Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BSC014N04LS
MA001021354
PG-TDSON-8-17
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
iron
phosphorus
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
silver
tin
lead
phosphorus
zinc
iron
copper
phosphorus
zinc
iron
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7723-14-0
7440-66-6
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
1.009
0.038
0.011
37.762
0.045
0.087
6.156
37.112
1.470
0.166
0.036
0.029
1.387
0.003
0.013
0.269
10.909
0.007
0.026
0.529
21.482
Average
Mass
[%]
0.85
0.03
0.01
31.86
0.04
0.07
5.19
31.31
1.24
0.14
0.03
0.02
1.17
0.00
0.01
0.23
9.20
0.01
0.02
0.45
18.12
15. June 2015
118.55 mg
Sum
[%]
0.85
Average
Mass
[ppm]
8514
319
96
31.90
0.04
318540
376
731
51933
36.57
1.24
0.14
313058
12399
1396
306
245
1.22
11699
28
113
2266
9.44
92024
56
223
4463
18.60
181215
185957
1000000
94431
12250
365722
12399
1396
318955
376
Sum
[ppm]
8514
wire
encapsulation
leadfinish
plating
solder
heatspreader
heat sink CLIP
*deviation
< 10%
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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