Power Management Circuit, CDIP14,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Linfinity Microelectronics |
| Reach Compliance Code | unknown |
| JESD-30 代码 | R-XDIP-T14 |
| JESD-609代码 | e0 |
| 端子数量 | 14 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP14,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 4.5/40 V |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 最大供电电流 (Isup) | 7 mA |
| 表面贴装 | NO |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| SG1542J/883B | SG3542J | SG3542N | SG1542J | SG1542J/883C | SG2542J | SG1542F/883B | SG1542F | SG3542D | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Power Management Circuit, CDIP14, | Power Management Circuit, CDIP14, | Power Management Circuit, PDIP14, | Power Management Circuit, CDIP14, | Power Management Circuit, CDIP14, | Power Management Circuit, CDIP14, | Power Management Circuit, CDFP14, | Power Management Circuit, CDFP14, | Power Management Circuit, PDSO14, |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 代码 | R-XDIP-T14 | R-XDIP-T14 | R-PDIP-T14 | R-XDIP-T14 | R-XDIP-T14 | R-XDIP-T14 | R-XDFP-F14 | R-XDFP-F14 | R-PDSO-G14 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 端子数量 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
| 最高工作温度 | 125 °C | 70 °C | 70 °C | 125 °C | 125 °C | 85 °C | 125 °C | 125 °C | 70 °C |
| 最低工作温度 | -55 °C | - | - | -55 °C | -55 °C | -25 °C | -55 °C | -55 °C | - |
| 封装主体材料 | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DFP | DFP | SOP |
| 封装等效代码 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | FL14,.3 | FL14,.3 | SOP14,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | FLATPACK | FLATPACK | SMALL OUTLINE |
| 电源 | 4.5/40 V | 4.5/40 V | 4.5/40 V | 4.5/40 V | 4.5/40 V | 4.5/40 V | 4.5/40 V | 4.5/40 V | 4.5/40 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电流 (Isup) | 7 mA | 10 mA | 10 mA | 7 mA | 7 mA | 7 mA | 7 mA | 7 mA | 10 mA |
| 表面贴装 | NO | NO | NO | NO | NO | NO | YES | YES | YES |
| 温度等级 | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | OTHER | MILITARY | MILITARY | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT | FLAT | GULL WING |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 厂商名称 | Linfinity Microelectronics | - | Linfinity Microelectronics | Linfinity Microelectronics | Linfinity Microelectronics | Linfinity Microelectronics | Linfinity Microelectronics | Linfinity Microelectronics | Linfinity Microelectronics |
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