Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BSZ018NE2LSI
MA001021954
PG-TSDSON-8-26
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
phosphorus
zinc
iron
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
silver
tin
lead
phosphorus
zinc
iron
copper
phosphorus
zinc
iron
copper
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7723-14-0
7440-66-6
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
0.629
0.002
0.010
0.197
7.988
0.028
0.037
1.897
16.486
0.400
0.020
0.023
0.019
0.895
0.001
0.005
0.094
3.816
0.001
0.005
0.101
4.112
Average
Mass
[%]
1.71
0.01
0.03
0.54
21.73
0.08
0.10
5.16
44.83
1.09
0.06
0.06
0.05
2.43
0.00
0.01
0.26
10.38
0.00
0.01
0.28
11.18
17. June 2015
36.77 mg
Sum
[%]
1.71
Average
Mass
[ppm]
17110
67
268
5351
22.31
0.08
217265
759
1002
51602
50.09
1.09
0.06
448386
10885
553
637
510
2.54
24330
32
128
2556
10.65
103784
34
138
2755
11.47
111848
114775
1000000
106500
25477
500990
10885
553
222951
759
Sum
[ppm]
17110
wire
encapsulation
leadfinish
plating
solder
heatspreader
heat sink CLIP
inorganic material
non noble metal
non noble metal
non noble metal
< 10%
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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