Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
SAK-XC878-13FFA 5V AC
MA001414114
PG-LQFP-64-5
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
Substances
silicon
magnesium
silicon
nickel
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7439-95-4
7440-21-3
7440-02-0
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
10.632
0.172
0.743
3.431
110.016
2.078
1.194
32.228
205.307
4.169
1.663
0.626
1.879
Average
Mass
[%]
2.84
0.05
0.20
0.92
29.41
0.56
0.32
8.61
54.87
1.11
0.44
0.17
0.50
14. October 2015
374.14 mg
Sum
[%]
2.84
Average
Mass
[ppm]
28416
458
1987
9170
30.58
0.56
294052
5553
3190
86141
63.80
1.11
0.44
548749
11143
4445
1674
0.67
5022
6696
1000000
638080
11143
4445
305667
5553
Sum
[ppm]
28416
wire
encapsulation
leadfinish
plating
glue
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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