Hebei I.T. (Shanghai) Co., Ltd
LED SPECIFICATION
Part No.
¾
Features/
z
Single color/
z
High bright output/
z
Low power consumption/
z
High reliability and long life/
t
130PG2C
¾
Descriptions/
z
z
z
z
Dice material/
Emitting Color/
InGaN
Super Bright Blue Green/
Device Outline/
Special Type/
Lens Type
Water Clear/
2.4±0.2
0.2
.7±
R1
1.
.2
±0
8
3.3±0.2
2.4±0.2
3±0.2
1.6±0.2
CATHODE
25.4min
2.54±0.2
1±0.2
NOTE:
z
z
All dimensions are millimeters/
mm.
.
Tolerance is +/-0.25mm unless otherwise noted/
0.25mm
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1.0Max
0.5±0.2
Page: 1 of 3
Hebei I.T. (Shanghai) Co., Ltd
LED SPECIFICATION
Part No.
Absolute maximum ratings/
Ta = 25
130PG2C
Parameter
Reverse Voltage
Forward Current
Power Dissipation
Pulse Current
Operating Temperature
Storage
Temperature
Symbol
Test Condition
Values
Min.
Max.
--
30
80
100
+85
+100
Unit
V
R
I
F
P
d
I
peak
T
opr
T
str
I
R
= 30 A
----
----
Duty=0.1mS 1kHz
----
----
5
----
----
----
-40
-40
V
mA
mW
mA
¾
Electrical and optical characteristics/
Parameter
Forward Voltage
Reverse Current
Dominate Wavelength
Peak Wavelength
Spectral Line half-width
Luminous Intensity
I
V
Symbol
Test Condition
Ta = 25
Values
Min.
Typ.
3.2
----
525
520
25
1500
Max.
3.6
30
----
----
----
----
V
A
nm
nm
nm
mcd
Unit
V
F
I
R
d
p
I
F
= 20mA
V
R
= 5V
I
F
= 20mA
I
F
= 20mA
I
F
= 20mA
I
F
= 20mA
----
----
----
----
----
----
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Page: 2 of 3
Hebei I.T. (Shanghai) Co., Ltd
LED SPECIFICATION
Part No.
¾
Typical electrical/optical characteristic curves
/
Fig.1
50
40
30
20
10
0
1.7
Luminous Intensity
Relative Value at IF=20mA
Forward Current(mA)
130PG2C
Vs.
2.5
2.0
1.5
1.0
0.5
0
Fig.2
Vs.
1.9
2.1 2.3 2.5
Forward Voltage(V)
2.7
0
40
10
20
30
IF-Forward Current (mA)
50
Fig.3
50
Forward Current(mA)
40
30
20
10
0
0
20
40
Vs.
Relative Luminous Intensity
2.5
2.0
1.5
1.0
0.5
0
-40
Fig.4
Vs.
60
80
)
100
Ambient Temperature T
A (
-20
40
60
0
20
Ambient Temperature T
A (
80 90
)
Fig.5
Relative Luminous Intensity
100
75
50
25
0
400
450
Vs.
500
550
(nm)/
600
650
Wavelength
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Page: 3 of 3
BIN ranking for LEDs
BRIGHTNESS BIN
Bin Code
A
B
C
D
E
F
G
IV(mcd)
0-5.0
5.0-7.0
7.0-9.8
9.8-13.7
13.7-19.0
19.0-26.6
26.6-37.2
Bin Code
H
J
K
L
M
N
P
IV(mcd) Bin Code
37.2-52.0
52.0-72.8
72.8-102
102-145
145-200
200-280
280-390
Q
R
S
T
U
V
W
IV(mcd)
390-550
550-770
770-1100
1100-1520
1520-2130
2130-3000
3000-4180
Bin Code
X
Y
Z1
Z2
Z3
Z4
Z5
IV(mcd)
4180--5860
5860-8200
8-10cd
10-12cd
12-14cd
14-16cd
16-18cd
WAVELENGTH BIN
Ligth Col. Bin Code Wavel. (nm) Ligth Col. Bin Code Wavel. (nm)
B1
B2
B3
B4
B5
B6
G1
G2
BLUE
GREEN
G3
G4
G5
G6
G7
G8
G9
G10
G11
G12
G13
PURE
GREEN
G14
G15
G16
G17
G18
G19
450-455
455-460
460-465
465-470
470-475
475-480
491-494
494-497
497-500
500-503
503-506
506-509
509-512
512-515
515-518
518-521
521-524
524-527
527-530
530-533
533-536
536-539
539-542
542-545
545-548
RED
PURE
ORANGE
YELLOW
ORANGE
YELLOW
YG1
YG2
YG3
YG4
YG5
YG6
YG7
Y1
Y2
Y3
Y4
Y5
YO1
YO2
YO3
YO4
O1
O2
O3
R1
R2
R3
R4
R5
R6
555-558
558-561
561-564
564-567
567-570
570-573
573-576
582-585
585-588
588-591
591-594
594-597
597-600
600-603
603-606
606-609
609-612
612-615
615-618
618-621
621-624
624-627
627-630
630-633
633-636
BLUE
YELLOW
GREEN
FORWARD VOLTAGE (VF) BIN
Bin Code
V1
V2
V3
V4
VF (V)
1.6-1.8
1.8-2.0
2.0-2.2
2.2-2.4
Bin Code
V5
V6
V7
V8
VF (V)
2.4-2.6
2.6-2.8
2.8-3.0
3.0-3.2
Bin Code
V9
V10
V11
V12
VF (V)
3.2-3.4
3.4-3.6
3.6-3.8
3.8-4.0
Bin Code
V13
V14
V15
V16
VF (V)
4.0-4.2
4.2-4.4
4.4-4.6
4.6-4.8
Page:4
LED
ySOLDERING
METHOD
LAMP APPLICATION
SOLDERING CONDITIONS
REMARK
y
Solder no closer than 3mm from the
base of the package
y
Using soldering flux,” RESIN FLUX”
is recommended.
y
During soldering, take care not to
press the tip of iron against the
DIP
SOLDERING
Bath temperature: 260±5
Immersion time: with 5 sec
Soldering iron: 30W or smaller
lead.
SOLDERING
Temperature at tip of iron: 260 or lower (To prevent heat from being
IRON
Soldering time: within 5 sec.
transferred directly to the lead, hold
the lead with a pair of tweezers
while soldering
1) When soldering the lead of LED in a condition that the package is fixed with a panel (See Fig.1),
be careful not to stress the leads with iron tip.
/HDG ZULHV
3DQHO
2) When soldering wire to the lead, work with a Fig (See Fig.2) to avoid stressing the package.
/HDG ZULHV
/HDYH D VOLJKW
FOHDUDQFH
Page : 5
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