Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BSC028N06NS
MA001014854
PG-TDSON-8-7
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
noble metal
non noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
inorganic material
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
silver
tin
lead
iron
phosphorus
copper
iron
phosphorus
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
7440-22-4
7440-31-5
7439-92-1
7439-89-6
7723-14-0
7440-50-8
7439-89-6
7723-14-0
7440-50-8
Issued
Weight*
Weight
[mg]
0.837
0.038
0.011
37.762
0.045
0.087
6.183
37.271
1.470
0.166
0.031
0.024
1.168
0.011
0.003
11.320
0.022
0.007
22.292
Average
Mass
[%]
0.70
0.03
0.01
31.80
0.04
0.07
5.21
31.39
1.24
0.14
0.03
0.02
0.98
0.01
0.00
9.53
0.02
0.01
18.77
15. June 2015
118.75 mg
Sum
[%]
0.70
Average
Mass
[ppm]
7047
318
96
31.84
0.04
317999
377
733
52067
36.67
1.24
0.14
313868
12378
1394
258
206
1.03
9839
95
29
9.54
95329
188
56
18.80
187723
187967
1000000
95453
10303
366668
12378
1394
318413
377
Sum
[ppm]
7047
wire
encapsulation
leadfinish
plating
solder
heatspreader
heat sink CLIP
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
