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HYMP125U64CP8-5

产品描述DDR DRAM, 256MX64, CMOS, ROHS COMPLIANT, DIMM-240
产品类别存储    存储   
文件大小261KB,共29页
制造商SK Hynix(海力士)
官网地址http://www.hynix.com/eng/
标准
下载文档 详细参数 选型对比 全文预览

HYMP125U64CP8-5概述

DDR DRAM, 256MX64, CMOS, ROHS COMPLIANT, DIMM-240

HYMP125U64CP8-5规格参数

参数名称属性值
是否Rohs认证符合
厂商名称SK Hynix(海力士)
零件包装代码DIMM
包装说明ROHS COMPLIANT, DIMM-240
针数240
Reach Compliance Codecompliant
ECCN代码EAR99
访问模式DUAL BANK PAGE BURST
其他特性AUTO/SELF REFRESH
JESD-30 代码R-XDMA-N240
内存密度17179869184 bit
内存集成电路类型DDR DRAM
内存宽度64
功能数量1
端口数量1
端子数量240
字数268435456 words
字数代码256000000
工作模式SYNCHRONOUS
最高工作温度55 °C
最低工作温度
组织256MX64
封装主体材料UNSPECIFIED
封装代码DIMM
封装形状RECTANGULAR
封装形式MICROELECTRONIC ASSEMBLY
峰值回流温度(摄氏度)NOT SPECIFIED
认证状态Not Qualified
自我刷新YES
最大供电电压 (Vsup)1.9 V
最小供电电压 (Vsup)1.7 V
标称供电电压 (Vsup)1.8 V
表面贴装NO
技术CMOS
温度等级COMMERCIAL
端子形式NO LEAD
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED

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240pin DDR2 SDRAM Unbuffered DIMMs based on 1Gb C version
This Hynix unbuffered Dual In-Line Memory Module(DIMM) series consists of 1Gb version C DDR2
SDRAMs in Fine Ball Grid Array(FBGA) packages on a 240pin glass-epoxy substrate. This Hynix 1Gb ver-
sion C based DDR2 Unbuffered DIMM series provide a high performance 8 byte interface in 133.35mm
width form factor of industry standard. It is suitable for easy interchange and addition.
FEATURES
JEDEC standard Double Data Rate2 Syn-
chrnous DRAMs (DDR2 SDRAMs) with 1.8V +/
- 0.1V Power Supply
All inputs and outputs are compatible with
SSTL_1.8 interface
8 Bank architecture
Posted CAS
Programmable CAS Latency 3 ,4 ,5, 6
OCD (Off-Chip Driver Impedance Adjustment)
ODT (On-Die Termination)
Fully differential clock operations (CK & CK)
Programmable Burst Length 4 / 8 with both
sequential and interleave mode
Auto refresh and self refresh supported
8192 refresh cycles / 64ms
Serial presence detect with EEPROM
DDR2 SDRAM Package: 60ball
FBGA(128Mx8), 84ball FBGA(64Mx16)
133.35 x 30.00 mm form factor
RoHS compliant
ORDERING INFORMATION
Part Name
HYMP164U64CP6-C4/Y5/S6/S5
HYMP164U64CR6-C4/Y5/S6/S5
HYMP112U64CP8-C4/Y5/S6/S5
HYMP112U64CR8-C4/Y5/S6/S5
HYMP112U72CP8-C4/Y5/S6/S5
HYMP125U64CP8-C4/Y5/S6/S5
HYMP125U64CR8-C4/Y5/S6/S5
HYMP125U72CP8-C4/Y5/S6/S5
Density
512MB
512MB
1GB
1GB
1GB
2GB
2GB
2GB
Org.
64Mx64
64Mx64
128Mx64
128Mx64
128Mx72
256Mx64
256Mx64
256Mx72
# of
DRAMs
4
4
8
8
9
16
16
18
# of
ranks
1
1
1
1
1
2
2
2
Materials
Lead-free
Halogen-free
Lead-free
Halogen-free
Lead-free
Lead-free
Halogen-free
Lead-free
ECC
None
None
None
None
ECC
None
None
ECC
This document is a general product description and is subject to change without notice. Hynix Semiconductor does not assume any
responsibility for use of circuits described. No patent licenses are implied.
Rev. 0.6 / Jul. 2008
1

HYMP125U64CP8-5相似产品对比

HYMP125U64CP8-5 HYMP164U64CR6-C4 HYMP164U64CP6-S6 HYMP112U72CP8-S5 HYMP112U72CP8-Y5 HYMP125U64CR8-S6 HYMP164U64CR6-Y5 HYMP125U64CP8-Y5
描述 DDR DRAM, 256MX64, CMOS, ROHS COMPLIANT, DIMM-240 DDR DRAM, 64MX64, 0.5ns, CMOS, ROHS COMPLIANT, DIMM-240 DDR DRAM Module, 64MX64, 0.4ns, CMOS, ROHS COMPLIANT, DIMM-240 DDR DRAM Module, 128MX72, 0.4ns, CMOS, ROHS COMPLIANT, DIMM-240 DDR DRAM Module, 128MX72, 0.45ns, CMOS, ROHS COMPLIANT, DIMM-240 DDR DRAM, 256MX64, 0.4ns, CMOS, ROHS COMPLIANT, DIMM-240 DDR DRAM, 64MX64, 0.45ns, CMOS, ROHS COMPLIANT, DIMM-240 DDR DRAM Module, 256MX64, 0.45ns, CMOS, ROHS COMPLIANT, DIMM-240
是否Rohs认证 符合 符合 符合 符合 符合 符合 符合 符合
零件包装代码 DIMM DIMM DIMM DIMM DIMM DIMM DIMM DIMM
包装说明 ROHS COMPLIANT, DIMM-240 DIMM, DIMM240,40 DIMM, DIMM240,40 DIMM, DIMM240,40 DIMM, DIMM240,40 DIMM, DIMM240,40 DIMM, DIMM240,40 DIMM, DIMM240,40
针数 240 240 240 240 240 240 240 240
Reach Compliance Code compliant unknown compliant unknown unknown unknown unknown compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
访问模式 DUAL BANK PAGE BURST SINGLE BANK PAGE BURST SINGLE BANK PAGE BURST SINGLE BANK PAGE BURST SINGLE BANK PAGE BURST DUAL BANK PAGE BURST SINGLE BANK PAGE BURST SINGLE BANK PAGE BURST
其他特性 AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 代码 R-XDMA-N240 R-XDMA-N240 R-XZMA-N240 R-XZMA-N240 R-XZMA-N240 R-XDMA-N240 R-XDMA-N240 R-XZMA-N240
内存密度 17179869184 bit 4294967296 bit 4294967296 bit 9663676416 bit 9663676416 bit 17179869184 bit 4294967296 bit 17179869184 bit
内存集成电路类型 DDR DRAM DDR DRAM DDR DRAM MODULE DDR DRAM MODULE DDR DRAM MODULE DDR DRAM DDR DRAM DDR DRAM MODULE
内存宽度 64 64 64 72 72 64 64 64
功能数量 1 1 1 1 1 1 1 1
端口数量 1 1 1 1 1 1 1 1
端子数量 240 240 240 240 240 240 240 240
字数 268435456 words 67108864 words 67108864 words 134217728 words 134217728 words 268435456 words 67108864 words 268435456 words
字数代码 256000000 64000000 64000000 128000000 128000000 256000000 64000000 256000000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 55 °C 55 °C 55 °C 55 °C 55 °C 55 °C 55 °C 55 °C
组织 256MX64 64MX64 64MX64 128MX72 128MX72 256MX64 64MX64 256MX64
封装主体材料 UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
封装代码 DIMM DIMM DIMM DIMM DIMM DIMM DIMM DIMM
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
峰值回流温度(摄氏度) NOT SPECIFIED 260 260 260 260 260 260 260
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
自我刷新 YES YES YES YES YES YES YES YES
最大供电电压 (Vsup) 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V
最小供电电压 (Vsup) 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V
标称供电电压 (Vsup) 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
表面贴装 NO NO NO NO NO NO NO NO
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子形式 NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD
端子位置 DUAL DUAL ZIG-ZAG ZIG-ZAG ZIG-ZAG DUAL DUAL ZIG-ZAG
处于峰值回流温度下的最长时间 NOT SPECIFIED 20 20 20 20 20 20 20
最长访问时间 - 0.5 ns 0.4 ns 0.4 ns 0.45 ns 0.4 ns 0.45 ns 0.45 ns
最大时钟频率 (fCLK) - 266 MHz 200 MHz 400 MHz 333 MHz 400 MHz 333 MHz 333 MHz
I/O 类型 - COMMON COMMON COMMON COMMON COMMON COMMON COMMON
输出特性 - 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
封装等效代码 - DIMM240,40 DIMM240,40 DIMM240,40 DIMM240,40 DIMM240,40 DIMM240,40 DIMM240,40
电源 - 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
刷新周期 - 8192 8192 8192 8192 8192 8192 8192
最大待机电流 - 0.04 A 0.04 A - - 0.16 A 0.04 A 0.18 A
端子节距 - 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm
Base Number Matches - 1 1 1 1 1 1 1

 
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