Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPC80N04S4-03
MA001255710
PG-TDSON-8-23
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
inorganic material
non noble metal
noble metal
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
phosphorus
nickel
silver
tin
lead
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7723-14-0
7440-02-0
7440-22-4
7440-31-5
7439-92-1
Issued
Weight*
Weight
[mg]
1.776
0.053
0.016
52.469
1.108
0.083
5.862
35.334
1.535
0.002
0.632
0.044
0.035
1.681
Average
Mass
[%]
1.77
0.05
0.02
52.14
1.10
0.08
5.82
35.11
1.53
0.00
0.63
0.04
0.04
1.67
15. June 2015
100.63 mg
Sum
[%]
1.77
Average
Mass
[ppm]
17651
522
157
52.21
1.10
521415
11006
820
58250
41.01
1.53
351138
15251
15
0.63
6280
437
350
1.75
16708
17495
1000000
6295
410208
15251
522094
11006
Sum
[ppm]
17651
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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