SYZ6040
DC Input
400V
Photo SCR / Thyristor
Description
The SYZ6040 consists of a single input AlGaAs LED
optically coupled to a photo-sensitive SCR.
Optical
coupling provides high isolation levels (up to 5kV
RMS
) while
maintaining low-level DC signal control capability. With
high load voltage and low input current, the SYZ6040 is an
ideal solution for driving SCRs, Triacs and Solid State
Relays.
The SYZ6040 comes standard in a compact 6 pin DIP
package making it ideal for high-density board applications.
Features
Low Input Control Current (5mA MAX)
High Blocking Voltage (400V)
400mA Maximum Continuous Current
High Isolation Voltage (up to 5kV
RMS
)
High Transient Immunity (dV/dt = 400V/S MIN)
Long Life / High Reliability
RoHS / Pb-Free / REACH Compliant
Agency Approvals
Applications
Home Appliances
Motor / Drive Controls
Solid State Relays
Solenoid / Valve Controls
Temperature Controls
Dimmer Controls
UL/C-UL:
VDE:
File # E201932
File # 40035191 (EN 60747-5-2)
Absolute Maximum Ratings
The values indicated are absolute stress ratings. Functional
operation of the device is not implied at these or any
conditions in excess of those defined in electrical
characteristics section of this document. Exposure to
absolute Maximum Ratings may cause permanent damage
to the device and may adversely affect reliability.
Storage Temperature …………………………..-55 to +125°C
Operating Temperature …….………...…..……-40 to +85°C
Continuous Input Current ………………………………..50mA
Transient Input Current ………………….……………..400mA
Transient Output Current ………………………..……….10A
Reverse Input Control Voltage …………..…………………5V
Input Power Dissipation …………………………………40mW
Output Power Dissipation ……………………………..500mW
Solder Temperature – Wave (10sec)……………….….260°C
Solder Temperature – IR Reflow (10sec)….…………..260°C
Schematic Diagram
(+) Input
1
6
Gate
(-) Input
2
5
Anode
Ordering Information
Part Number
Do Not Connect
3
4
Cathode
Description
6 pin DIP, (60/Tube)
5kV
RMS
V
ISO
, 6 pin DIP, (60/Tube)
6 pin SMD, (60/Tube)
5kV
RMS
, 6 pin SMD, (60/Tube)
6 pin SMD, Tape and Reel (1000/Reel)
5kV
RMS
, 6 pin SMD, Tape and Reel (1000/Reel)
SYZ6040
SYZ6040
SYZ6040-H
SYZ6040-S
SYZ6040-HS
SYZ6040-STR
SYZ6040-HSTR
NOTE: Suffixes listed above are not included in marking on
device for part number identification
© 2013 Solid State Optronics
•
San José, CA
www.ssousa.com
•
+1.408.293.4600
Page 1 of 8
SYZ6040 /H/S/TR
Rev 2.00 (11/25/2013)
001761
SYZ6040
DC Input
400V
Photo SCR / Thyristor
Electrical Characteristics,
T
A
= 25°C (unless otherwise specified)
Parameter
Input Specifications
LED Forward Voltage
LED Reverse Voltage
Reverse Leakage Current
Trigger (Must Operate) Current
1
Symbol
V
F
BV
R
I
InRleak
I
InOn
Min.
-
5
-
-
Typ.
1.2
-
-
2.5
Max.
1.5
-
10
5
Units
V
V
A
mA
Test Conditions
I
F
= 10mA
I
R
= 10μA
V
R
= 5μA
I
O
= 400mA
Output Specifications
Forward Blocking Voltage
Reverse Blocking Voltage
Continuous Load Current
Transient Surge Current
On-State Voltage
Forward Leakage Current
Reverse Leakage Current
Gate Trigger Voltage
Gate Trigger Current
Critical Rate of Rise
2
V
DM
V
RM
I
DM
I
DM (PEAK)
V
TM
I
DM
I
RM
V
GT
I
GT
dV/dt
400
400
-
-
-
-
-
-
-
400
-
-
-
-
1.1
1
1
0.6
20
-
-
-
400
10
1.4
10
10
1
50
-
V
V
mA
A
V
A
A
V
A
V/S
R
GK
=10kΩ, T
A
=100°C, I
D
=150A
R
GK
=10kΩ, T
A
=100°C, I
R
=150A
I
F
= 5mA
T = 16S
I
F
= 5mA, I
DM
= 400mA
R
GK
=10kΩ, T
A
=100°C, V
DM
=400V, I
F
=0
R
GK
=10kΩ, T
A
=100°C, V
RM
=400V, I
F
=0
V
FX
=100V, R
GK
=27kΩ, R
L
=10kΩ
V
FX
=100V, R
GK
=27kΩ, R
L
=10kΩ
-
Isolation Specifications
Isolation Voltage
(-H Option)
Input-Output Resistance
Note 1:
Note 2:
V
ISO
R
I-O
3750
5000
-
-
10
12
-
-
V
RMS
RH
≤
50%, t=1min
V
I-O
= 500V
DC
Resistive load. For inductive loads, higher drive current is recommended
This is for static dV/dt.
© 2013 Solid State Optronics
•
San José, CA
www.ssousa.com
•
+1.408.293.4600
Page 2 of 8
SYZ6040 /H/S/TR
Rev 2.00 (11/25/2013)
001761
SYZ6040
DC Input
400V
Photo SCR / Thyristor
SYZ6040 Solder Temperature Profile Recommendations
(1)
Infrared Reflow:
Refer to the following figure as an example of an optimal temperature profile for single occurrence infrared reflow.
Soldering process should not exceed temperature or time limits expressed herein. Surface temperature of device
package should not exceed 250ºC:
G
F
D
E
H
B
A
C
Figure 1
Process
Step
A
B
C
D
E
F
G
H
Description
Preheat Start Temperature (ºC)
Preheat Finish Temperature (ºC)
Preheat Time (s)
Melting Temperature (ºC)
Time above Melting Temperature (s)
Peak Temperature, at Terminal (ºC)
Dwell Time at Peak Temperature (s)
Cool-down (ºC/s)
150ºC
180ºC
90 - 120s
230ºC
30s
260ºC
10s
<6ºC/s
Parameter
(2)
Wave Solder:
Maximum Temperature:
Maximum Time:
Pre-heating:
Single Occurrence
260ºC (at terminal)
10s
100 - 150ºC (30 - 90s)
(3)
Hand Solder:
Maximum Temperature:
Maximum Time:
Single Occurrence
350ºC
3s
(at tip of soldering iron)
© 2013 Solid State Optronics
•
San José, CA
www.ssousa.com
•
+1.408.293.4600
Page 4 of 8
SYZ6040 /H/S/TR
Rev 2.00 (11/25/2013)
001761
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