Transistor Output SSR, 2-Channel, 3750V Isolation, SURFACE MOUNT PACKAGE-8
LAA110LS规格参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
厂商名称
IXYS
包装说明
SURFACE MOUNT PACKAGE-8
Reach Compliance Code
compliant
其他特性
UL RECOGNIZED, CMOS COMPATIBLE, HIGH RELIABILITY
配置
SEPARATE, 2 ELEMENTS
控制电流
0.005 A
控制电压
0.9 V
最大正向电流
0.05 A
输入类型
DC
最大绝缘电压
3750 V
JESD-609代码
e3
元件数量
2
最大通态电流
0.12 A
最大通态电阻
35 Ω
最高工作温度
85 °C
最低工作温度
-40 °C
光电设备类型
TRANSISTOR OUTPUT SSR
输出电路类型
MOSFET
总高度
3 mm
总长度
9 mm
端子面层
Matte Tin (Sn)
LAA110LS文档预览
LAA110L
I
NTEGRATED
C
IRCUITS
D
IVISION
Parameter
Blocking Voltage
Load Current
On-Resistance (max)
Ratings
350
120
35
Units
V
P
mA
rms
/ mA
DC
Dual Single-Pole, Current-Limited
OptoMOS
®
Relay
Description
LAA110L is a dual normally open (1-Form-A) Solid
State Relay that has two independently controlled,
optically coupled MOSFET switches with an additional
current limiting circuit. The MOSFET switches and
photovoltaic die use optically coupled MOSFET
technology to provide 3750V
rms
of input/output
isolation.
The optically coupled outputs, which use the patented
OptoMOS architecture, are controlled by a highly
efficient GaAIAs infrared LED.
This dual switch OptoMOS relay provides a more
compact design solution than discrete single-pole
relays in a variety of applications, and saves board
space by incorporating both switches in a single 8-Pin
package.
Features
•
3750V
rms
Input/Output Isolation
•
Current Limiting Device
•
Low Drive Power Requirements (TTL/CMOS
Compatible)
•
No Moving Parts
•
High Reliability
•
Arc-Free With No Snubbing Circuits
•
No EMI/RFI Generation
•
Machine Insertable, Wave Solderable
•
Surface Mount and Tape & Reel Versions Available
•
Small 8-Pin Package
Approvals
Applications
•
Telecom Switching
•
Tip/Ring Circuits
•
Modem Switching (Laptop, Notebook, Pocket Size)
•
Hook Switch
•
Dial Pulsing
•
Ground Start
•
Ringing Injection
•
Instrumentation
•
Multiplexers
•
Data Acquisition
•
Electronic Switching
•
I/O Subsystems
•
Meters (Watt-Hour, Water, Gas)
•
Medical Equipment-Patient/Equipment Isolation
•
Security
•
Aerospace
•
Industrial Controls
•
UL Recognized Component: File # E76270
•
CSA Certified Component: Certificate # 1175739
•
EN/IEC 60950-1 Certified Component:
TUV Certificate B 09 07 49410 004
Ordering Information
Part #
LAA110L
LAA110LS
LAA110LSTR
LAA110PL
LAA110PLTR
Description
8-Pin DIP (50/Tube)
8-Pin Surface Mount (50/Tube)
8-Pin Surface Mount (1,000/Reel)
8-Pin Flat Pack (50/Tube)
8-Pin Flat Pack (1,000/Reel)
Pin Configuration
+ Control - Switch #1
– Control - Switch #1
+ Control - Switch #2
– Control - Switch #2
1
2
3
4
8
7
6
5
Load - Switch #1
Load - Switch #1
Load - Switch #2
Load - Switch #2
Switching Characteristics of
Normally Open (Form A) Devices
Form-A
I
F
90%
I
LOAD
t
on
10%
t
off
Pb
DS-LAA110L-R09
e
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NTEGRATED
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D
IVISION
Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation
1
Total Power Dissipation
2
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
2
LAA110L
Ratings
350
5
50
1
150
800
3750
-40 to +85
-40 to +125
Units
V
P
V
mA
A
mW
mW
V
rms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Derate linearly 1.33 mW / ºC
Derate linearly 6.67 mW / ºC
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Load Current, Continuous
1
Load Current Limiting
On-Resistance
2
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Input to Output Capacitance
1
2
Conditions
-
V
L
=8V, I
F
=5mA
I
L
=120mA
V
L
=350V
P
Symbol
I
L
I
CL
R
ON
I
LEAK
t
on
t
off
C
OUT
I
F
-
V
F
I
R
C
I/O
Min
-
±130
-
-
-
-
-
-
0.4
0.9
-
-
Typ
-
±170
30
-
-
-
25
-
0.7
1.2
-
3
Max
120
±210
35
1
3
3
-
5
-
1.4
10
-
Units
mA
rms
/ mA
DC
mA
A
ms
ms
pF
mA
mA
V
A
pF
I
F
=5mA, V
L
=10V
V
L
=50V, f=1MHz
I
L
=120mA
-
I
F
=5mA
V
R
=5V
-
If both poles operate, then the load current must be derated so that it does not exceed the package power dissipation value.
Measurement taken within one second of on-time.
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R09
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PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
35
30
Device Count (N)
25
20
15
10
5
0
1.17
1.19
1.21
1.23
1.25
LED Forward Voltage Drop (V)
Device Count (N)
LAA110L
Typical LED Forward Voltage Drop
(N=50, I
F
=5mA)
25
20
15
10
5
0
0.15
Typical Turn-On Time
(N=50, I
F
=5mA, I
L
=120mA
DC
)
Typical Turn-Off Time
(N=50, I
F
=5mA, I
L
=120mA
DC
)
25
20
15
10
5
0
Device Count (N)
0.25
0.35 0.45 0.55 0.65
Turn-On Time (ms)
0.75
0.025
0.075
0.125
0.175
0.225
Turn-Off Time (ms)
Typical I
F
for Switch Operation
(N=50, I
L
=120mA
DC
)
25
20
15
10
5
0
0.45
0.75
1.05 1.35 1.65
LED Current (mA)
1.95
2.25
25
20
15
10
5
0
Typical I
F
for Switch Dropout
(N=50, I
L
=120mA
DC
)
35
30
Device Count (N)
25
20
15
10
5
0
Typical On-Resistance Distribution
(N=50, I
F
=5mA, I
L
=120mA
DC
)
Device Count (N)
Device Count (N)
0.45
0.75
1.05 1.35 1.65 1.95
LED Current (mA)
2.25
17.0
17.4
17.8 18.2 18.6 19.0
On-Resistance ( )
19.4
Typical Blocking Voltage Distribution
(N=50)
35
30
Device Count (N)
25
20
15
10
5
0
376.3 382.8 389.3 395.8 402.3 408.8 415.3
Blocking Voltage (V
P
)
Typical LED Forward Voltage Drop
vs. Temperature
LED Forward Voltage Drop (V)
1.8
Turn-On Time (ms)
1.6
1.4
1.2
1.0
0.8
-40
-20
0
20
40
60
80
Temperature (ºC)
100
120
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
5
Typical Turn-On Time
vs. LED Forward Current
(I
L
=120mA
DC
)
0.35
0.30
Turn-Off Time (ms)
0.25
0.20
0.15
0.10
0.05
0
10
15
20
25
30
35
40
45
50
0
5
LED Forward Current (mA)
Typical Turn-Off Time
vs. LED Forward Current
(I
L
=120mA
DC
)
I
F
=50mA
I
F
=30mA
I
F
=20mA
I
F
=10mA
I
F
=5mA
10 15 20 25 30 35 40
LED Forward Current (mA)
45
50
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
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I
NTEGRATED
C
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D
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PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
Typical Turn-On Time
vs. Temperature
(I
L
=120mA
DC
)
Turn-Off Time (ms)
LAA110L
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
-40
I
F
=5mA
I
F
=10mA
I
F
=20mA
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-40
-20
Typical Turn-Off Time
vs. Temperature
(I
F
=5mA, I
L
=120mA
DC
)
On-Resistance ( )
0
20
40
60
Temperature (ºC)
80
100
60
50
40
30
20
10
0
Typical On-Resistance vs. Temperature
(I
F
=5mA, I
L
=120mA
DC
)
Turn-On Time (ms)
-20
0
20
40
60
Temperature (ºC)
80
100
-40
-20
0
20
40
60
Temperature (ºC)
80
100
3.0
2.5
LED Current (mA)
2.0
1.5
1.0
0.5
0
-40
Typical I
F
for Switch Operation
vs. Temperature
(I
L
=120mA
DC
)
3.0
2.5
LED Current (mA)
2.0
1.5
1.0
0.5
0
-40
Typical I
F
for Switch Dropout
vs. Temperature
(I
L
=120mA
DC
)
Load Current (mA)
-20
0
20
40
60
Temperature (ºC)
80
100
Typical Load Current vs. Load Voltage
(I
F
=5mA)
150
100
50
0
-50
-100
-150
-3
-2
-1
0
1
Load Voltage (V)
2
3
-20
0
20
40
60
Temperature (ºC)
80
100
Maximum Load Current
vs. Temperature
180
160
Load Current (mA)
140
120
100
80
60
40
20
0
-40
-20
0
20
40
60
80
Temperature (ºC)
100
120
-40
I
F
=10mA
I
F
=5mA
Blocking Voltage (V
P
)
420
410
Typical Blocking Voltage
vs. Temperature
16
14
Leakage (nA)
12
10
8
6
4
2
-20
0
20
40
60
Temperature (ºC)
80
100
0
-40
Typical Leakage vs. Temperature
Measured across Pins 5&6, 7&8
400
390
380
370
360
-20
0
20
40
60
Temperature (ºC)
80
100
Typical Current Limiting
vs. Temperature
(I
F
=5mA)
350
300
Current (mA)
250
200
150
100
50
0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
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R09
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NTEGRATED
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Manufacturing Information
Moisture Sensitivity
LAA110L
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard,
IPC/JEDEC J-STD-020,
in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a
Moisture Sensitivity Level (MSL) rating
as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033.
Device
LAA110L / LAA110LS / LAA110PL
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is
ESD Sensitive,
and should be handled according to the industry standard
JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020
must be observed.
Device
LAA110L / LAA110LS
LAA110PL
Maximum Temperature x Time
250ºC for 30 seconds
260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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