RS1E200BN
Nch 30V 20A Middle Power MOSFET
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Outline
Datasheet
V
DSS
R
DS(on)
(Max.)
I
D
P
D
30V
3.9mΩ
±20A
3.0W
HSOP8
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Inner circuit
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Features
1) Low on - resistance.
2) High Power small mold Package (HSOP8).
3) Pb-free lead plating ; RoHS compliant.
4) Halogen Free.
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Packaging specifications
Packing
Reel size (mm)
Tape width (mm)
Basic ordering unit (pcs)
Taping code
Marking
Parameter
Drain - Source voltage
Continuous drain current
Pulsed drain current
Gate - Source voltage
Power dissipation
Junction temperature
Range of storage temperature
Symbol
V
DSS
I
D
I
D,pulse*1
V
GSS
P
D*2
P
D*3
T
j
T
stg
Value
30
±20
±80
±20
3.0
25
150
-55 to +150
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Application
Type
Embossed
Tape
330
12
2500
TB
RS1E200BN
Unit
V
A
A
V
W
W
℃
℃
Switching
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Absolute maximum ratings
(T
a
= 25°C)
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© 2014 ROHM Co., Ltd. All rights reserved.
1/11
20140825 - Rev.001
RS1E200BN
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Thermal resistance
Datasheet
Parameter
Thermal resistance, junction - ambient
Thermal resistance, junction - case
Symbol
R
thJA*2
R
thJC*3
Values
Min.
-
-
Typ.
41.7
5.0
Max.
-
-
Unit
℃
/W
℃
/W
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Electrical characteristics (T
a
= 25°C)
Parameter
Drain - Source breakdown
voltage
Breakdown voltage
temperature coefficient
Zero gate voltage
drain current
Gate - Source leakage current
Gate threshold voltage
Gate threshold voltage
temperature coefficient
Static drain - source
on - state resistance
Transconductance
*1 Pw
≦
10μs, Duty cycle
≦
1%
Symbol
Conditions
Values
Min.
30
-
-
-
1.0
-
-
-
15
Typ.
-
21
-
-
-
-3
2.8
3.8
-
Max.
-
-
1
±100
2.5
-
3.9
5.3
-
Unit
V
(BR)DSS
V
GS
= 0V, I
D
= 1mA
Δ
V
(BR)DSS
I
D
= 1mA
ΔT
j
referenced to 25
℃
V
mV/
℃
μA
nA
V
mV/
℃
mΩ
S
I
DSS
I
GSS
V
GS(th)
V
DS
= 30V, V
GS
= 0V
V
GS
= ±20V, V
DS
= 0V
V
DS
= 10V, I
D
= 1mA
Δ
V
GS(th)
I
D
= 1mA
ΔT
j
referenced to 25
℃
R
DS(on)*4
g
fs*4
V
GS
= 10V, I
D
= 20A
V
GS
= 4.5V, I
D
= 20A
V
DS
= 5V, I
D
= 20A
*2 MOUNTED ON 40mm×40mm Cu BOARD
*3 Tc=25
℃
*4 Pulsed
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© 2014 ROHM Co., Ltd. All rights reserved.
2/11
20140825 - Rev.001
RS1E200BN
Datasheet
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Electrical characteristics
(T
a
= 25°C)
Parameter
Input capacitance
Output capacitance
Reverse transfer capacitance
Turn - on delay time
Rise time
Turn - off delay time
Fall time
Symbol
C
iss
C
oss
C
rss
t
d(on)*4
t
r*4
t
d(off)*4
t
f*4
Conditions
V
GS
= 0V
V
DS
= 15V
f = 1MHz
V
DD
⋍
15V,V
GS
= 10V
Values
Min.
-
-
-
-
-
-
-
Typ.
3100
360
290
20
65
105
25
Max.
-
-
-
-
-
-
-
Unit
pF
I
D
= 10A
R
L
= 1.5Ω
R
G
= 10Ω
ns
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Gate charge characteristics
(T
a
= 25°C)
Parameter
Total gate charge
Gate - Source charge
Gate - Drain charge
Symbol
Q
g*4
Q
gs*4
Q
gd*4
Conditions
V
GS
= 10V
Values
Min.
-
-
-
-
Typ.
59
29
8.5
11
Max.
-
-
-
-
Unit
V
DD
⋍
15V
I
D
= 20A
V
GS
= 4.5V
nC
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Body diode electrical characteristics
(Source-Drain) (T
a
= 25°C)
Parameter
Symbol
I
S
Conditions
Values
Min.
-
Typ.
-
-
-
Max.
2.5
Unit
Body diode continuous
forward current
Body diode
pulse current
Forward voltage
T
a
= 25
℃
I
SP*1
V
SD*4
V
GS
= 0V, I
S
= 2.5A
-
-
80
1.2
A
V
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© 2014 ROHM Co., Ltd. All rights reserved.
3/11
20140825 - Rev.001
RS1E200BN
Datasheet
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Electrical characteristic curves
Fig.1 Power Dissipation Derating Curve
Fig.2 Maximum Safe Operating Area
Fig.3 Normalized Transient Thermal
Resistance vs. Pulse Width
Fig.4 Single Pulse Maximum Power
dissipation
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© 2014 ROHM Co., Ltd. All rights reserved.
4/11
20140825 - Rev.001
RS1E200BN
Datasheet
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Electrical characteristic curves
Fig.5 Typical Output Characteristics(I)
Fig.6 Typical Output Characteristics(II)
Fig.7 Breakdown Voltage vs. Junction
Temperature
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© 2014 ROHM Co., Ltd. All rights reserved.
5/11
20140825 - Rev.001
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