Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPZ40N04S5-8R4
MA001338272
PG-TSDSON-8-32
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
phosphorus
zinc
iron
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
silver
tin
lead
phosphorus
zinc
iron
copper
phosphorus
zinc
iron
copper
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7723-14-0
7440-66-6
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
0.222
0.003
0.012
0.249
10.102
0.031
0.037
1.931
16.779
0.400
0.086
0.009
0.007
0.353
0.001
0.002
0.047
1.908
0.001
0.004
0.073
2.958
Average
Mass
[%]
0.63
0.01
0.04
0.71
28.69
0.09
0.11
5.48
47.63
1.14
0.24
0.03
0.02
1.00
0.00
0.01
0.13
5.42
0.00
0.01
0.21
8.40
15. June 2015
35.21 mg
Sum
[%]
0.63
Average
Mass
[ppm]
6311
88
353
7065
29.45
0.09
286879
875
1065
54834
53.22
1.14
0.24
476471
11367
2432
262
210
1.05
10013
17
67
1334
5.56
54172
26
103
2068
8.62
83988
86185
1000000
55590
10485
532370
11367
2432
294385
875
Sum
[ppm]
6311
wire
encapsulation
leadfinish
plating
solder
heatspreader
heat sink CLIP
inorganic material
non noble metal
non noble metal
non noble metal
< 10%
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com