Bus Driver, CB3Q/3VH/3C/2B Series, 2-Func, 5-Bit, True Output, CMOS, PDSO24, 0.150 INCH, PLASTIC, TSSOP-24
参数名称 | 属性值 |
厂商名称 | Pericom Semiconductor Corporation (Diodes Incorporated) |
零件包装代码 | TSSOP |
包装说明 | TSSOP, |
针数 | 24 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
系列 | CB3Q/3VH/3C/2B |
JESD-30 代码 | R-PDSO-G24 |
JESD-609代码 | e0 |
长度 | 7.8 mm |
逻辑集成电路类型 | BUS DRIVER |
位数 | 5 |
功能数量 | 2 |
端口数量 | 2 |
端子数量 | 24 |
最高工作温度 | 85 °C |
最低工作温度 | |
输出特性 | 3-STATE |
输出极性 | TRUE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSSOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
传播延迟(tpd) | 1 ns |
认证状态 | Not Qualified |
座面最大高度 | 1.2 mm |
最大供电电压 (Vsup) | 2.7 V |
最小供电电压 (Vsup) | 2.3 V |
标称供电电压 (Vsup) | 2.5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | OTHER |
端子面层 | TIN LEAD |
端子形式 | GULL WING |
端子节距 | 0.65 mm |
端子位置 | DUAL |
宽度 | 4.4 mm |
PI2B3857L | PI2B3857QX | PI2B3857LX | PI2B3857Q | |
---|---|---|---|---|
描述 | Bus Driver, CB3Q/3VH/3C/2B Series, 2-Func, 5-Bit, True Output, CMOS, PDSO24, 0.150 INCH, PLASTIC, TSSOP-24 | Bus Driver, CB3Q/3VH/3C/2B Series, 2-Func, 5-Bit, True Output, CMOS, PDSO24, 0.150 INCH, PLASTIC, QSOP-24 | Bus Driver, CB3Q/3VH/3C/2B Series, 2-Func, 5-Bit, True Output, CMOS, PDSO24, 0.150 INCH, PLASTIC, TSSOP-24 | Bus Driver, CB3Q/3VH/3C/2B Series, 2-Func, 5-Bit, True Output, CMOS, PDSO24, 0.150 INCH, PLASTIC, QSOP-24 |
零件包装代码 | TSSOP | SOIC | TSSOP | SOIC |
包装说明 | TSSOP, | SSOP, | TSSOP, | SSOP, |
针数 | 24 | 24 | 24 | 24 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
系列 | CB3Q/3VH/3C/2B | CB3Q/3VH/3C/2B | CB3Q/3VH/3C/2B | CB3Q/3VH/3C/2B |
JESD-30 代码 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 |
JESD-609代码 | e0 | e0 | e0 | e0 |
长度 | 7.8 mm | 8.65 mm | 7.8 mm | 8.65 mm |
逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
位数 | 5 | 5 | 5 | 5 |
功能数量 | 2 | 2 | 2 | 2 |
端口数量 | 2 | 2 | 2 | 2 |
端子数量 | 24 | 24 | 24 | 24 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
输出极性 | TRUE | TRUE | TRUE | TRUE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSSOP | SSOP | TSSOP | SSOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH |
传播延迟(tpd) | 1 ns | 1 ns | 1 ns | 1 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.2 mm | 1.75 mm | 1.2 mm | 1.75 mm |
最大供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
最小供电电压 (Vsup) | 2.3 V | 2.3 V | 2.3 V | 2.3 V |
标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
表面贴装 | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS |
温度等级 | OTHER | OTHER | OTHER | OTHER |
端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.65 mm | 0.635 mm | 0.65 mm | 0.635 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL |
宽度 | 4.4 mm | 3.9116 mm | 4.4 mm | 3.9116 mm |
厂商名称 | Pericom Semiconductor Corporation (Diodes Incorporated) | - | Pericom Semiconductor Corporation (Diodes Incorporated) | Pericom Semiconductor Corporation (Diodes Incorporated) |
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