOR FIXED RESISTOR
尺寸代码 0805 0805 0805 0805 0805 0805 0805 0805
表面贴装 YES YES YES YES YES YES YES YES
技术 METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
温度系数 200 ppm/°C 200 ppm/°C 200 ppm/°C 200 ppm/°C 200 ppm/°C 200 ppm/°C 200 ppm/°C 200 ppm/°C
端子面层 Tin (Sn) Tin (Sn) Tin (Sn) Tin (Sn) Tin (Sn) Tin (Sn) Tin (Sn) Tin (Sn)
端子形状 WRAPAROUND WRAPAROUND WRAPAROUND WRAPAROUND WRAPAROUND WRAPAROUND WRAPAROUND WRAPAROUND
容差 5% 10% 5% 10% 10% 5% 10% 5%
工作电压 300 V 300 V 300 V 300 V 300 V 300 V 300 V 300 V
1
本帖最后由 anrui-2021 于 2021-12-22 11:35 编辑 1 ...
anrui-2021 FPGA/CPLD
can通信的测试
本帖最后由 dontium 于 2015-1-23 11:44 编辑 自收发成功; 自收发模式改成了正常模式,即把dsp28_ecan.c中的ECanaShadow.CANMC.bit.STM寄存器由1改为了0; GpioMuxRegs.GPFMUX.bit.CANT ......
morse 模拟与混合信号
MSP430 低功耗设计注意要点
简介:MSP430是超级低功耗单片机的代表产品。他有灵活的时钟系统,多种深度的低功耗模式,以及高度智能化的外设。通过充分应用MSP430的特性和内部模块,可以实现理想的低功耗特性。 http://p ......
德仪MCU天地 微控制器 MCU
EEWORLD大学堂----电源设计小贴士51:了解电容器的寄生效应
电源设计小贴士51:了解电容器的寄生效应:https://training.eeworld.com.cn/course/126...
zhangjianee 电源技术
AFE1230的开发板或评估套件?
在哪能找到AFE1230的开发板、评估套件或参考设计? ...
海天长笑 模拟与混合信号
求各位大侠帮忙,相信这个问题难不倒你们,小弟在此衷心地谢谢各位了!!
:kiss:求各位大侠帮忙,相信这个问题难不倒你们,关于8051单片机设计一个实例的,小弟在此衷心地谢谢各位了!!在Proteus软件中完成所有操作!!!! 本人是初学者,老师布置了一道作业,:titt ......
我想学 51单片机

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1051  1670  771  1512  722  22  34  16  31  15 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved