Bus Driver, CBTLV/3B Series, 1-Func, 10-Bit, True Output, CMOS, PDSO24
| 参数名称 | 属性值 |
| 厂商名称 | Renesas(瑞萨电子) |
| 包装说明 | TSSOP, |
| Reach Compliance Code | compliant |
| 系列 | CBTLV/3B |
| JESD-30 代码 | R-PDSO-G24 |
| JESD-609代码 | e0 |
| 长度 | 7.8 mm |
| 逻辑集成电路类型 | BUS DRIVER |
| 位数 | 10 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 24 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 传播延迟(tpd) | 0.25 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 2.3 V |
| 标称供电电压 (Vsup) | 2.5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 宽度 | 4.4 mm |





| IDT74CBTLV3861P | IDT74CBTLV3861PGG8 | IDT74CBTLV3861PGG | IDT74CBTLV3861QG8 | IDT74CBTLV3861QG | |
|---|---|---|---|---|---|
| 描述 | Bus Driver, CBTLV/3B Series, 1-Func, 10-Bit, True Output, CMOS, PDSO24 | Bus Driver, CBTLV/3B Series, 1-Func, 10-Bit, True Output, CMOS, PDSO24 | Bus Driver, CBTLV/3B Series, 1-Func, 10-Bit, True Output, CMOS, PDSO24 | Bus Driver, CBTLV/3B Series, 1-Func, 10-Bit, True Output, CMOS, PDSO24 | Bus Driver, CBTLV/3B Series, 1-Func, 10-Bit, True Output, CMOS, PDSO24 |
| 厂商名称 | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) |
| 包装说明 | TSSOP, | TSSOP, TSSOP24,.25 | TSSOP, TSSOP24,.25 | SSOP, SSOP24,.24 | SSOP, SSOP24,.24 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant |
| 系列 | CBTLV/3B | CBTLV/3B | CBTLV/3B | CBTLV/3B | CBTLV/3B |
| JESD-30 代码 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 |
| JESD-609代码 | e0 | e3 | e3 | e3 | e3 |
| 长度 | 7.8 mm | 7.8 mm | 7.8 mm | 8.6868 mm | 8.6868 mm |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 位数 | 10 | 10 | 10 | 10 | 10 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 24 | 24 | 24 | 24 | 24 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | TSSOP | TSSOP | SSOP | SSOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH |
| 传播延迟(tpd) | 0.25 ns | 0.25 ns | 0.25 ns | 0.25 ns | 0.25 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 1.7272 mm | 1.7272 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V |
| 标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | TIN LEAD | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 0.635 mm | 0.635 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 4.4 mm | 4.4 mm | 4.4 mm | 3.937 mm | 3.937 mm |
| 是否Rohs认证 | - | 符合 | 符合 | 符合 | 符合 |
| 湿度敏感等级 | - | 1 | 1 | 1 | 1 |
| 封装等效代码 | - | TSSOP24,.25 | TSSOP24,.25 | SSOP24,.24 | SSOP24,.24 |
| 峰值回流温度(摄氏度) | - | 260 | 260 | 260 | 260 |
| 电源 | - | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V |
| 处于峰值回流温度下的最长时间 | - | 30 | 30 | 30 | 30 |
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