Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
wire
encapsulation
SPA02N80C3
MA000452950
PG-TO220-3-31
Material Group
inorganic material
non noble metal
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
non noble metal
non noble metal
non noble metal
< 10%
Substances
silicon
zinc
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
antimony
silver
tin
zinc
copper
CAS#
if applicable
7440-21-3
7440-66-6
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7440-36-0
7440-22-4
7440-31-5
7440-66-6
7440-50-8
Issued
Weight*
Weight
[mg]
2.280
0.925
615.788
20.625
2.223
208.942
900.228
6.250
0.679
0.165
0.412
1.071
0.746
496.335
Average
Mass
[%]
0.10
0.04
27.29
0.91
0.10
9.26
39.89
0.28
0.03
0.01
0.02
0.05
0.03
21.99
22. October 2015
2256.67 mg
Sum
[%]
0.10
Average
Mass
[ppm]
1010
410
27.33
0.91
272875
9139
985
92589
49.25
0.28
0.03
398919
2770
301
73
183
0.08
475
330
22.02
219941
220271
1000000
731
492493
2770
301
273285
9139
Sum
[ppm]
1010
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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