PRODUCT SPECIFICATION
Part Number
PLBT5050-WCP32
Details
5.0mm x 5.0mm SMT LED, 1.5mm
Thickness
Package: 1,000pcs/Reel
Emitting Color: Purple
InGaN dice used
Features
Resin (Mold) Material: Silicon
RoHS Compliant
120° Viewing Angle
Low Power Consumption
Mechanical Dimensions
Notes:
1. Dimensions in millimeters and tolerance is ±0.1mm unless otherwise noted.
2. Specifications are subject to change without notice
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Device Selection Guide
Model Number
PLBT5050-WCP32
Material
InGaN
Chip
Emitting Color
Purple
Lens Type
Water Clear
Absolute Maximum Ratings at Ta=25
Purple
Parameter
Power Dissipation per Dice
DC Forward Current per Dice
Single Chip Pulsed Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
Soldering Temperature
Symbol
P
D
I
F
I
FP
VR
Topr
Tstg
Tsol
Rating
120*3
30*3
100※
5
-40~+105
-40~+105
260for5sec
Unit
mW
mA
mA
V
※Duty
1/10, Pulse Width 0.1ms
Soldering time max 10 seconds
*Please refer to IF-Ta diagram of curves for the temperature during application
Electrical and Optical Characteristics at Ta=25
Parameter
Forward Voltage
Power
Peak Emission Wavelength
Reverse Current
Viewing Angle
Symbol
Vf
W
λP
Ir
2θ1/2
Min.
2.8
--
400
--
--
Typ.
3.3
16
--
--
120
Max.
3.8
410
10
‐‐
Unit
V
mW
nm
μA
Deg
Condition
IF=20mA*3
IF=20mA*3
IF=20mA*3
VR=5V
IF=20mA*3
Note: 1. Luminous intensity ±10%, Forward voltage (VF) ±0.1V, Wavelength(λd) ±0.5nm
2. IS Standard Testing
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Typical Electrical / Optical Characteristic Curves
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IR Reflow Temperature / Time
Notes:
1. We recommend reflow temp of 245
(+/- 5
) Maximum soldering temp should be limited to 260
2. Do not cause stress to the silicon resin while it is exposed to high temperatures
3. Number of reflow process shall be 1 time
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Test Circuit and Handling Precautions
1. Test Circuit
2. Over-current-proof
a. Customer must apply resistors for protection, otherwise slight voltage shift will cause big current
change (burn out will happen)
3. Storage
a. It is recommended to store the products in the following conditions
i. Humidity: 60% R.H. Max. | Temperature : 5 ~30 (41 ~86 )
ii. Shelf life in sealed bag: 12 month at
＜5
~30 and
＜30%
R.H. after the package is
opened, the products should be used within a week or they should be stored at
≦20
R.H.
with zip-lock sealed.
4. Baking
a. It is recommended to bake before soldering when the pack is unsealed after 24hrs. The conditions
are as follows:
i. 3.1 70±3 x(12~24hrs) and
＜5%RH,
taped reel type
ii. 3.2 100±3 x(45min~1hr), bulk type
iii. 3.3 130±3 x(15~30min), bulk type
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