HFW12N60S
Jan 2013
BV
DSS
= 600 V
HFW12N60S
600V N-Channel MOSFET
FEATURES
Originative New Design
Superior Avalanche Rugged Technology
Robust Gate Oxide Technology
Very Low Intrinsic Capacitances
Excellent Switching Characteristics
Unrivalled Gate Charge : 38 nC (Typ.)
Extended Safe Operating Area
Lower R
DS(ON)
: 0.53
100% Avalanche Tested
GS
=10V
R
DS(on) typ
= 0.53
I
D
= 12 A
D
2
-PAK
1.Gate 2. Drain 3. Source
Absolute Maximum Ratings
Symbol
V
DSS
I
D
I
DM
V
GS
E
AS
I
AR
E
AR
dv/dt
P
D
Drain-Source Voltage
Drain Current
Drain Current
Drain Current
Gate-Source Voltage
T
C
=25
unless otherwise specified
Parameter
Value
600
Units
V
A
A
A
V
mJ
A
mJ
V/ns
W
W
W/
– Continuous (T
C
= 25
– Continuous (T
C
= 100
– Pulsed
)
)
12
7.4
48
30
(Note 1)
Single Pulsed Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Power Dissipation (T
A
= 25
)*
(Note 2)
(Note 1)
(Note 1)
(Note 3)
870
12
22.5
4.5
3.13
225
1.78
-55 to +150
300
Power Dissipation (T
C
= 25 )
- Derate above 25
T
J
, T
STG
T
L
Operating and Storage Temperature Range
Maximum lead temperature for soldering purposes,
1/8” from case for 5 seconds
Thermal Resistance Characteristics
Symbol
R
R
R
JC
JA
JA
Parameter
Junction-to-Case
Junction-to-Ambient*
Junction-to-Ambient
Typ.
--
--
--
Max.
0.56
40
62.5
Units
/W
* When mounted on the minimum pad size recommended (PCB Mount)
HFW12N60S
Electrical Characteristics
T
C
=25
Symbol
Parameter
C unless otherwise specified
Test Conditions
Min
Typ
Max
Units
On Characteristics
V
GS
R
DS(ON)
Gate Threshold Voltage
Static Drain-Source
On-Resistance
V
DS
= V
GS
, I
D
= 250
V
GS
= 10 V, I
D
= 6.0 A
2.0
--
--
0.53
4.0
0.65
V
Off Characteristics
BV
DSS
Drain-Source Breakdown Voltage
V
GS
= 0 V, I
D
= 250
I
D
= 250
, Referenced to 25
600
--
--
--
--
--
--
0.5
--
--
--
--
--
--
1
10
100
-100
V
V/
BV
DSS
Breakdown Voltage Temperature
Coefficient
/ T
J
I
DSS
I
GSSF
I
GSSR
Zero Gate Voltage Drain Current
Gate-Body Leakage Current,
Forward
Gate-Body Leakage Current,
Reverse
V
DS
= 600 V, V
GS
= 0 V
V
DS
= 480 V, T
C
= 125
V
GS
= 30 V, V
DS
= 0 V
V
GS
= -30 V, V
DS
= 0 V
Dynamic Characteristics
C
iss
C
oss
C
rss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
V
DS
= 25 V, V
GS
= 0 V,
f = 1.0 MHz
--
--
--
1835
185
16
2385
240
21
Switching Characteristics
t
d(on)
t
r
t
d(off)
t
f
Q
g
Q
gs
Q
gd
Turn-On Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
(Note 4,5)
V
DS
= 300 V, I
D
= 12 A,
R
G
= 25
--
--
--
--
--
--
--
30
85
140
90
38
8
13
70
180
280
190
49
--
--
nC
nC
nC
V
DS
= 480V, I
D
= 12 A,
V
GS
= 10 V
(Note 4,5)
Source-Drain Diode Maximum Ratings and Characteristics
I
S
I
SM
V
SD
trr
Qrr
Continuous Source-Drain Diode Forward Current
Pulsed Source-Drain Diode Forward Current
Source-Drain Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
I
S
= 12.0 A, V
GS
= 0 V
I
S
= 12.0 A, V
GS
= 0 V
di
F
/dt = 100 A/
(Note 4)
--
--
--
--
--
--
--
--
420
4.9
12
48
1.4
--
--
A
V
Notes ;
1. Repetitive Rating : Pulse width limited by maximum junction temperature
2. L=11mH, I
AS
=12A, V
DD
=50V, R
G
=25 , Starting T
J
=25 C
3. I
SD
, di/dt
, V
DD
DSS
, Starting T
J
=25 C
4. Pulse Test : Pulse Width
5. Essentially Independent of Operating Temperature
HFW12N60S
Typical Characteristics
I
D
, Drain Current [A]
I
D
, Drain Current [A]
V
DS
, Drain-Source Voltage [V]
V
GS
, Gate-Source Voltage [V]
Figure 1. On Region Characteristics
Figure 2. Transfer Characteristics
R
DS(ON)
[
Drain-Source On-Resistance
I
DR
, Reverse Drain Current [A]
I
D
, Drain Current [A]
V
SD
, Source-Drain Voltage [V]
Figure 3. On Resistance Variation vs
Drain Current and Gate Voltage
3500
3000
2500
Figure 4. Body Diode Forward Voltage
Variation with Source Current
and Temperature
12
V
GS
, Gate-Source Voltage [V]
C
iss
C
iss
= C
gs
+ C
gd
(C
ds
= shorted)
C
oss
= C
ds
+ C
gd
C
rss
= C
gd
V
DS
= 120V
10
V
DS
= 300V
V
DS
= 480V
Capacitances [pF]
8
2000
C
oss
1500
1000
500
0
10
-1
Note ;
1. V
GS
= 0 V
2. f = 1 MHz
6
4
C
rss
2
* Note : I
D
= 12.0A
10
0
10
1
0
0
4
8
12
16
20
24
28
32
36
40
V
DS
, Drain-Source Voltage [V]
Q
G
, Total Gate Charge [nC]
Figure 5. Capacitance Characteristics
Figure 6. Gate Charge Characteristics
HFW12N60S
Typical Characteristics
(continued)
3.0
BV
DSS
, (Normalized)
Drain-Source Breakdown Voltage
2.5
R
DS(ON)
, (Normalized)
Drain-Source On-Resistance
2.0
1.5
1.0
* Note:
1. V
GS
=10V
2. I
D
=6.0A
0.5
0.0
-100
-50
0
50
100
o
150
200
T
J
, Junction Temperature [
o
C]
T
J
, Junction Temperature[ C]
Figure 7. Breakdown Voltage Variation
vs Temperature
14
10
2
Operation in This Area
is Limited by R
DS(on)
Figure 8. On-Resistance Variation
vs Temperature
10 s
12
I
D
, Drain Current [A]
10
1
I
D
, Drain Current [A]
100 s
1 ms
10 ms
100 ms
DC
10
8
6
4
2
0
25
10
0
10
-1
* Notes :
1. T
C
= 25
o
C
2. T
J
= 150
o
C
3. Single Pulse
10
-2
10
0
10
1
10
2
10
3
50
75
100
o
125
150
V
DS
, Drain-Source Voltage [V]
T
C
, Case Temperature [ C]
Figure 9. Maximum Safe Operating Area
Figure 10. Maximum Drain Current
vs Case Temperature
10
0
Z
JC
(t), Thermal Response
D=0.5
0.2
0.1
0.05
0.02
0.01
* Notes :
1. Z
JC
(t) = 0.56
o
C/W Max.
2. Duty Factor, D=t
1
/t
2
3. T
JM
- T
C
= P
DM
* Z
JC
(t)
10
-1
10
-2
single pulse
P
DM
t
1
t
2
10
0
10
1
10
-5
10
-4
10
-3
10
-2
10
-1
t
1
, Square Wave Pulse Duration [sec]
Figure 11. Transient Thermal Response Curve
HFW12N60S
Fig 12. Gate Charge Test Circuit & Waveform
Same Type
as DUT
12V
200nF
300nF
V
GS
Q
g
10V
V
GS
V
DS
Q
gs
Q
gd
DUT
3mA
Charge
Fig 13. Resistive Switching Test Circuit & Waveforms
V
DS
R
G
R
L
V
DD
( 0.5 rated V
DS
)
V
DS
90%
10V
DUT
V
in
10%
t
d(on)
t
on
t
r
t
d(off)
t
off
t
f
Fig 14. Unclamped Inductive Switching Test Circuit & Waveforms
L
V
DS
V
DD
I
D
R
G
DUT
V
DD
BV
DSS
I
AS
BV
DSS
1
E
AS
= ---- L
L
I
AS2
--------------------
2
BV
DSS
-- V
DD
I
D
(t)
V
DS
(t)
t
p
10V
Time
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