Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
XMC4400-F100K512 AB
MA001352460
PG-LQFP-100-11
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
Substances
silicon
phosphorus
zinc
iron
copper
copper
carbon black
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-50-8
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
33.863
0.072
0.286
5.726
232.490
2.192
2.334
63.028
401.513
9.873
2.029
2.363
7.090
Average
Mass
[%]
4.44
0.01
0.04
0.75
30.48
0.29
0.31
8.26
52.62
1.29
0.27
0.31
0.93
14. April 2015
762.86 mg
Sum
[%]
4.44
Average
Mass
[ppm]
44390
94
375
7506
31.28
0.29
304761
2874
3060
82621
61.19
1.29
0.27
526325
12942
2660
3098
1.24
9294
12392
1000000
612006
12942
2660
312736
2874
Sum
[ppm]
44390
wire
encapsulation
leadfinish
plating
glue
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com