Active Delay Line, 3-Func, 1-Tap, True Output, CMOS, DIP-14/8
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Data Delay Devices |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 14 |
| Reach Compliance Code | compliant |
| 其他特性 | MEETS MIL-D-23859; IN-HOUSE BURN-IN AND THERMAL SHOCK; TESTED NO LOAD CONDITIONS |
| 系列 | HC/UH |
| 输入频率最大值（fmax） | 3.33333 MHz |
| JESD-30 代码 | R-XDIP-T8 |
| 逻辑集成电路类型 | ACTIVE DELAY LINE |
| 功能数量 | 3 |
| 抽头/阶步数 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出极性 | TRUE |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 可编程延迟线 | NO |
| 认证状态 | Not Qualified |
| 座面最大高度 | 8.636 mm |
| 最大供电电压 (Vsup) | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 总延迟标称（td） | 100 ns |
| 宽度 | 7.62 mm |
| MDU-3C-100ME7 | MDU-3C-50ME7 | MDU-3C-40ME7 | MDU-3C-75ME7 | MDU-3C-20ME7 | MDU-3C-25ME7 | MDU-3C-30ME7 | MDU-3C-15ME7 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Active Delay Line, 3-Func, 1-Tap, True Output, CMOS, DIP-14/8 | Active Delay Line, 3-Func, 1-Tap, True Output, CMOS, DIP-14/8 | Active Delay Line, 3-Func, 1-Tap, True Output, CMOS, DIP-14/8 | Active Delay Line, 3-Func, 1-Tap, True Output, CMOS, DIP-14/8 | Active Delay Line, 3-Func, 1-Tap, True Output, CMOS, DIP-14/8 | Active Delay Line, 3-Func, 1-Tap, True Output, CMOS, DIP-14/8 | Active Delay Line, 3-Func, 1-Tap, True Output, CMOS, DIP-14/8 | Active Delay Line, 3-Func, 1-Tap, True Output, CMOS, DIP-14/8 |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| 包装说明 | DIP, | DIP, | DIP, | DIP, | DIP, | DIP-14/8 | DIP, | DIP-14/8 |
| 针数 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| 其他特性 | MEETS MIL-D-23859; IN-HOUSE BURN-IN AND THERMAL SHOCK; TESTED NO LOAD CONDITIONS | MEETS MIL-D-23859; IN-HOUSE BURN-IN AND THERMAL SHOCK; TESTED NO LOAD CONDITIONS | MEETS MIL-D-23859; IN-HOUSE BURN-IN AND THERMAL SHOCK; TESTED NO LOAD CONDITIONS | MEETS MIL-D-23859; IN-HOUSE BURN-IN AND THERMAL SHOCK; TESTED NO LOAD CONDITIONS | MEETS MIL-D-23859; IN-HOUSE BURN-IN AND THERMAL SHOCK; TESTED NO LOAD CONDITIONS | MEETS MIL-D-23859; IN-HOUSE BURN-IN AND THERMAL SHOCK; TESTED NO LOAD CONDITIONS | MEETS MIL-D-23859; IN-HOUSE BURN-IN AND THERMAL SHOCK; TESTED NO LOAD CONDITIONS | MEETS MIL-D-23859; IN-HOUSE BURN-IN AND THERMAL SHOCK; TESTED NO LOAD CONDITIONS |
| 系列 | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH |
| 输入频率最大值（fmax） | 3.33333 MHz | 6.66667 MHz | 8.33333 MHz | 4.44444 MHz | 16.6667 MHz | 13.3333 MHz | 11.1111 MHz | 22.2222 MHz |
| JESD-30 代码 | R-XDIP-T8 | R-XDIP-T8 | R-XDIP-T8 | R-XDIP-T8 | R-XDIP-T8 | R-XDIP-T8 | R-XDIP-T8 | R-XDIP-T8 |
| 逻辑集成电路类型 | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE |
| 功能数量 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| 抽头/阶步数 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 可编程延迟线 | NO | NO | NO | NO | NO | NO | NO | NO |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 8.636 mm | 8.636 mm | 8.636 mm | 8.636 mm | 8.636 mm | 8.636 mm | 8.636 mm | 8.636 mm |
| 最大供电电压 (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 总延迟标称（td） | 100 ns | 50 ns | 40 ns | 75 ns | 20 ns | 25 ns | 30 ns | 15 ns |
| 宽度 | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
| 厂商名称 | Data Delay Devices | Data Delay Devices | Data Delay Devices | - | Data Delay Devices | Data Delay Devices | Data Delay Devices | Data Delay Devices |
模拟与混合信号
DSP 与 ARM 处理器
FPGA/CPLD
综合技术交流
stm32/stm8
51单片机
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
