Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BTT6050-2EKA
MA001413438
PG-DSO-14-40
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
Substances
silicon
phosphorus
zinc
iron
copper
copper
carbon black
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-50-8
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
3.421
0.017
0.070
1.392
56.512
1.065
0.168
7.708
75.903
1.241
1.417
0.184
0.866
Average
Mass
[%]
2.28
0.01
0.05
0.93
37.68
0.71
0.11
5.14
50.61
0.83
0.95
0.12
0.58
14. October 2015
149.96 mg
Sum
[%]
2.28
Average
Mass
[ppm]
22813
116
464
9281
38.67
0.71
376838
7101
1117
51396
55.86
0.83
0.95
506144
8278
9452
1225
0.70
5775
7000
1000000
558657
8278
9452
386699
7101
Sum
[ppm]
22813
wire
encapsulation
leadfinish
plating
glue
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
FPGA/CPLD
京公网安备 11010802033920号
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