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MA001171646_15

产品描述Material Content Data Sheet
文件大小29KB,共1页
制造商Infineon(英飞凌)
官网地址http://www.infineon.com/
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MA001171646_15概述

Material Content Data Sheet

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Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPZ40N04S5L-7R4
MA001171646
PG-TSDSON-8-32
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
phosphorus
zinc
iron
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
silver
tin
lead
phosphorus
zinc
iron
copper
phosphorus
zinc
iron
copper
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7723-14-0
7440-66-6
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
0.174
0.003
0.012
0.249
10.102
0.031
0.038
1.936
16.822
0.400
0.086
0.008
0.007
0.318
0.001
0.002
0.047
1.908
0.001
0.004
0.073
2.958
Average
Mass
[%]
0.49
0.01
0.04
0.71
28.72
0.09
0.11
5.50
47.82
1.14
0.24
0.02
0.02
0.90
0.00
0.01
0.13
5.42
0.00
0.01
0.21
8.41
9. June 2015
35.18 mg
Sum
[%]
0.49
Average
Mass
[ppm]
4936
88
354
7073
29.48
0.09
287174
876
1069
55033
53.43
1.14
0.24
478200
11378
2434
237
189
0.94
9036
17
67
1336
5.56
54228
26
104
2071
8.63
84074
86275
1000000
55648
9462
534302
11378
2434
294689
876
Sum
[ppm]
4936
wire
encapsulation
leadfinish
plating
solder
heatspreader
heat sink CLIP
inorganic material
non noble metal
non noble metal
non noble metal
< 10%
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com

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