1. Rating applies when surface mounted on the minimum pad sizes recommended.
Symbol
R
qJC
R
qJA
Value
6
80
Unit
°C/W
°C/W
ELECTRICAL CHARACTERISTICS
Characteristics
Maximum Instantaneous Forward Voltage Drop (Note 2)
(i
F
= 3 Amps, T
J
= 25°C)
(i
F
= 3 Amps, T
J
= 125°C)
Maximum Instantaneous Reverse Current (Note 2)
(T
J
= 25°C, Rated dc Voltage)
(T
J
= 125°C, Rated dc Voltage)
Maximum Reverse Recovery Time
(I
F
= 1 Amp, di/dt = 50 Amps/ms, V
R
= 30 V, T
J
= 25°C)
(I
F
= 0.5 Amp, i
R
= 1 Amp, I
REC
= 0.25 A, V
R
= 30 V, T
J
= 25°C)
Symbol
v
F
0.95
0.75
i
R
5
500
t
rr
35
25
ns
mA
Value
Unit
Volts
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
2. Pulse Test: Pulse Width = 300
ms,
Duty Cycle
≤
2.0%.
100
IR, REVERSE CURRENT (
m
A)
70
50
80
40
20
8.0
4.0
2.0
0.8
0.4
0.2
0.08
0.04
0.02
0.008
0.004
0.002
0
20
40
60
80
T
J
= 175°C
150°C
100°C
30
i , INSTANTANEOUS FORWARD CURRENT (AMPS)
F
20
25°C
10
7.0
5.0
100
120
140
160
180 200
V
R
, REVERSE VOLTAGE (VOLTS)
Figure 2. Typical Reverse Current*
3.0
175°C
2.0
PF(AV) , AVERAGE POWER DISSIPATION (WATTS)
150°C
1.0
0.7
0.5
100°C
14
13
12
11
10
9.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0
0
T
J
= 25°C
* The curves shown are typical for the highest voltage device in the
voltage grouping. Typical reverse current for lower voltage selections
can be estimated from these curves if V
R
is sufficiently below rated
V
R
.
SINE WAVE
SQUARE WAVE
5.0
10
I
PK
/I
AV
= 20
dc
0.3
0.2
T
J
= 175°C
0.1
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
v
F,
INSTANTANEOUS VOLTAGE (VOLTS)
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10
Figure 1. Typical Forward Voltage
I
F(AV)
, AVERAGE FORWARD CURRENT (AMPS)
Figure 3. Average Power Dissipation
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2
MURD320, SURD8320, NRVUD320W1
IF(AV) , AVERAGE FORWARD CURRENT (AMPS)
8.0
7.0
6.0
5.0
4.0
3.0
dc
2.0
1.0
0
100
110
120
130
140
150
160
170
180
T
C
, CASE TEMPERATURE (°C)
T
J
= 175°C
SINE WAVE
OR
SQUARE WAVE
RATED VOLTAGE APPLIED
R
qJC
= 6°C/W
Figure 4. Current Derating, Case
IF(AV) , AVERAGE FORWARD CURRENT (AMPS)
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
0
20
40
60
80
100
120
140
160
180 200
T
A
, AMBIENT TEMPERATURE (°C)
SINE WAVE
OR
SQUARE WAVE
SURFACE MOUNTED ON
MIN. PAD SIZE RECOMMENDED
dc
T
J
= 175°C
RATED VOLTAGE APPLIED
R
qJA
= 80°C/W
Figure 5. Current Derating, Ambient
1000
500
C, CAPACITANCE (pF)
300
200
T
J
= 25°C
100
50
30
20
10
0
10
20
30
40
50
60
70
80
90
100
V
R
, REVERSE VOLTAGE (VOLTS)
Figure 6. Typical Capacitance
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3
MURD320, SURD8320, NRVUD320W1
PACKAGE DIMENSIONS
DPAK (SINGLE GAUGE)
CASE 369C
ISSUE E
A
E
A
b3
4
C
B
c2
Z
DETAIL A
L3
1
D
2
3
Z
H
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. THERMAL PAD CONTOUR OPTIONAL WITHIN DI-
MENSIONS b3, L3 and Z.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL
NOT EXCEED 0.006 INCHES PER SIDE.
5. DIMENSIONS D AND E ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY.
6. DATUMS A AND B ARE DETERMINED AT DATUM
PLANE H.
7. OPTIONAL MOLD FEATURE.
DIM
A
A1
b
b2
b3
c
c2
D
E
e
H
L
L1
L2
L3
L4
Z
INCHES
MIN
MAX
0.086 0.094
0.000 0.005
0.025 0.035
0.028 0.045
0.180 0.215
0.018 0.024
0.018 0.024
0.235 0.245
0.250 0.265
0.090 BSC
0.370 0.410
0.055 0.070
0.114 REF
0.020 BSC
0.035 0.050
−−− 0.040
0.155
−−−
MILLIMETERS
MIN
MAX
2.18
2.38
0.00
0.13
0.63
0.89
0.72
1.14
4.57
5.46
0.46
0.61
0.46
0.61
5.97
6.22
6.35
6.73
2.29 BSC
9.40 10.41
1.40
1.78
2.90 REF
0.51 BSC
0.89
1.27
−−−
1.01
3.93
−−−
STYLE 8:
PIN 1. N/C
2. CATHODE
3. ANODE
4. CATHODE
L4
b2
e
TOP VIEW
NOTE 7
b
c
SIDE VIEW
M
BOTTOM VIEW
H
BOTTOM VIEW
ALTERNATE
CONSTRUCTION
0.005 (0.13)
C
L2
GAUGE
PLANE
C
L
SEATING
PLANE
L1
DETAIL A
ROTATED 90 CW
5
A1
SOLDERING FOOTPRINT*
6.20
0.244
3.00
0.118
2.58
0.102
STYLE 3:
PIN 1. ANODE
2. CATHODE
3. ANODE
4. CATHODE
5.80
0.228
1.60
0.063
6.17
0.243
SCALE 3:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and the
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation
or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which
the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or
unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
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