SMB1W-700-04
TECHNICAL DATA
High Power LED, SMD
AlGaAs
SMB1W-700-04 is a AlGaAs high power LED, mounted on a cooper heat sink with a 5x5 mm SMD
package and molded with epoxy resin. On forward bias, it emits a radiation of typical 120 mW at a
peak wavelength of 700 nm.
Specifications
•
•
•
•
•
Structure:
Peak Wavelength:
Optical Output Power:
Package:
Lead frame die:
Lens:
AlGaAs, 1W high power chip
700 nm
120 mW
SMD, PPA resin
silver plated on copper
epoxy resin
Absolute Maximum Ratings (T
A
=25°C)
Item
Power Dissipation
Forward Current
1
Pulse Forward Current *
Reverse Voltage
Thermal Resistance
Junction Temperature
Operating Temperature
Storage Temperature
2
Soldering Temperature *
1
Symbol
P
D
I
F
I
FP
V
R
R
th
T
J
T
opr
T
stg
T
sol
Value
1500
500
2000
5
10
120
-40 … +100
-40 … +100
255
Unit
mW
mA
mA
V
K/W
°C
°C
°C
°C
(Unit: mm)
* duty = 1%, pulse width = 10 µs
2
* must be completed within 3 seconds at 260°C
Electro-Optical Characteristics
Item
Forward Voltage
Pulsed Forward Voltage
Total Radiated Power
Radiant Intensity
Peak Wavelength
Half Width
Viewing Half Angle
Rise Time
Fall Time
Symbol
V
F
V
FP
P
O
I
E
λ
P
Δλ
Θ
1/2
t
r
t
f
Condition
I
F
= 500 mA
I
FP
= 2 A
I
F
= 500 mA
I
FP
= 2 A
I
F
= 500 mA
I
FP
= 2 A
I
F
= 500 mA
I
F
= 500 mA
I
F
= 500 mA
I
F
= 500 mA
I
F
= 500 mA
Min.
-
-
60
-
-
-
690
-
-
-
-
Typ.
2.1
3.5
120
480
130
530
700
21
±24
50
40
Max.
2.7
-
-
-
-
-
710
-
-
-
-
Unit
V
V
mW
mW/sr
nm
nm
deg.
ns
ns
Radiated Power is measured by S3584-08
Radiant Intensity is measured by Tektronix J-6512
Note:
The above specifications are for reference purpose only and subjected to change without prior notice.
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Typical Performance Curves
Forward Current – Forward Voltage
Radiant Intensity – Forward Current
Forward Current – Pulse Duration
Forward Current – Ambient Temperature
Relative Radiant Intensity –
Ambient Temperature
Allowed Forward Voltage –
Ambient Temperature
Relative Spectral Emission
Peak Wavelength – Ambient Temperature
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Precaution for Use
1. Cautions
•
•
•
This high power LED must be cooled!
DO NOT look directly into the emitting area of the LED during operation!
WARNING: LED is emitting invisible light!
2. Soldering Conditions
•
•
•
DO NOT apply any stress to the lead particularly when heat.
After soldering the LEDs should be protected from mechanical shock or vibration until the LEDs return
to room temperature.
When it is necessary to clamp the LEDs to prevent soldering failure, it is important to minimize the
mechanical stress on the LEDs.
Recommended Land Layout
Soldering Conditions
(Unit: mm)
3. Static Electricity
•
The LEDs are very sensitive to Static Electricity and surge
voltage. So it is recommended that a wrist band and/or an anti-
electrostatic glove be used when handling the LEDs.
All devices, equipment and machinery must be grounded properly.
It is recommended that precautions should be taken against surge
voltage to the equipment that mounts the LEDs.
•
4. Heat Generation
•
Thermal design of the end product is of paramount importance. Please consider the heat generation of
the LED when making the system design. The coefficient of temperature increase per input electric
power is affected by the thermal resistance of the circuit board and density of LED placement on the
board, as well as other components. It is necessary to avoid intense heat generation and operate
within the maximum ratings given in the specification.
The operating current should be decided after considering the ambient maximum temperature of
LEDs.
•
5. Storage
•
The LEDs should be stored at 30°C or less and 60%RH or less after being shipped and the storage
life limits are 3 months. If the LEDs are stored for 3 months or more, they can be stored for a year in a
sealed container with nitrogen atmosphere and moisture absorbent material at less than 30%RH.
Please avoid rapid transitions in ambient temperature, especially in high humidity environments where
condensation can occur.
•
19.12.2013
SMB1W-700-04
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