Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
ESD3V3XU1US E6327
MA001012934
PG-TSSLP-2-1
Material Group
non noble metal
noble metal
inorganic material
non noble metal
noble metal
inorganic material
organic material
plastics
inorganic material
noble metal
noble metal
< 10%
Substances
tin
gold
silicon
nickel
gold
antimonytrioxide
carbon black
epoxy resin
silicondioxide
gold
silver
CAS#
if applicable
7440-31-5
7440-57-5
7440-21-3
7440-02-0
7440-57-5
1309-64-4
1333-86-4
-
60676-86-0
7440-57-5
7440-22-4
Issued
Weight*
Weight
[mg]
0.000
0.001
0.010
0.036
0.003
0.000
0.001
0.012
0.074
0.004
0.007
Average
Mass
[%]
0.23
0.91
6.72
24.38
1.69
0.03
0.58
7.87
49.84
2.76
4.99
11. May 2015
0.15 mg
Sum
[%]
Average
Mass
[ppm]
2340
9063
7.86
24.38
1.69
67178
243793
16927
295
5832
78741
58.32
2.76
4.99
498404
27572
49855
583272
27572
49855
1000000
78581
243793
16927
Sum
[ppm]
leadframe
wire
encapsulation
leadfinish
plating
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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