PRODUCT SPECIFICATION
Part Number
PLBT5050-WCB12
Details
•
•
•
•
Features
Square SMD
120° viewing angle.
Emitting Color: Blue
InGaN dice used
•
•
RoHS Compliant
Easy mounting on PCB
Mechanical Dimensions
Notes:
1. Dimension in millimeter [inch], and tolerance is ±0.13mm unless otherwise noted.
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040715 Rev1 JAS Page 1 of 11
Device Selection Guide
Model Number
PLBT5050-WCB12
Material
InGaN
Chip
Emitting Color
Blue
Absolute Maximum Ratings at Ta=25°C
Parameter
Power Dissipation
DC Forward Current
Single Chip Pulse Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
Symbol
P
D per dice
I
F per dice
I
F per dice
Vr
Topr
Tstg
Rating
120
30
100
5
-30~+80
-40~+100
Unit
mW
mA
mA
V
°C
°C
Electrical and Optical Characteristics at Ta=25°C
Parameter
Forward Voltage per Die
Luminous intensity per Die
Wavelength
Reverse Current
Viewing Angle per Die
Symbol
VF
I
v
λD
IR
2θ
1/2
Min.
2.8
600
460
--
--
Typ.
3.2
780
--
--
120
Max.
3.4
1300
470
10
--
Unit
V
Lm
nm
μA
Deg
Condition
IF=20mA
IF=20mA
IF=20mA
VR=5V
IF=20mA
Recommended Pad Layout
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040715 Rev1 JAS Page 2 of 11
Typical Electrical / Optical Characteristic Curves
Fig.1 IF-VF(Ta=25℃)
Fig.2 Relative Luminous Intensity-IF
(Ta=25℃)
Relative Luminous Intensity
Forward Current IF(mA)
Forward Current IF(mA)
Fig.3 Wavelength
Characteristics (Ta=25℃)
Relative Luminous Intensity
Relative Luminous Intensity
Directive Characteristics
（
Ta=25°)
Forward Current IF(mA)
Ambient Temperature Ta (℃)
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040715 Rev1 JAS Page 3 of 11
IR Reflow Temperature / Time
NOTES:
1. We recommend the reflow temperature 240°C(±5°C).the maximum soldering temperature
should be limited to 260°C.
2. Don’t cause stress to the silicone resin while it is exposed to high temperature.
3. Number of reflow process shall be 1 time.
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040715 Rev1 JAS Page 4 of 11
Test circuit and handling precautions
Test circuit
Handling precautions
1. Over-current-proof
Customer must apply resistors for protection; otherwise slight voltage shift will cause
big current change (Burn out will happen).
2.Storage
2.1 It is recommended to store the products in the following conditions:
Humidity: 60% R.H. Max. Temperature: 5°C~30°C (41°F~86°F)
2.2 Shelf life in sealed bag: 12 month at
＜
5°C~30°C and
＜
60% R.H. after the package is
Opened, the products should be used within a week or they should be keeping to stored at
≤20%R.H. with zip-lock sealed.
3.Baking
It is recommended to baking before soldering when the pack is unsealed after 24hrs. The
Conditions are as following:
3.1 70±3°C x(12~24hrs) and
＜5%RH,
taped reel type
3.2 100±3°C x(45min~1hr), bulk type
3.3 130±3°C x(15~30min), bulk type
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040715 Rev1 JAS Page 5 of 11
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