AN5569
Standard Waveforms
Application Note
AN5569-1.1 JULY 2005 ( LN24023)
SINGLE PHASE
Circuit and output voltage waveform across a - b
Fig. 1 : Half wave
Fig. 2 : Full wave centre tap
Fig. 3 : Full wave bridge
Current Ratios
Fundamental
Ripple
Frequency
Half
Wave
Half
Wave
Centre
Tap
Full
Wave
Bridge
I
AV
/I
DC
R
1f
1.0
1.57
I
RMS
/I
DCA
L
-
I
PK
/I
DCB
R
3.14
L
-
R
1.57
I
PK
/I
DCC
L
-
2.22
E
RMS
/E
DCD
Voltage Ratios
E
RMS
/E
DCE
E
PK
/E
DCF
1.57
3.14
2f
0.5
0.785
0.707
1.57
1.0
0.785
0.707
1.11
2.22
1.57
2f
0.5
0.785
0.707
1.57
1.0
1.11
1.0
1.11
1.11
1.57
NOTES
R = Resistive load.
L = Inductive load.
A = Ratio of RMS current to DC output current. Arm fuses are rated for this RMS current.
B = Ratio of peak device current to DC output current.
C = Ratio of secondary RMS line current from supply to DC output current. Line fuses are rated for this RMS current.
D = Ratio of no load RMS line to line voltage to no load DC voltage.
E = Ratio of RMS phase voltage to DC voltage.
F = Ratio of peak phase voltage to DC voltage.
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AN5569 Application Note
THREE PHASE
Circuit and output voltage waveform across a - b
Fig. 4 : Half wave
Fig. 5 : Bridge
Fig. 6: Double star
Current Ratios
Fundamental
Ripple
Frequency
I
AV
/I
DC
R
Half
Wave
3f
0.33
0.588
I
RMS
/I
DCA
L
0.577
I
PK
/I
DCB
R
1.21
L
1.0
R
0.588
I
PK
/I
DCC
L
0.577
1.48
E
RMS
/E
DCD
Voltage Ratios
E
RMS
/E
DCE
E
PK
/E
DCF
0.855
2.1
Bridge
6f
0.33
0.588
0.577
1.05
1.0
0.816
0.816
0.74
0.427
1.05
Double
Star
6f
0.167
0.293
0.289
0.525
0.5
0.293
0.289
1.48
0.855
2.42
NOTES
R = Resistive load.
L = Inductive load.
A = Ratio of RMS current to DC output current. Arm fuses are rated for this RMS current.
B = Ratio of peak device current to DC output current.
C = Ratio of secondary RMS line current from supply to DC output current. Line fuses are rated for this RMS current.
D = Ratio of no load RMS line to line voltage to no load DC voltage.
E = Ratio of RMS phase voltage to DC voltage.
F = Ratio of peak phase voltage to DC voltage.
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AN5569 Application Note
SIX PHASE
Circuit and output voltage waveform across a - b
Fig. 7 : 5 Star limb core
Fig. 8 : Series bridges
Fig. 9 : Star delta with IPT
Current Ratios
Fundamental
Ripple
Frequency
5 Star
Limb
Core
Series
Bridges
Star
Delta
with
IPT
I
AV
/I
DC
R
6f
0.167
0.408
I
RMS
/I
DCA
L
0.408
I
PK
/I
DCB
R
1.05
L
0.5
R
0.408
I
PK
/I
DCC
L
0.408
1.48
E
RMS
/E
DCD
Voltage Ratios
E
RMS
/E
DCE
E
PK
/E
DCF
0.74
2.1
12f
0.33
0.588
0.577
1.05
1.0
0.816
0.816
0.37
-
1.05
12f
0.167
0.293
0.289
0.525
0.5
0.408
0.408
0.74
-
1.05
NOTES
R = Resistive load.
L = Inductive load.
A = Ratio of RMS current to DC output current. Arm fuses are rated for this RMS current.
B = Ratio of peak device current to DC output current.
C = Ratio of secondary RMS line current from supply to DC output current. Line fuses are rated for this RMS current.
D = Ratio of no load RMS line to line voltage to no load DC voltage.
E = Ratio of RMS phase voltage to DC voltage.
F = Ratio of peak phase voltage to DC voltage.
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AN5569 Application Note
POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the
basic semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in
device voltages and current capability of our semiconductors.
We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general
use today. The Assembly group offers high quality engineering support dedicated to designing new units to satisfy
the growing needs of our customers.
Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly
Complete Solution (PACs).
HEATSINKS
The Power Assembly group has its own proprietary range of extruded aluminium heatsinks, which have been,
designed to optimise the performance of Dynex semiconductors. Data with respect to air natural, forced air and
liquid cooling (with flow rates) is available on request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest sales
representative or Customer Services.
http://www.dynexsemi.com
e-mail: power_solutions@dynexsemi.com
HEADQUARTERS OPERATIONS
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln
Lincolnshire, LN6 3LF. United Kingdom.
Fax: +44(0)1522 500550
CUSTOMER SERVICE
Tel: +44(0)1522 502753 / 502901. Fax: +44(0)1522 500020
Tel: +44(0)1522 500500
©
Dynex Semiconductor 2003 TECHNICAL DOCUMENTATION – NOT FOR
RESALE. PRODUCED IN UNITED KINGDOM.
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follows:-
Target Information:
This is the most tentative form of information and represents a very preliminary specification. No
actual design work on the product has been started.
Preliminary Information:
The product is in design and development. The datasheet represents the product as it is understood but details may
change.
Advance Information:
The product design is complete and final characterisation for volume production is well in hand.
No Annotation:
The product parameters are fixed and the product is available to datasheet specification.
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suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible
methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user’s responsibility to
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products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided
subject to the Company’s conditions of sale, which are available on request.
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