8-BIT, FLASH, 10MHz, MICROCONTROLLER, PDSO8, ROHS COMPLIANT, MS-012AA, SOIC-8
参数名称 | 属性值 |
厂商名称 | NXP(恩智浦) |
零件包装代码 | SOIC |
包装说明 | SOP, |
针数 | 8 |
Reach Compliance Code | unknown |
具有ADC | YES |
地址总线宽度 | |
位大小 | 8 |
最大时钟频率 | 10 MHz |
DAC 通道 | NO |
DMA 通道 | NO |
外部数据总线宽度 | |
JESD-30 代码 | R-PDSO-G8 |
长度 | 4.9 mm |
I/O 线路数量 | 6 |
端子数量 | 8 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
PWM 通道 | YES |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
认证状态 | Not Qualified |
ROM可编程性 | FLASH |
座面最大高度 | 1.75 mm |
速度 | 10 MHz |
最大供电电压 | 3.6 V |
最小供电电压 | 1.8 V |
标称供电电压 | 2.7 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
宽度 | 3.9 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER |
MC9S08QA2CSCE | MC9S08QA2CPCE | MC9S08QA4CFCE | MC9S08QA4CSCE | MC9S08QA2CFCE | MC9S08QA4CPCE | |
---|---|---|---|---|---|---|
描述 | 8-BIT, FLASH, 10MHz, MICROCONTROLLER, PDSO8, ROHS COMPLIANT, MS-012AA, SOIC-8 | 8-BIT, FLASH, 10MHz, MICROCONTROLLER, PDIP8, ROHS COMPLIANT, PLASTIC, DIP-8 | 8-BIT, FLASH, 10MHz, MICROCONTROLLER, PDSO8, 4 X 4 MM, 1 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, DFN-8 | 8-BIT, FLASH, 10MHz, MICROCONTROLLER, PDSO8, ROHS COMPLIANT, MS-012AA, SOIC-8 | 8-BIT, FLASH, 10MHz, MICROCONTROLLER, PDSO8, 4 X 4 MM, 1 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, DFN-8 | 8-BIT, FLASH, 10MHz, MICROCONTROLLER, PDIP8, ROHS COMPLIANT, PLASTIC, DIP-8 |
厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
零件包装代码 | SOIC | DIP | DFN | SOIC | DFN | DIP |
包装说明 | SOP, | DIP, | HVSON, | SOP, | HVSON, | DIP, |
针数 | 8 | 8 | 8 | 8 | 8 | 8 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknow | unknow |
具有ADC | YES | YES | YES | YES | YES | YES |
位大小 | 8 | 8 | 8 | 8 | 8 | 8 |
最大时钟频率 | 10 MHz | 10 MHz | 10 MHz | 10 MHz | 10 MHz | 10 MHz |
DAC 通道 | NO | NO | NO | NO | NO | NO |
DMA 通道 | NO | NO | NO | NO | NO | NO |
JESD-30 代码 | R-PDSO-G8 | R-PDIP-T8 | S-PDSO-N8 | R-PDSO-G8 | S-PDSO-N8 | R-PDIP-T8 |
长度 | 4.9 mm | 9.779 mm | 4 mm | 4.9 mm | 4 mm | 9.779 mm |
I/O 线路数量 | 6 | 6 | 6 | 6 | 6 | 6 |
端子数量 | 8 | 8 | 8 | 8 | 8 | 8 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
PWM 通道 | YES | YES | YES | YES | YES | YES |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | DIP | HVSON | SOP | HVSON | DIP |
封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR |
封装形式 | SMALL OUTLINE | IN-LINE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | IN-LINE |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
ROM可编程性 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
座面最大高度 | 1.75 mm | 5.334 mm | 1 mm | 1.75 mm | 1 mm | 5.334 mm |
速度 | 10 MHz | 10 MHz | 10 MHz | 10 MHz | 10 MHz | 10 MHz |
最大供电电压 | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
标称供电电压 | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
表面贴装 | YES | NO | YES | YES | YES | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | GULL WING | THROUGH-HOLE | NO LEAD | GULL WING | NO LEAD | THROUGH-HOLE |
端子节距 | 1.27 mm | 2.54 mm | 0.8 mm | 1.27 mm | 0.8 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 3.9 mm | 7.62 mm | 4 mm | 3.9 mm | 4 mm | 7.62 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
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