Revision 18
DS0097
ProASIC3 Flash Family FPGAs
with Optional Soft ARM Support
Features and Benefits
High Capacity
• 15 K to 1 M System Gates
• Up to 144 Kbits of True Dual-Port SRAM
• Up to 300 User I/Os
Advanced I/O
• 700 Mbps DDR, LVDS-Capable I/Os (A3P250 and above)
• 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation
• Wide Range Power Supply Voltage Support per JESD8-B,
Allowing I/Os to Operate from 2.7 V to 3.6 V
• Bank-Selectable I/O Voltages—up to 4 Banks per Chip
• Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V /
2.5 V / 1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X
†
and LVCMOS
2.5 V / 5.0 V Input
• Differential I/O Standards: LVPECL, LVDS, B-LVDS, and
M-LVDS (A3P250 and above)
• I/O Registers on Input, Output, and Enable Paths
• Hot-Swappable and Cold Sparing I/Os
‡
• Programmable Output Slew Rate
†
and Drive Strength
• Weak Pull-Up/-Down
• IEEE 1149.1 (JTAG) Boundary Scan Test
• Pin-Compatible Packages across the ProASIC3 Family
• Six CCC Blocks, One with an Integrated PLL
• Configurable Phase-Shift, Multiply/Divide, Delay Capabilities
and External Feedback
• Wide Input Frequency Range (1.5 MHz to 350 MHz)
• 1 Kbit of FlashROM User Nonvolatile Memory
• SRAMs and FIFOs with Variable-Aspect-Ratio 4,608-Bit RAM
Blocks (×1, ×2, ×4, ×9, and ×18 organizations)
†
• True Dual-Port SRAM (except ×18)
Reprogrammable Flash Technology
• 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS
Process
• Instant On Level 0 Support
• Single-Chip Solution
• Retains Programmed Design when Powered Off
High Performance
• 350 MHz System Performance
• 3.3 V, 66 MHz 64-Bit PCI
†
In-System Programming (ISP) and Security
• ISP Using On-Chip 128-Bit Advanced Encryption Standard
(AES) Decryption (except ARM
®
-enabled ProASIC
®
3 devices)
via JTAG (IEEE 1532–compliant)
†
• FlashLock
®
to Secure FPGA Contents
Clock Conditioning Circuit (CCC) and PLL
†
Low Power
• Core Voltage for Low Power
• Support for 1.5 V-Only Systems
• Low-Impedance Flash Switches
Embedded Memory
†
High-Performance Routing Hierarchy
• Segmented, Hierarchical Routing and Clock Structure
ARM Processor Support in ProASIC3 FPGAs
ProASIC3 Devices
A3P015
1
A3P030
A3P060 A3P125
A3P250
A3P400
A3P600
2
Cortex-M1 Devices
M1A3P250 M1A3P400
M1A3P600
System Gates
15,000
30,000
60,000 125,000
250,000
400,000
600,000
Typical Equivalent Macrocells
128
256
512
1,024
2,048
–
–
VersaTiles (D-flip-flops)
384
768
1,536
3,072
6,144
9,216
13,824
RAM Kbits (1,024 bits)
–
–
18
36
36
54
108
4,608-Bit Blocks
–
–
4
8
8
12
24
FlashROM Kbits
1
1
1
1
1
1
1
3
Secure (AES) ISP
–
–
Yes
Yes
Yes
Yes
Yes
Integrated PLL in CCCs
–
–
1
1
1
1
1
4
VersaNet Globals
6
6
18
18
18
18
18
I/O Banks
2
2
2
2
4
4
4
Maximum User I/Os
49
81
96
133
157
194
235
Notes:
1. A3P015 is not recommended for new designs.
2. Refer to the
Cortex-M1
product brief for more information.
3. AES is not available for Cortex-M1 ProASIC3 devices.
4. Six chip (main) and three quadrant global networks are available for A3P060 and above.
5. The M1A3P250 device does not support this package.
6. For higher densities and support of additional features, refer to the
ProASIC3E Flash Family FPGAs
datasheet.
7. Package not available.
• M1 ProASIC3 Devices—ARM
®
Cortex
®
-M1 Soft Processor
Available with or without Debug
A3P1000
M1A3P1000
1,000,000
–
24,576
144
32
1
Yes
1
18
4
300
† A3P015 and A3P030 devices do not support this feature.
‡ Supported only by A3P015 and A3P030 devices.
March 2016
© 2016 Microsemi Corporation
I
ProASIC3 Flash Family FPGAs
ProASIC3 Devices
Cortex-M1 Devices
2
Package Pins
QFN
CS
VQFP
TQFP
PQFP
FBGA
A3P015
1
A3P030
A3P060
A3P125
A3P250
M1A3P250
QN132
7
VQ100
PQ208
PQ208
FG144/256
5
FG144/256/
484
PQ208
FG144/256/
484
PQ208
FG144/256/
484
A3P400
M1A3P400
A3P600
M1A3P600
A3P1000
M1A3P1000
QN68
QN48, QN68,
QN132
7
VQ100
QN132
7
CS121
VQ100
TQ144
FG144
QN132
7
VQ100
TQ144
PQ208
FG144
Notes:
1. A3P015 is not recommended for new designs.
2. Refer to the
Cortex-M1
product brief for more information.
3. AES is not available for Cortex-M1 ProASIC3 devices.
4. Six chip (main) and three quadrant global networks are available for A3P060 and above.
5. The M1A3P250 device does not support this package.
6. For higher densities and support of additional features, refer to the
ProASIC3E Flash Family FPGAs
datasheet.
7. Package not available.
II
R evis i o n 18
ProASIC3 Flash Family FPGAs
I/Os Per Package
1
ProASIC3
Devices
Cortex-M1
Devices
A3P015
2
A3P030
A3P060
A3P125
A3P250
3
M1A3P250
3,5
I/O Type
Differential I/O Pairs
Differential I/O Pairs
Differential I/O Pairs
Differential I/O Pairs
–
–
–
–
–
–
35
25
44
74
FG484
23 × 23
529
1.0
2.23
III
A3P400
3
M1A3P400
3
A3P600
M1A3P600
A3P1000
M1A3P1000
Single-Ended I/O
4
Single-Ended I/O
4
Single-Ended I/O
4
Package
QN48
QN68
QN132
7
CS121
VQ100
TQ144
PQ208
FG144
FG256
5,6
FG484
6
–
49
–
–
–
–
–
–
–
–
34
49
81
–
77
–
–
–
–
–
–
–
80
96
71
91
–
96
–
–
–
–
84
–
71
100
133
97
–
–
–
–
87
–
68
–
151
97
157
–
–
–
19
–
13
–
34
24
38
–
–
–
–
–
–
151
97
178
194
–
–
–
–
–
–
34
25
38
38
–
–
–
–
–
–
–
–
154
97
177
235
–
35
25
43
60
Notes:
1. When considering migrating your design to a lower- or higher-density device, refer to the
ProASIC3 FPGA Fabric User Guide
to
ensure complying with design and board migration requirements.
2. A3P015 is not recommended for new designs.
3. For A3P250 and A3P400 devices, the maximum number of LVPECL pairs in east and west banks cannot exceed 15. Refer to
the
ProASIC3 FPGA Fabric Users Guide
for position assignments of the 15 LVPECL pairs.
4. Each used differential I/O pair reduces the number of single-ended I/Os available by two.
5. The M1A3P250 device does not support FG256 package.
6. FG256 and FG484 are footprint-compatible packages.
7. Package not available.
Table 1 • ProASIC3 FPGAs Package Sizes Dimensions
Package
Length × Width
(mm × mm)
Nominal Area
(mm
2
)
Pitch (mm)
Height (mm)
CS121
6×6
36
0.5
0.99
QN48
6×6
36
0.4
0.90
QN68
8×8
64
0.4
0.90
QN132
*
8×8
64
0.5
0.75
VQ100
14 × 14
196
0.5
1.00
TQ144
20 × 20
400
0.5
1.40
PQ208
28 × 28
784
0.5
3.40
FG144
13 × 13
169
1.0
1.45
FG256
17 × 17
289
1.0
1.60
Note:
*
Package not available
R ev i si o n 1 8
Single-Ended I/O
4
–
–
–
–
–
–
154
97
177
300
Single-Ended I/O
Single-Ended I/O
Single-Ended I/O
Single-Ended I/O
ProASIC3 Flash Family FPGAs
ProASIC3 Ordering Information
A3P1000
_
1
FG
G
144
I
Y
Security Feature
Y = Device Includes License to Implement IP Based on the
Cryptography Research, Inc. (CRI) Patent Portfolio
Blank = Device Does Not Include License to Implement IP Based
on the Cryptography Research, Inc. (CRI) Patent Portfolio
Note:
Only devices with packages greater than or equal to 5x5 are supported
Application (Temperature Range)
Blank = Commercial (0°C to +85°C Junction Temperature)
I = Industrial (
–
40°C to +100°C Junction Temperature)
PP = Pre-Production
ES = Engineering Sample (Room Temperature Only)
Package Lead Count
Lead-Free Packaging
Blank = Standard Packaging
G= RoHS-Compliant (Green) Packaging (some packages also halogen-free)
Package Type
QN = Quad Flat Pack No Leads (0.4 mm and 0.5 mm pitches)
VQ = Very Thin Quad Flat Pack (0.5 mm pitch)
TQ = Thin Quad Flat Pack (0.5 mm pitch)
PQ = Plastic Quad Flat Pack (0.5 mm pitch)
FG = Fine Pitch Ball Grid Array (1.0 mm pitch)
Speed Grade CS = Chip Scale Package (0.5 mm pitch)
Blank = Standard
1 = 15% Faster than Standard
2 = 25% Faster than Standard
15,000 System Gates (A3P015 is not recommended for new designs.)
30,000 System Gates
60,000 System Gates
125,000 System Gates
250,000 System Gates
400,000 System Gates
600,000 System Gates
1,000,000 System Gates
Part Number
ProASIC3 Devices
A3P015 =
A3P030 =
A3P060 =
A3P125 =
A3P250 =
A3P400 =
A3P600 =
A3P1000 =
ProASIC3 Devices with Cortex-M1
M1A3P250
M1A3P400
M1A3P600
M1A3P1000
=
=
=
=
250,000 System Gates
400,000 System Gates
600,000 System Gates
1,000,000 System Gates
ProASIC3 Device Status
ProASIC3 Devices
A3P015
A3P030
A3P060
A3P125
A3P250
A3P400
A3P600
A3P1000
Status
Not recommended for new designs.
Production
Production
Production
Production
Production
Production
Production
M1A3P250
M1A3P400
M1A3P600
M1A3P1000
Production
Production
Production
Production
Cortex-M1 Devices
Status
IV
R evis i o n 18
ProASIC3 Flash Family FPGAs
ProASIC3 Device Family Overview
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
ProASIC3 DC and Switching Characteristics
General Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
Calculating Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7
User I/O Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-15
VersaTile Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-81
Global Resource Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-85
Clock Conditioning Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-90
Embedded SRAM and FIFO Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-92
Embedded FlashROM Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-107
JTAG 1532 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-108
Pin Descriptions
Supply Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
User Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
JTAG Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Special Function Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Related Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3-1
3-2
3-3
3-4
3-4
Package Pin Assignments
QN48 – Bottom View . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
QN68 – Bottom View . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3
QN132 – Bottom View . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-6
CS121 – Bottom View . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-15
VQ100 – Top View . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-18
TQ144 – Top View . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-23
PQ208 – Top View . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-28
FG144 – Bottom View . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-39
FG256 – Bottom View . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-52
FG484 – Bottom View . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-65
Datasheet Information
List of Changes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1
Datasheet Categories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-15
Safety Critical, Life Support, and High-Reliability Applications Policy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-15
R ev i si o n 1 8
V
Microchip MCU
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